公开(公告)号：US20130335928A1

公开(公告)日：2013-12-19

申请号：US13780421

申请日：2013-02-28

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Tzyy-Jang Tseng ,  Chung W. Ho ,  Dyi-Chung Hu ,  Huan-Ling Lee ,  Sheng-Yuah He

IPC: H05K3/10 ,  H05K1/02

CPC classification number: H05K1/05 ,  H01L21/568 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0271 ,  H05K3/10 ,  H05K3/4644 ,  H05K3/4682 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A fabrication method of a coreless packaging substrate is provided, including the steps of: forming an inner built-up circuit board on a carrier; removing the carrier; and symmetrically forming a first outer built-up structure and a second outer built-up structure on top and bottom surfaces of the inner built-up circuit board, respectively. The present invention effectively increases the product yield, saves the fabrication cost, and reduces wastes.

Abstract translation: 提供一种无芯封装基板的制造方法，包括以下步骤：在载体上形成内层叠电路板; 移除载体; 并且分别在内部堆叠电路板的顶表面和底表面上对称地形成第一外部组合结构和第二外部组合结构。 本发明有效地提高了产品产量，节省了制造成本，并且减少了废物。

公开(公告)号：US09485863B2

公开(公告)日：2016-11-01

申请号：US13780421

申请日：2013-02-28

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Chung W. Ho ,  Dyi-Chung Hu ,  Huan-Ling Lee ,  Sheng-Yuah He

IPC: H05K1/05 ,  H05K3/46 ,  H05K3/10 ,  H05K1/02 ,  H01L21/56 ,  H01L23/14 ,  H01L23/498

CPC classification number: H05K1/05 ,  H01L21/568 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0271 ,  H05K3/10 ,  H05K3/4644 ,  H05K3/4682 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A fabrication method of a coreless packaging substrate is provided, including the steps of: forming an inner built-up circuit board on a carrier; removing the carrier; and symmetrically forming a first outer built-up structure and a second outer built-up structure on top and bottom surfaces of the inner built-up circuit board, respectively. The present invention effectively increases the product yield, saves the fabrication cost, and reduces wastes.

Abstract translation: 提供一种无芯封装基板的制造方法，包括以下步骤：在载体上形成内层叠电路板; 移除载体; 并且分别在内部堆叠电路板的顶表面和底表面上对称地形成第一外部组合结构和第二外部组合结构。 本发明有效地提高了产品产量，节省了制造成本，并且减少了废物。