公开(公告)号：US20140033526A1

公开(公告)日：2014-02-06

申请号：US14052443

申请日：2013-10-11

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Tsung-Yuan Chen ,  Ming-Huang Ting

IPC: H05K3/40

CPC classification number: H05K3/4007 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68304 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/2919 ,  H01L2224/321 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49128 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A fabricating method of an embedded package structure includes following steps. First and second boards are combined to form an integrated panel. First and second circuit structures are respectively formed on the first and second boards that are then separated. An embedded element is electrically disposed on the first circuit structure. First and second conductive bumps are respectively formed on a conductive circuit substrate and the second circuit structure. First and second semi-cured films are provided; a laminating process is performed to laminate the first circuit structure on the first board, the first and second semi-cured films, the conductive circuit substrate, and the second circuit structure on the second board. The first and second semi-cured films encapsulate the embedded element. The first and second conductive bumps respectively pierce through the first and second semi-cured films and are electrically connected to the first circuit structure and the conductive circuit substrate, respectively.

Abstract translation: 嵌入式封装结构的制造方法包括以下步骤。 第一和第二板组合形成集成面板。 第一和第二电路结构分别形成在第一和第二板上，然后分离。 嵌入式元件电气地布置在第一电路结构上。 第一和第二导电凸块分别形成在导电电路基板和第二电路结构上。 提供第一和第二半固化膜; 执行层压工艺以将第一板上的第一电路结构，第二和第二半固化膜，导电电路基板和第二电路结构层叠在第二板上。 第一和第二半固化膜封装了嵌入元件。 第一和第二导电凸块分别穿过第一和第二半固化膜，并分别电连接到第一电路结构和导电电路基板。

公开(公告)号：US08943683B2

公开(公告)日：2015-02-03

申请号：US14052443

申请日：2013-10-11

Applicant: Unimicron Technology Corp.

Inventor： Tsung-Yuan Chen ,  Ming-Huang Ting

IPC: H05K3/20 ,  H05K3/00 ,  H05K3/40 ,  H01L21/683 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K3/4007 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68304 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/2919 ,  H01L2224/321 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49128 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A fabricating method of an embedded package structure includes following steps. First and second boards are combined to form an integrated panel. First and second circuit structures are respectively formed on the first and second boards that are then separated. An embedded element is electrically disposed on the first circuit structure. First and second conductive bumps are respectively formed on a conductive circuit substrate and the second circuit structure. First and second semi-cured films are provided; a laminating process is performed to laminate the first circuit structure on the first board, the first and second semi-cured films, the conductive circuit substrate, and the second circuit structure on the second board. The first and second semi-cured films encapsulate the embedded element. The first and second conductive bumps respectively pierce through the first and second semi-cured films and are electrically connected to the first circuit structure and the conductive circuit substrate, respectively.

Abstract translation: 嵌入式封装结构的制造方法包括以下步骤。 第一和第二板组合形成集成面板。 第一和第二电路结构分别形成在第一和第二板上，然后分离。 嵌入式元件电气地布置在第一电路结构上。 第一和第二导电凸块分别形成在导电电路基板和第二电路结构上。 提供第一和第二半固化膜; 执行层压工艺以将第一板上的第一电路结构，第二和第二半固化膜，导电电路基板和第二电路结构层叠在第二板上。 第一和第二半固化膜封装了嵌入元件。 第一和第二导电凸块分别穿过第一和第二半固化膜，并分别电连接到第一电路结构和导电电路基板。