公开(公告)号：US11924961B2

公开(公告)日：2024-03-05

申请号：US17661284

申请日：2022-04-28

Applicant: Unimicron Technology Corp.

Inventor： Ai Jing Lin ,  Chung-Yu Lan ,  Jia Hao Liang

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0204 ,  H05K1/115 ,  H05K3/0061 ,  H05K2201/09509 ,  H05K2201/10416

Abstract: A circuit board includes a conductive metal layer, at least one insulating layer, at least one thermally conductive insulating layer and a heat dissipation element. The conductive metal layer is mainly used to transmit electronic signals. The insulating layer is connected to the conductive metal layer. The thermally conductive insulating layer is sandwiched between the conductive metal layer and the insulating layer, and thermally contacts the conductive metal layer, and is used for thermally conducting the heat of the conductive metal layer. The heat dissipation element is in thermal contact with the thermally conductive insulating layer, and is used to conduct the heat of the thermally conductive insulating layer to the outside through a heat dissipation channel.