COPPER TERMINATION INKS CONTAINING LEAD FREE AND CADMIUM FREE GLASSES FOR CAPACITORS
    2.
    发明申请
    COPPER TERMINATION INKS CONTAINING LEAD FREE AND CADMIUM FREE GLASSES FOR CAPACITORS 有权
    铜箔终止墨水包含无铅和无镉免费玻璃电容器

    公开(公告)号:US20050276002A1

    公开(公告)日:2005-12-15

    申请号:US10864309

    申请日:2004-06-09

    IPC分类号: H01G4/06 H01G4/232

    摘要: Lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise up to about 65 mole % ZnO, up to about 51 mole % SrO, about 0.1 to about 61 mole % B2O3, up to about 17 mole % Al2O3, about 0.1 to about 63 mole % SiO2, up to about 40 mole % BaO+CaO, and up to about 20 mole % MgO.

    摘要翻译: 无铅和无镉玻璃组合物,特别适用于导电油墨应用。 本发明包括一个包含铜终端的电容器,铜端接件是通过烧制包括玻璃组分的油墨制成的,该玻璃组分可以包括高达约65%(摩尔)的ZnO,至多约51%的SrO,约0.1-约61 摩尔%B 2 O 3 3,至多约17摩尔%的Al 2 O 3 3,约0.1至约 63摩尔%SiO 2,至多约40摩尔%的BaO + CaO和至多约20摩尔%的MgO。

    Copper termination inks containing lead free and cadmium free glasses for capacitors
    3.
    发明授权
    Copper termination inks containing lead free and cadmium free glasses for capacitors 有权
    铜终端油墨含有无铅和无镉电容的玻璃

    公开(公告)号:US07339780B2

    公开(公告)日:2008-03-04

    申请号:US11201278

    申请日:2005-08-10

    IPC分类号: H01G4/228

    CPC分类号: H01G4/232 H01G4/2325 H01G4/30

    摘要: A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which includes a conductive copper termination. The copper termination is made by firing an ink including a glass component, which may include ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.

    摘要翻译: 公开了一种特别适用于导电油墨应用的耐还原性无铅和无镉玻璃组合物。 本发明包括电容器,其包括导电铜端接件。 铜终端是通过焙烧包括玻璃组分的油墨制成的,该玻璃组分可以包括ZnO,只要该量不超过约65摩尔%; B 2 O 3 3,条件是该量不超过约61摩尔%; 和SiO 2,条件是该量不超过约63摩尔%。 B 2 O 3 O 3与SiO 2的摩尔比为约0.05至约3。

    Copper termination inks containing lead free and cadmium free glasses for capacitors
    4.
    发明申请
    Copper termination inks containing lead free and cadmium free glasses for capacitors 有权
    铜终端油墨含有无铅和无镉电容的玻璃

    公开(公告)号:US20060028788A1

    公开(公告)日:2006-02-09

    申请号:US11201278

    申请日:2005-08-10

    IPC分类号: H01G9/00

    CPC分类号: H01G4/232 H01G4/2325 H01G4/30

    摘要: A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a conductive copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.

    摘要翻译: 特别适用于导电油墨应用的抗还原性无铅和无镉玻璃组合物。 本发明包括一种包括导电铜端接件的电容器,铜端接件是通过烧制包括玻璃组分的油墨制成的,该玻璃组分可以包含ZnO,只要该量不超过约65摩尔%; B 2 O 3 3,条件是该量不超过约61摩尔%; 和SiO 2,条件是该量不超过约63摩尔%。 B 2 O 3 O 3与SiO 2的摩尔比为约0.05至约3。

    Copper termination inks containing lead free and cadmium free glasses for capacitors
    5.
    发明授权
    Copper termination inks containing lead free and cadmium free glasses for capacitors 有权
    铜终端油墨含有无铅和无镉电容的玻璃

    公开(公告)号:US06982864B1

    公开(公告)日:2006-01-03

    申请号:US10864309

    申请日:2004-06-09

    IPC分类号: H01G4/06

    摘要: Lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise up to about 65 mole % ZnO, up to about 51 mole % SrO, about 0.1 to about 61 mole % B2O3, up to about 17 mole % Al2O3, about 0.1 to about 63 mole % Sio2, up to about 40 mole % BaO+CaO, and up to about 20 mole % MgO.

    摘要翻译: 无铅和无镉玻璃组合物,特别适用于导电油墨应用。 本发明包括一个包含铜终端的电容器,铜端接件是通过烧制包括玻璃组分的油墨制成的,该玻璃组分可以包括高达约65%(摩尔)的ZnO,至多约51%的SrO,约0.1-约61 摩尔%B 2 O 3 3,至多约17摩尔%的Al 2 O 3 3,约0.1至约 63摩尔%的SiO 2,至多约40摩尔%的BaO + CaO和至多约20摩尔%的MgO。

    Solution coated hydrothermal BaTiO3 for low-temperature firing
    8.
    发明授权
    Solution coated hydrothermal BaTiO3 for low-temperature firing 失效
    溶液涂层水热BaTiO3用于低温烧制

    公开(公告)号:US06169049A

    公开(公告)日:2001-01-02

    申请号:US08847613

    申请日:1997-04-28

    IPC分类号: C04B35468

    CPC分类号: C04B35/62222 C04B35/468

    摘要: Hydrothermal BaTiO3 crystallites were coated with Bismuth solutions prepared from Bismuth metal-organics and anhydrous solvents. The Bismuth metal-organics were Bi 2-ethylhexanoate and Bi-neodecanoate. Bismuth oxide was also used as a comparison to the Bismuth solutions. BaTiO3 ceramics with either 3.0 wt % equivalent Bismuth oxide or 5.0 wt % equivalent Bismuth oxide were made by sintering the compacts between 700° C. and 1000° C. BaTiO3 ceramics that were coated by Bi-neodecanoate densified >90% theoretical as low as 800° C. for 3.0 wt % equivalent Bi2O3. Average grain sizes of 0.2-0.4 &mgr;m were observed for Bi-coated BaTiO3 ceramics, for sintering temperatures below 950° C. Dielectric K versus temperature measurements of Bismuth-coated BaTiO3 ceramics, sintered in the lower temperature ranges, showed consistently superior dielectric characteristics.

    摘要翻译: 用由铋金属有机物和无水溶剂制备的铋溶液涂覆水热BaTiO 3微晶。 铋金属有机物为Bi 2-乙基己酸酯和双 - 新癸酸酯。 氧化铋也用作与铋溶液的比较。 通过烧结700℃和1000℃之间的压块来制备具有3.0重量%当量氧化铋或5.0重量%当量氧化铋的BaTiO 3陶瓷。由新癸酸酯涂覆的BaTiO 3陶瓷致密化> 90%理论值低至 800℃,3.0重量%当量Bi 2 O 3。 对于Bi包覆的BaTiO 3陶瓷,烧结温度低于950℃,观察到平均晶粒尺寸为0.2-0.4μm。在较低温度范围内烧结的铋包覆的BaTiO 3陶瓷的介电K与温度测量显示出一贯优异的介电特性。