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公开(公告)号：US20100314149A1
公开(公告)日：2010-12-16
申请号：US12569431
申请日：2009-09-29
申请人： Paul F. Gerrish , Geoffrey Batchelder , Andreas Armin Fenner , Lary R. Larson , Anna J. Malin , Michael F. Mattes , Tyler Mueller , David A. Ruben , Larry E. Tyler
发明人： Paul F. Gerrish , Geoffrey Batchelder , Andreas Armin Fenner , Lary R. Larson , Anna J. Malin , Michael F. Mattes , Tyler Mueller , David A. Ruben , Larry E. Tyler
IPC分类号： H05K5/06
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/80895 , H01L2224/80896 , H01L2224/80986 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.
摘要翻译： 气密密封电路装置和使用一个或多个密封部分构造这种装置的方法。
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公开(公告)号：US08125058B2
公开(公告)日：2012-02-28
申请号：US12569525
申请日：2009-09-29
申请人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin
发明人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin
IPC分类号： H01L23/552
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device. For example, the first Faraday cage portion may include a first conductive portion of a Faraday cage enclosure surrounding the at least one circuit device, and a second Faraday cage portion may include a second conductive portion of the Faraday cage enclosure surrounding the at least one circuit device. Further, for example, the first Faraday cage portion may include a connection surface having one or more conductive contact portions terminating the first conductive portion of the Faraday cage enclosure the second Faraday cage portion may include a connection surface having one or more conductive contact portions terminating the second conductive portion of the Faraday cage enclosure. An electrical connection may be provided between the conductive contact portions of the first and second Faraday cage portions.
摘要翻译： 一种装置和方法使用第一法拉第笼部分和第二法拉第笼部分来提供围绕至少一个电路装置的法拉第笼壳。 例如，第一法拉第笼部分可以包括围绕至少一个电路装置的法拉第笼壳体的第一导电部分，并且第二法拉第笼部分可以包括围绕至少一个电路的法拉第笼壳体的第二导电部分 设备。 此外，例如，第一法拉第笼部分可以包括具有端接法拉第笼壳体的第一导电部分的一个或多个导电接触部分的连接表面，第二法拉第笼部分可以包括具有一个或多个导电接触部分终止的连接表面 法拉第笼壳的第二个导电部分。 可以在第一和第二法拉第笼部分的导电接触部分之间提供电连接。
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公开(公告)号：US20100314726A1
公开(公告)日：2010-12-16
申请号：US12569525
申请日：2009-09-29
申请人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin
发明人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin
IPC分类号： H01L23/552 , H01L21/00
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device.
摘要翻译： 一种装置和方法使用第一法拉第笼部分和第二法拉第笼部分来提供围绕至少一个电路装置的法拉第笼壳。
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公开(公告)号：US08389331B2
公开(公告)日：2013-03-05
申请号：US13593549
申请日：2012-08-24
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L21/00
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译： 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。
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公开(公告)号：US08072056B2
公开(公告)日：2011-12-06
申请号：US12569504
申请日：2009-09-29
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L23/02
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译： 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。
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公开(公告)号：US20100314733A1
公开(公告)日：2010-12-16
申请号：US12569504
申请日：2009-09-29
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译： 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。
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公开(公告)号：US08263436B2
公开(公告)日：2012-09-11
申请号：US13302725
申请日：2011-11-22
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L21/00
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译： 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。
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公开(公告)号：US20120311855A1
公开(公告)日：2012-12-13
申请号：US13593549
申请日：2012-08-24
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01R43/00
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
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公开(公告)号：US20120064670A1
公开(公告)日：2012-03-15
申请号：US13302725
申请日：2011-11-22
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L21/52
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译： 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。
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公开(公告)号：US20100315110A1
公开(公告)日：2010-12-16
申请号：US12569474
申请日：2009-09-29
申请人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
发明人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
摘要翻译： 包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。
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