摘要:
A 3D polysilicon ROM including an isolated SiO2 layer on a silicon substrate, and an N+ polysilicon layer on the isolated SiO2 layer. The N+ polysilicon layer is further defined by a plurality of parallel, separate word lines. A first oxide layer fills the space between the word lines. A dielectric layer is deposited on the word lines and the first oxide layer. A P− polysilicon layer is deposited on the dielectric layer and further defines a plurality of parallel, separate bit lines. The bit lines overlap the word lines, from a top view, to form an approximately cross shape. The neck structure may be individually formed between the P− and N+ polysilicon layers by wet etching the dielectric layer with dilute hydrofluoric acid. A second oxide layer fills the space between the bit lines and is on the word lines and the first oxide layer.
摘要:
A 3D polysilicon read only memory at least including: a silicon substrate, an isolated silicon dioxide (SiO2) layer, a N-Type heavily doped (N+) polysilicon layer, a first oxide layer, a dielectric layer, a P-Type lightly doped (P−) polysilicon layer, at least a neck structure, and a second oxide layer. The isolated SiO2 layer is deposited on the silicon substrate, and the N+ polysilicon layer is deposited on the isolated SiO2 layer. The N+ polysilicon layer is further defined a plurality of parallel, separate word lines (WL), and the first oxide layer is filled in the space between the word lines. The dielectric layer is deposited on the word lines and the first oxide layer. The P-Type lightly doped (P−) polysilicon layer is deposited on the dielectric layer and is further defined a plurality of parallel, separate bit lines (BL). The bit lines overlap the word lines, from a top view, to form a shape approximately as a cross. There are at least a neck structure individually formed between the first polysilicon layer and the second polysilicon layer by isotropy wet etching the dielectric layer, with using dilute hydrofluoric acid (HF) as the example. The second oxide layer is filled in the space between the bit lines and is on the word lines and the first oxide layer.
摘要:
A method of determining an optimal reading voltage for reading a two-side non-volatile memory programmed with a threshold voltage Vt is described. A first side of a memory cell is programmed to Vt, and then an I1-Vg curve of the first side and an I2-Vg curve of the second side are measured, wherein Vg is the gate voltage. A Gm1-Vg curve and a Gm2-Vg curve are plotted, wherein Gm1=dI1/dVg and Gm2=dI2/dVg. The optimal reading voltage VgO is determined as the gate voltage at the intersection of Gm1 and Gm2, corresponding to a maximal total current window Wm (=I2(VgO)−I1(VgO)).
摘要翻译:描述了一种确定用于读取用阈值电压Vt编程的双侧非易失性存储器的最佳读取电压的方法。 存储器单元的第一侧被编程为Vt,然后第二侧的I 1 -T 1 -V G曲线和第二侧的I 2 -V -V曲线是 测量,其中Vg是栅极电压。 绘制了一个Gm 1-ΔVg曲线和一个Gm 2 -V -G曲线,其中G m 1 = 1/1 / / dVg和Gm2 i> = dI2 / dVg。 确定最佳读取电压V g O O N作为在最大总电流窗口Gm1和Gm2的交点处的栅极电压 Wm(= I 2)(V g O O) - I 1(V g O O))。
摘要:
A method of determining an optimal reading voltage for reading a two-side non-volatile memory programmed with a threshold voltage Vt is described. A first side of a memory cell is programmed to Vt, and then an I1-Vg curve of the first side and an I2-Vg curve of the second side are measured, wherein Vg is the gate voltage. A Gm1-Vg curve and a Gm2-Vg curve are plotted, wherein Gm1=dI1/dVg and Gm2=dI2/dVg. The optimal reading voltage VgO is determined as the gate voltage at the intersection of Gm1 and Gm2, corresponding to a maximal total current window Wm(=I2(VgO)−I1(VgO)).
摘要翻译:描述了一种确定用于读取用阈值电压Vt编程的双侧非易失性存储器的最佳读取电压的方法。 存储器单元的第一侧被编程为Vt,然后第二侧的I 1 -T 1 -V G曲线和第二侧的I 2 -V -V曲线是 测量,其中Vg是栅极电压。 绘制了一个Gm 1-ΔVg曲线和一个Gm 2 -V -G曲线,其中G m 1 = 1/1 / / dVg和Gm2 i> = dI2 / dVg。 确定最佳读取电压V g O O N作为在最大总电流窗口Gm1和Gm2的交点处的栅极电压 Wm(= I 2)(V g O O) - I 1(V g O O))。
摘要:
A memory array comprising vertical memory cells does not require any isolation layers between cells. Thus, a very compact, high density memory array can be achieved. Each memory cell in the memory array is configured to store 4 bits of data per cell. Multi-level charge techniques can be used to increase the number of bit per cell and achieve further increased density for the memory array.
摘要:
A method for programming one or more memory cells is disclosed. The one or more memory cells need to be two sides operated. After verifying both sides of each memory cell to identify the sides of the memory cells to be programmed, a programming voltage pulse is given to the first sides of the memory cells identified to be programmed. Another verification process is performed for both sides of each memory cell to identify the sides of the memory cells to be programmed. Next, a programming voltage pulse is given to the second sides of the memory cells identified to be programmed. The verifying both sides, programming the first sides, verifying both sides, and programming the second sides will continue until the both sides of each memory cell are programmed to a target programming voltage. The target programming voltage might have multiple voltage levels.
摘要:
A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
摘要:
A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
摘要:
A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
摘要:
A memory array comprising vertical memory cells does not require any isolation layers between cells. Thus, a very compact, high density memory array can be achieved. Each memory cell in the memory array is configured to store 4 bits of data per cell. Multi-level charge techniques can be used to increase the number of bit per cell and achieve further increased density for the memory array.