公开(公告)号：US20100117530A1

公开(公告)日：2010-05-13

申请号：US12267872

申请日：2008-11-10

申请人： Tzu-Han LIN ,  Tzy-Ying LIN ,  Jui-Ping WENG ,  Wei-Hung Kang

发明人： Tzu-Han LIN ,  Tzy-Ying LIN ,  Jui-Ping WENG ,  Wei-Hung Kang

IPC分类号： H01J1/62 ,  H01L21/00

CPC分类号： H01L33/507 ,  H01L24/24 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.

摘要翻译： 公开了一种发光二极管（LED）装置。 LED装置包括：具有平面顶面的半导体基板，设置在半导体基板的上表面上的发光二极管（LED）芯片，至少两个隔离的外部布线层，形成在半导体基板上并电连接到该光 用作输入端子的透明封装层，形成在所述半导体衬底上方的基本上平坦的顶表面，对所述LED芯片和所述至少两个隔离的外部布线层进行封盖;以及透镜模块，其粘附到所述基本平坦的顶部 透明封装层的表面覆盖发光二极管芯片。 在一个实施例中，透镜模块包括荧光层和覆盖或被荧光层覆盖的透镜。

公开(公告)号：US20110018082A1

公开(公告)日：2011-01-27

申请号：US12897176

申请日：2010-10-04

申请人： Jui-Ping WENG ,  Tzu-Han Lin

发明人： Jui-Ping WENG ,  Tzu-Han Lin

IPC分类号： H01L31/0232

CPC分类号： H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

摘要翻译： 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。