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1.发明授权公开(公告)号：US10953757B2
公开(公告)日：2021-03-23
申请号：US15862551
申请日：2018-01-04
发明人： Jongwon Shin , Jae Seung Lee , Chung Chih Chou , George C. Bucsan
摘要： Methods, systems, and apparatus for wirelessly providing power to a vehicle. The system includes a plurality of ground-side wireless power transfer devices each configured to automatically provide power to a counterpart vehicle-side wireless power transfer device. The system includes a switch connecting a power source to the plurality of ground-side wireless power transfer devices and configured to be in an open position or a closed position. The system includes a vehicle position sensor configured to detect the vehicle being within a range of the plurality of ground-side wireless power transfer devices. The system includes a switch driver configured to move the switch from the open position to the closed position when the vehicle position sensor detects the vehicle being within the range, and move the switch from the closed position to the open position when the vehicle position sensor does not detect the vehicle being within the range.
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公开(公告)号：US10438739B2
公开(公告)日：2019-10-08
申请号：US15146524
申请日：2016-05-04
发明人： Masanori Ishigaki , Jongwon Shin
摘要： A transformer includes a magnetic core assembly including a cylindrical bobbin around which transformer windings are wrapped. Primary transformer windings are wrapped around the cylindrical bobbin of the magnetic core assembly with additional primary transformer windings that are extended to come in contact with one or more external surfaces of the magnetic core assembly. Secondary transformer windings are wrapped around the cylindrical bobbin of the magnetic core assembly with additional secondary transformer windings that are extended to come in contact with the one or more external surfaces of the magnetic core assembly.
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3.发明授权公开(公告)号：US10334756B1
公开(公告)日：2019-06-25
申请号：US15907926
申请日：2018-02-28
发明人： Ercan M. Dede , Jongwon Shin , Yanghe Liu , Jae Seung Lee
IPC分类号： H05K7/20 , H01L23/473 , H01L23/367
摘要： Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.
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公开(公告)号：US10141923B2
公开(公告)日：2018-11-27
申请号：US15247248
申请日：2016-08-25
发明人： Jongwon Shin
IPC分类号： H03K17/041 , H03K17/16 , H03K17/0814 , H03K17/90 , H03K17/082
摘要： Methods, systems, and apparatus for eliminating gate voltage oscillation without increasing switching power loss in paralleled power semiconductor switches at high current turn-off. The damping circuit includes a switch for driving voltage and multiple resistors and multiple inductors. The damping circuit includes multiple capacitors connected to the multiple inductors. The damping circuit includes multiple power semiconductor switches that are connected to the multiple inductors at gate terminals. The damping circuit includes multiple gate terminal resistors connected in parallel to the multiple power semiconductor switches at the gate terminals and multiple gate terminal switches connected to the multiple gate terminal resistors.
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公开(公告)号：US10481651B2
公开(公告)日：2019-11-19
申请号：US15834173
申请日：2017-12-07
发明人： Ercan M. Dede , Jongwon Shin
摘要： An electronics control system includes a power control unit disposed above a graphics processing unit and thermally connected to a cooling assembly inside. The system also includes a graphics processing unit disposed below the power control unit and thermally connected to the cooling assembly, an auxiliary DC-DC converter disposed below the power control unit and thermally connected to the cooling assembly, and a cooling assembly disposed at a predetermined location and configured to simultaneously transfer heat away from a power control unit, graphics processing unit, and auxiliary DC-DC converter via fluid circulation are presented.
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公开(公告)号：US10461566B2
公开(公告)日：2019-10-29
申请号：US15726706
申请日：2017-10-06
发明人： Jae Seung Lee , Jongwon Shin
摘要： A capacitive wireless charging system having a charging circuit and the operating characteristics of the charging circuit can be adjusted. The charging circuit includes two coupling capacitors formed by two electrode plates at least partially overlapping two other electrode plates, where the coupling characteristics of the coupling capacitors can be adjusted by moving at least one of the electrodes. When the coupling characteristics of the coupling capacitors reach a pre-determined threshold, the operating characteristics of the charging circuit can be adjusted to optimize the power transfer efficiency of the capacitive wireless charging system.
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7.发明申请公开(公告)号：US20190269033A1
公开(公告)日：2019-08-29
申请号：US16408767
申请日：2019-05-10
发明人： Ercan M. Dede , Jongwon Shin , Yanghe Liu , Jae Seung Lee
IPC分类号： H05K7/20 , H01L23/367 , H01L23/473
摘要： Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.
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公开(公告)号：US10149413B1
公开(公告)日：2018-12-04
申请号：US15665158
申请日：2017-07-31
发明人： Ercan M. Dede , Jongwon Shin , Jae Seung Lee
IPC分类号： H05K7/20 , H01L23/473 , H01L23/427
摘要： An integrated thermal management assembly, device or system for a power conversion device having a driver board and a power board. The integrated thermal management assembly includes a double-sided cooler. The double-sided cooler has a first layer that includes a first surface that is positioned below an inner surface of the power board. The double-sided cooler has a second surface positioned above an inner surface of the driver board. The double-sided cooler includes a first coolant channel in between the first surface and the second surface. The thermal integrated assembly includes a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler.
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公开(公告)号：US09531378B1
公开(公告)日：2016-12-27
申请号：US14845081
申请日：2015-09-03
申请人： TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. , VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.
发明人： Jongwon Shin , Chi-Ming Wang , Khai Ngo
IPC分类号： H03B1/00 , H03K3/00 , H03K17/687 , G05F3/24
CPC分类号： H03K17/687 , G05F3/24 , H03K17/163
摘要： Aspects of the disclosure provide a circuit for driving a power switch. The circuit includes a first circuit configured to provide a charging current to charge a control terminal of the power switch, a second circuit configured to provide a discharging current to discharge the control terminal of the power switch, and a control circuit configured to provide control signals to the first circuit and the second circuit to activate/deactivate the first circuit and the second circuit. At least one of the charging current and the discharging current ramps from a first level to a second level at a rate.
摘要翻译： 本公开的方面提供了用于驱动电力开关的电路。 电路包括：第一电路，被配置为提供充电电流以对功率开关的控制端进行充电;第二电路，被配置为提供放电电流以对电源开关的控制端进行放电;以及控制电路，被配置为提供控制信号 到第一电路和第二电路以激活/去激活第一电路和第二电路。 充电电流和放电电流中的至少一个以一个速率从第一电平斜坡到第二电平。
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10.发明授权公开(公告)号：US10791649B2
公开(公告)日：2020-09-29
申请号：US16408767
申请日：2019-05-10
发明人： Ercan M. Dede , Jongwon Shin , Yanghe Liu , Jae Seung Lee
IPC分类号： H05K7/20 , H01L23/473 , H01L23/367
摘要： Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.
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