-
公开(公告)号:US4697204A
公开(公告)日:1987-09-29
申请号:US516451
申请日:1983-07-22
IPC分类号: H01L23/12 , H01L23/13 , H01L23/498 , H05K3/34 , H01L23/02
CPC分类号: H01L23/13 , H01L23/498 , H05K3/3442 , H01L2924/0002 , H05K2201/09472 , H05K2201/10719 , H05K2201/10727 , Y02P70/613
摘要: A leadless chip carrier is constructed in such a manner that each of the electrode terminals is made to be recessed from the insulation layer of the bottom surface of the carrier so as to have a difference in level between the bottom surface and at least a part of the electrode terminal. Because of such construction, when the electrode terminals are bonded to the conductors of the printed circuit board in the reflowing method, molten solder is collected in the recessed portions of the electrode terminals besides each portion of the insulation layer positioned between the electrode terminals prevents flowing of the molten solder in the recessed portion, so that strength and reliability in the bonding are remarkably improved.
摘要翻译: 无引线芯片载体被构造成使得每个电极端子被制成从载体的底表面的绝缘层凹陷,以便在底表面和至少一部分 电极端子。 由于这样的结构,当电极端子以回流方式接合到印刷电路板的导体时,熔融焊料被收集在电极端子的凹陷部分中,除了位于电极端子之间的绝缘层的每个部分都防止流动 的凹陷部分中的熔融焊料,从而显着提高了接合中的强度和可靠性。