公开(公告)号：US07858145B2

公开(公告)日：2010-12-28

申请号：US11211550

申请日：2005-08-26

申请人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada ,  Taku Shimoda ,  Michiko Kato

发明人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada ,  Taku Shimoda ,  Michiko Kato

IPC分类号： B05D5/12

CPC分类号： C23C18/06 ,  C23C18/1216 ,  H01J9/027 ,  H01J31/127 ,  H01J2201/3165 ,  H05K3/105 ,  H05K2203/0522 ,  H05K2203/121

摘要： Provided is a method for producing a pattern of an electroconductive member, comprising: a step of forming a resin film on a substrate surface; a step of incorporating the first metal component into the resin by applying to the resin a liquid which contains a complex of a first metal component, which contains also a second metal component different from the first component, and to which a compound forming a complex with the second metal component is contacting or contacted preliminary; and a step of baking the resin film to form the electroconductive member from the first metal component incorporated into the resin film. Thus, the second metal component is prevented from adversely affecting the first metal component to be incorporated into the resin.

摘要翻译： 提供一种用于制造导电构件图案的方法，包括：在衬底表面上形成树脂膜的步骤; 将第一金属成分加入到树脂中的步骤是向树脂施加含有第一金属成分的复合物的液体，该第一金属成分也含有与第一成分不同的第二金属成分，并且与其形成复合物的化合物 第二金属组分接触或接触初步; 以及从结合到树脂膜中的第一金属成分烘烤树脂膜以形成导电构件的步骤。 因此，防止了第二金属成分对要结合到树脂中的第一金属成分的不良影响。

公开(公告)号：US07964336B2

公开(公告)日：2011-06-21

申请号：US12409569

申请日：2009-03-24

申请人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

发明人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

IPC分类号： G03F7/26

CPC分类号： H01J9/027 ,  G03F7/405 ,  H01J9/022 ,  H05K3/105 ,  Y10T428/12 ,  Y10T428/24802 ,  Y10T428/249953

摘要： The present invention is to provide a method for forming various patterns such as a metal or metal compound pattern, in which the amounts of the materials constituting the pattern which are removed during the formation step can be suppressed to the minimum. The method comprises a resin pattern forming step of forming on the surface of a substrate a resin pattern capable of absorbing a solution containing metal components, an absorbing step of dipping the resin pattern in the solution containing metal components to make the resin pattern absorb the solution containing metal components, a washing step of washing the substrate having formed thereon the resin pattern that has absorbed the solution containing metal components, and a burning step of burning the resin pattern after washing.

摘要翻译： 本发明提供一种用于形成诸如金属或金属化合物图案的各种图案的方法，其中可以将在形成步骤期间被去除的构成图案的材料的量抑制到最小。 该方法包括在基板的表面上形成能够吸收含有金属成分的溶液的树脂图案的树脂图案形成步骤，将树脂图案浸渍在含有金属成分的溶液中以使树脂图案吸收溶液的吸收步骤 洗涤步骤，洗涤其上形成有吸收了含有金属成分的溶液的树脂图案的基板，以及在洗涤后烧结树脂图案的燃烧工序。

公开(公告)号：US07556913B2

公开(公告)日：2009-07-07

申请号：US10910273

申请日：2004-08-04

申请人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

发明人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

IPC分类号： G03F7/00

CPC分类号： H01J9/027 ,  G03F7/405 ,  H01J9/022 ,  H05K3/105 ,  Y10T428/12 ,  Y10T428/24802 ,  Y10T428/249953

摘要： The present invention is to provide a method for forming various patterns such as a metal or metal compound pattern, in which the amounts of the materials constituting the pattern which are removed during the formation step can be suppressed to the minimum. The method comprises a resin pattern forming step of forming on the surface of a substrate a resin pattern capable of absorbing a solution containing metal components, an absorbing step of dipping the resin pattern in the solution containing metal components to make the resin pattern absorb the solution containing metal components, a washing step of washing the substrate having formed thereon the resin pattern that has absorbed the solution containing metal components, and a burning step of burning the resin pattern after washing.

摘要翻译： 本发明提供一种用于形成诸如金属或金属化合物图案的各种图案的方法，其中可以将在形成步骤期间被去除的构成图案的材料的量抑制到最小。 该方法包括在基板的表面上形成能够吸收含有金属成分的溶液的树脂图案的树脂图案形成步骤，将树脂图案浸渍在含有金属成分的溶液中以使树脂图案吸收溶液的吸收步骤 洗涤步骤，洗涤其上形成有吸收了含有金属成分的溶液的树脂图案的基板，以及在洗涤后烧结树脂图案的燃烧工序。

公开(公告)号：US07115432B2

公开(公告)日：2006-10-03

申请号：US10627645

申请日：2003-07-28

申请人： Kazuhiro Kagami ,  Masahiro Terada ,  Shosei Mori ,  Tsuyoshi Furuse

发明人： Kazuhiro Kagami ,  Masahiro Terada ,  Shosei Mori ,  Tsuyoshi Furuse

IPC分类号： H01L21/00

CPC分类号： H01J9/027 ,  G03F7/0047 ,  G03F7/405 ,  H05K3/02 ,  H05K3/105 ,  H05K2203/0514 ,  H05K2203/121

摘要： A fine electrode and wiring pattern with a good adhesive property is easily formed using a water-based solution easy to handle and small in environmental load, thereby improving a stability of a manufacturing process of an image-forming apparatus in the case where the water-based solution is used in the manufacturing process. A base pattern is formed using a base pattern forming material for electrode and wiring material absorption which is a water-based solution containing a water-soluble photosensitive resin component and a water-soluble metallic compound including rhodium, bismuth, ruthenium, vanadium, chromium, tin, lead, or silicon. An organic metallic compound is absorbed in the base pattern and then baking is conducted to form electrodes and wirings.

摘要翻译： 使用易于处理的水性溶液和环境负荷小的容易地形成具有良好粘附性的细电极和布线图案，从而提高了图像形成装置的制造过程的稳定性， 在制造过程中使用基于溶液的解决方案。 使用作为含有水溶性感光性树脂成分的水性溶液和包含铑，铋，钌，钒，铬等的水溶性金属化合物的电极用基材图案形成材料和布线材料吸收形成基体图案， 锡，铅或硅。 有机金属化合物被吸收到基底图案中，然后进行烘烤以形成电极和布线。

公开(公告)号：US20060045960A1

公开(公告)日：2006-03-02

申请号：US11214830

申请日：2005-08-31

申请人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada ,  Tsuyoshi Ibe ,  Makoto Kojima

发明人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada ,  Tsuyoshi Ibe ,  Makoto Kojima

IPC分类号： B05D5/06

CPC分类号： H01J9/027 ,  H01J31/127 ,  H01J2201/3165 ,  H05K3/105 ,  H05K3/386 ,  H05K2203/121

摘要： A method for producing a pattern of an electroconductive member, comprises: a step of forming on a substrate surface a resin film containing acid group; a step of incorporating into the resin film a liquid containing a metal complex salt and having a pH value of 5 to 7; and a step of baking the resin film to form the electroconductive member from a metal component incorporated into the resin film, thereby improving uniformity and speed of an adsorbing of the metal component into the resin, and providing uniform characteristics of the electroconductive pattern.

公开(公告)号：US20050266589A1

公开(公告)日：2005-12-01

申请号：US11138332

申请日：2005-05-27

申请人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada

发明人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada

IPC分类号： H01J9/02 ,  H01L21/00

CPC分类号： H01J1/316 ,  H01J9/027 ,  H01J31/127 ,  H01J2201/3165 ,  H01J2329/0489

摘要： In regard to an electroconductive pattern including a high resistivity region partially, by forming a pattern with a photosensitive resin, making the pattern absorb liquid containing a metal component, and baking this, an electroconductive film of metal oxide is formed, this electroconductive film is further covered by a gas shielding layer, and portions which are not shielded are reduced selectively to be made low resistance metal film regions. Since the material which constitutes the electroconductive pattern is hardly removed, a load concerning material reuse is mitigated and material cost is reduced.

摘要翻译： 关于包括高电阻率区域的导电图案，通过用感光树脂形成图案，使图案吸收含有金属成分的液体，并进行烘烤，形成金属氧化物的导电膜，该导电膜进一步 由气体屏蔽层覆盖，并且不被屏蔽的部分选择性地降低以制成低电阻金属膜区域。 由于构成导电图案的材料几乎不被去除，所以减轻了与材料再利用有关的负担，降低了材料成本。

公开(公告)号：US06833224B2

公开(公告)日：2004-12-21

申请号：US10122344

申请日：2002-04-16

申请人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

发明人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

IPC分类号： G03F700

CPC分类号： H01J9/027 ,  G03F7/405 ,  H01J9/022 ,  H05K3/105 ,  Y10T428/12 ,  Y10T428/24802 ,  Y10T428/249953

摘要： The present invention is to provide a method for forming various patterns such as a metal or metal compound pattern, in which the amounts of the materials constituting the pattern which are removed during the formation step can be suppressed to the minimum. The method comprises a resin pattern forming step of forming on the surface of a substrate a resin pattern capable of absorbing a solution containing metal components, an absorbing step of dipping the resin pattern in the solution containing metal components to make the resin pattern absorb the solution containing metal components, a washing step of washing the substrate having formed thereon the resin pattern that has absorbed the solution containing metal components, and a burning step of burning the resin pattern after washing.

摘要翻译： 本发明提供一种用于形成诸如金属或金属化合物图案的各种图案的方法，其中可以将在形成步骤期间被去除的构成图案的材料的量抑制到最小。 该方法包括在基板的表面上形成能够吸收含有金属成分的溶液的树脂图案的树脂图案形成步骤，将树脂图案浸渍在含有金属成分的溶液中以使树脂图案吸收溶液的吸收步骤 洗涤步骤，洗涤其上形成有吸收了含有金属成分的溶液的树脂图案的基板，以及在洗涤后烧结树脂图案的燃烧工序。

公开(公告)号：US07314768B2

公开(公告)日：2008-01-01

申请号：US11138332

申请日：2005-05-27

申请人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada

发明人： Tsuyoshi Furuse ,  Shosei Mori ,  Masahiro Terada

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01J1/316 ,  H01J9/027 ,  H01J31/127 ,  H01J2201/3165 ,  H01J2329/0489

摘要： In regard to an electroconductive pattern including a high resistivity region partially, by forming a pattern with a photosensitive resin, making the pattern absorb liquid containing a metal component, and baking this, an electroconductive film of metal oxide is formed, this electroconductive film is further covered by a gas shielding layer, and portions which are not shielded are reduced selectively to be made low resistance metal film regions. Since the material which constitutes the electroconductive pattern is hardly removed, a load concerning material reuse is mitigated and material cost is reduced.

摘要翻译： 关于包括高电阻率区域的导电图案，通过用感光树脂形成图案，使图案吸收含有金属成分的液体，并进行烘烤，形成金属氧化物的导电膜，该导电膜进一步 由气体屏蔽层覆盖，并且不被屏蔽的部分选择性地降低以制成低电阻金属膜区域。 由于构成导电图案的材料几乎不被去除，所以减轻了与材料再利用有关的负担，降低了材料成本。

公开(公告)号：US20050008955A1

公开(公告)日：2005-01-13

申请号：US10910273

申请日：2004-08-04

申请人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

发明人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

IPC分类号： G03F7/00 ,  G03F7/40 ,  H01J9/02 ,  H05K3/10

CPC分类号： H01J9/027 ,  G03F7/405 ,  H01J9/022 ,  H05K3/105 ,  Y10T428/12 ,  Y10T428/24802 ,  Y10T428/249953

摘要： The present invention is to provide a method for forming various patterns such as a metal or metal compound pattern, in which the amounts of the materials constituting the pattern which are removed during the formation step can be suppressed to the minimum. The method comprises a resin pattern forming step of forming on the surface of a substrate a resin pattern capable of absorbing a solution containing metal components, an absorbing step of dipping the resin pattern in the solution containing metal components to make the resin pattern absorb the solution containing metal components, a washing step of washing the substrate having formed thereon the resin pattern that has absorbed the solution containing metal components, and a burning step of burning the resin pattern after washing.

摘要翻译： 本发明提供一种用于形成诸如金属或金属化合物图案的各种图案的方法，其中可以将在形成步骤期间被去除的构成图案的材料的量抑制到最小。 该方法包括在基板的表面上形成能够吸收含有金属成分的溶液的树脂图案的树脂图案形成步骤，将树脂图案浸渍在含有金属成分的溶液中以使树脂图案吸收溶液的吸收步骤 洗涤步骤，洗涤其上形成有吸收了含有金属成分的溶液的树脂图案的基板，以及在洗涤后烧结树脂图案的燃烧工序。

公开(公告)号：US06586155B2

公开(公告)日：2003-07-01

申请号：US09777842

申请日：2001-02-07

申请人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

发明人： Tsuyoshi Furuse ,  Masahiro Terada ,  Shosei Mori

IPC分类号： G03F7038

CPC分类号： G03F7/0047 ,  C23C18/14 ,  H01L31/1804 ,  H05K3/02 ,  H05K3/105 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S430/106 ,  Y10S430/11

摘要： The invention is to enable easy formation of a fine electroconductive film pattern with a composition utilizing aqueous solvent of easy handling and little environmental burden. An electroconductive film forming composition composed of a water-soluble photosensitive resinous component, a water-soluble organometallic compound component capable of forming an electroconductive film by baking, and an aqueous solvent component is coated on a substrate and, after exposure based on the necessary pattern of the electroconductive film and development, is baked to form the required electroconductive film.

摘要翻译： 本发明能够容易地形成具有易于处理和小的环境负担的水性溶剂的组合物的细小导电膜图案。一种导电膜形成组合物，其由水溶性感光性树脂成分，能够溶解的水溶性有机金属化合物成分 通过烘烤形成导电膜，并且将水性溶剂组分涂覆在基材上，并且在基于导电膜的必要图案的曝光和显影之后，烘焙以形成所需的导电膜。