Abstract:
A method for use in a physical vapor deposition coating process includes depositing a ceramic coating material from a plume onto at least one substrate to form a ceramic coating thereon, and during the deposition, rotating the at least one substrate at rotational speed selected with respect to deposition rate of the ceramic coating material onto the at least one substrate.
Abstract:
A method for use in a physical vapor deposition coating process includes depositing a ceramic coating material from a plume onto at least one substrate to form a ceramic coating thereon, and during the deposition, rotating the at least one substrate at rotational speed selected with respect to deposition rate of the ceramic coating material onto the at least one substrate.
Abstract:
An apparatus for use in a physical vapor deposition coating process includes a chamber, a crucible configured to hold a ceramic coating material in the chamber, an energy source operable to heat the interior of the chamber, a fixture for holding at least one substrate in the chamber, an actuator operable to rotate the fixture, and a controller configured to establish a plume of the ceramic coating material in the chamber to deposit the ceramic coating material from the plume onto the at least one substrate and form a ceramic coating thereon, and during the deposition, rotate the at least one substrate at a rotational speed selected with respect to deposition rate of the ceramic coating material onto the at least one substrate.