公开(公告)号：US09420690B2

公开(公告)日：2016-08-16

申请号：US14720979

申请日：2015-05-26

申请人： Unimicron Technology Corp.

发明人： Chih-Peng Fan ,  Ching-Ho Hsieh ,  Chung-Chi Huang

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28 ,  H05K3/40

CPC分类号： H05K1/115 ,  H05K1/0298 ,  H05K1/113 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/09572 ,  H05K2203/041 ,  H05K2203/1536

摘要： The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure.

摘要翻译： 本公开涉及包括布线层，电介质层，导电结构，第一保护层和至少一个悬臂结构的连接器。 电介质层设置在布线层上，其中介电层具有至少一个通孔以部分地暴露布线层。 导电结构设置在电介质层的至少一个通孔的内壁上并电连接到布线层。 第一保护层设置在电介质层上。 所述悬臂结构设置在所述第一保护层和所述电介质层之间，其中所述至少一个悬臂结构经由所述导电结构电连接到所述布线层。

公开(公告)号：US20190296102A1

公开(公告)日：2019-09-26

申请号：US16145130

申请日：2018-09-27

申请人： Unimicron Technology Corp.

发明人： Ra-Min Tain ,  Chen-Hua Cheng ,  Chin-Sheng Wang ,  Chung-Chi Huang

IPC分类号： H01L49/02 ,  H01L23/522

摘要： An embedded component structure including a circuit board, an electronic component, a dielectric layer and a connection circuit layer and a manufacturing method thereof is provided. The circuit board has a through hole and includes a core layer, a first circuit layer, and a second circuit layer. The first circuit layer and the second circuit layer are disposed on the core layer. The through hole penetrates the first circuit layer and the core layer. The electronic component including a plurality of connection pads is disposed within the through hole where the dielectric layer is filled in. The connection circuit layer covers and contacts a first electrical connection surface of the first circuit layer and at least one of a second electrical connection surface of each of the connection pads.

公开(公告)号：US09370099B2

公开(公告)日：2016-06-14

申请号：US14681298

申请日：2015-04-08

申请人： UNIMICRON TECHNOLOGY CORP.

发明人： Chih-Peng Fan ,  Ching-Ho Hsieh ,  Chung-Chi Huang

IPC分类号： H01B13/00 ,  C23F1/00 ,  H05K3/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/06 ,  H05K3/28

CPC分类号： H05K1/115 ,  H05K1/0298 ,  H05K1/113 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/09572 ,  H05K2203/041 ,  H05K2203/1536

摘要： The instant disclosure relates to a manufacturing method of connector which comprises the following steps. The first step is to provide a substrate layer and forming a first metal layer on the substrate layer. The next step is to pattern the first metal layer to form a wiring layer. The next step is to form a dielectric layer on the wiring layer, wherein the dielectric layer is formed with at least one via hole to partially expose the wiring layer and a conductive structure arranged on the inner wall of the at least one via hole and electrically connected to the wiring layer. The next step is to form a first protective layer on the dielectric layer and at least one cantilever structure between the first protective layer and the dielectric layer. The last step is to remove the substrate layer.

摘要翻译： 本公开涉及一种连接器的制造方法，包括以下步骤。 第一步是提供衬底层并在衬底层上形成第一金属层。 下一步是图案化第一金属层以形成布线层。 下一步是在布线层上形成电介质层，其中介电层形成有至少一个通孔以部分地暴露布线层和布置在至少一个通孔的内壁上的导电结构， 连接到布线层。 下一步是在介电层上形成第一保护层，在第一保护层和电介质层之间形成至少一个悬臂结构。 最后一步是去除衬底层。

公开(公告)号：US20150289374A1

公开(公告)日：2015-10-08

申请号：US14720979

申请日：2015-05-26

申请人： Unimicron Technology Corp.

发明人： Chih-Peng Fan ,  Ching-Ho Hsieh ,  Chung-Chi Huang

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/115 ,  H05K1/0298 ,  H05K1/113 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/09572 ,  H05K2203/041 ,  H05K2203/1536

摘要： The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure.

摘要翻译： 本公开涉及包括布线层，电介质层，导电结构，第一保护层和至少一个悬臂结构的连接器。 电介质层设置在布线层上，其中介电层具有至少一个通孔以部分地暴露布线层。 导电结构设置在电介质层的至少一个通孔的内壁上并电连接到布线层。 第一保护层设置在电介质层上。 所述悬臂结构设置在所述第一保护层和所述电介质层之间，其中所述至少一个悬臂结构经由所述导电结构电连接到所述布线层。