Abstract:
A method of fabricating a capacitor over bit line (COB) is provided. First, a substrate is provided and a plurality of word lines is formed on the substrate. Next, a plurality of landing plug contacts (LPCs) are formed between the word lines and a plurality of first contacts is then formed on the LPCs. Thereafter, a plurality of second contacts is formed on a first portions of the first contacts and a plurality of bit lines connecting a second portions of the first contacts is formed, simultaneously. An inter-layer dielectric (ILD) layer is formed on the substrate to cover the second contacts and the bit lines. Subsequently, a plurality of capacitors is formed in the ILD layer. Thus, the fabrication of the capacitor is simplified.
Abstract:
A method of manufacturing a DRAM includes firstly providing a substrate. Many transistors are then formed on the substrate. Next, a first and a second LPCs are formed between the transistors. A first dielectric layer is then formed on the substrate, and a first opening exposing the first LPC is formed in the first dielectric layer. Thereafter, a barrier layer is formed on the first dielectric layer. Afterwards, a BLC is formed in the first opening, and a BL is formed on the first dielectric layer. A liner layer is then formed on a sidewall of the BL. Next, a second dielectric layer having a dry etching rate substantially equal to that of the liner layer and having a wet etching rate larger than that of the liner layer is formed on the substrate. Finally, an SNC is formed in the first and the second dielectric layers.
Abstract:
A method of fabricating an electrode of a capacitor is provided. A substrate is provided and a dielectric layer is then formed thereon. After that, one multilayer mask is formed on the dielectric layer to expose a portion of the dielectric layer, wherein the multilayer mask consists of at least two layers of materials having different etching rates respectively. The exposed dielectric layer is removed to form a trench, and then the dielectric layer is over-etched, so as to widen the inside diameter of the trench. Thereafter, a conductive layer is formed on the substrate, and thus the multilayer mask and a surface of the trench are covered with the conductive layer. The conductive layer except that in the trench is then removed so as to form the electrode of the capacitor. Therefore, it can prevent the conductive layer from generating more loss.
Abstract:
A method of fabricating a capacitor over bit line (COB) is provided. First, a substrate is provided and a plurality of word lines is formed on the substrate. Next, a plurality of landing plug contacts (LPCs) are formed between the word lines and a plurality of first contacts is then formed on the LPCs. Thereafter, a plurality of second contacts is formed on a first portions of the first contacts and a plurality of bit lines connecting a second portions of the first contacts is formed, simultaneously. An inter-layer dielectric (ILD) layer is formed on the substrate to cover the second contacts and the bit lines. Subsequently, a plurality of capacitors is formed in the ILD layer. Thus, the fabrication of the capacitor is simplified.
Abstract:
A method of manufacturing a DRAM includes firstly providing a substrate. Many transistors are then formed on the substrate. Next, a first and a second LPCs are formed between the transistors. A first dielectric layer is then formed on the substrate, and a first opening exposing the first LPC is formed in the first dielectric layer. Thereafter, a barrier layer is formed on the first dielectric layer. Afterwards, a BLC is formed in the first opening, and a BL is formed on the first dielectric layer. A liner layer is then formed on a sidewall of the BL. Next, a second dielectric layer having a dry etching rate substantially equal to that of the liner layer and having a wet etching rate larger than that of the liner layer is formed on the substrate. Finally, an SNC is formed in the first and the second dielectric layers.
Abstract:
The present invention discloses a method for fabricating an optical filter based on polymer asymmetric bragg couplers using holographic interference techniques, soft lithography, and micro molding, which comprises following steps: prepare a UV polymer with gratings; coating photo-resister film on the UV polymer, and exposed by UV light to obtain a photo-resister mold with two grooves each having gratings; coating diluted PDMS film on the photo-resister mold, and baking the PDMS film to obtain a PDMS mold having two waveguides with gratings; placing glass substrate over the PDMS mold to form a first tunnel; injecting a precure UV polymer into the first tunnel to from a cladding layer with two grooves having gratings pattern at its bottom; placing glass slide over the cladding layer and injecting a mixed UV polymer into the grooves to form waveguide cores; placing a second glass substrate over the cladding layer, and injecting UV polymer to form an upper cladding layer laminated with the cladding layer to obtain the optical filter based on polymer asymmetric bragg couplers.
Abstract:
The present invention discloses a method for fabricating an optical filter based on polymer asymmetric bragg couplers using holographic interference techniques, soft lithography, and micro molding, which comprises following steps: prepare a UV polymer with gratings; coating photo-resister film on the UV polymer, and exposed by UV light to obtain a photo-resister mold with two grooves each having gratings; coating diluted PDMS film on the photo-resister mold, and baking the PDMS film to obtain a PDMS mold having two waveguides with gratings; placing glass substrate over the PDMS mold to form a first tunnel; injecting a precure UV polymer into the first tunnel to from a cladding layer with two grooves having gratings pattern at its bottom; placing glass slide over the cladding layer and injecting a mixed UV polymer into the grooves to form waveguide cores; placing a second glass substrate over the cladding layer, and injecting UV polymer to form an upper cladding layer laminated with the cladding layer to obtain the optical filter based on polymer asymmetric bragg couplers.
Abstract:
The present invention discloses a method for fabricating polymer wavelength filter with high-resolution periodical structure, which comprises: a positive photo-resister film is coated or a substrate, holographically exposed with grating pattern, and coated with a negative photo-resister film, then exposed by UV light and developed to obtain a waveguide mold having negative waveguide; a PDMS film coated on the waveguide mold, baked and peeled off to obtain a PDMS mold; a first tunnel formed over the PDMS mold, injected with a first UV polymer, then cured and separated the first UV polymer having groove to be the cladding layer of the polymer wavelength filter; a second UV polymer injected into the groove of the cladding layer, and cured to form the core of the waveguide in the groove of the cladding layer to finally be the polymer wavelength filter.
Abstract:
The present invention discloses a biological measuring device with auto coding capabilities. In accordance with one embodiment of the present invention, the biological measuring device with auto coding capabilities includes a test strip having a substrate and at least a first contact pad and a second contact pad provided on the substrate; and a code reader having at least a first metal pin and a second metal pin to couple to the first contact pad and the second contact pad to obtain coding information associated with the test strip, wherein the code reader is capable of reading the coding information based on a movement of the test strip before the test strip is placed still in relation to the code reader for a proper reading of a sample.
Abstract:
The present invention discloses a method for fabricating polymeric wavelength filter, which method for forming gratings patterns on the UV polymer involves three processing steps. First, a gratings pattern is holographically exposed using a two-beam interference pattern on a positive photo-resister film. A 20-nm-thick nickel thin film is then sputtered onto the positive photo-resister film to form a nickel mold. This nickel mold on the photo-resister film then can be subsequently used to transfer the final gratings pattern onto a UV cure epoxy polymer. Whereby, a polymer film can be spun coated on the cure epoxy substrate so as to simplify the fabrication process for obtaining a polymer wavelength filter with good aspect ratio of gratings pattern.