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公开(公告)号：US20230117007A1
公开(公告)日：2023-04-20
申请号：US17851800
申请日：2022-06-28
发明人： Karthick Vilapakkam Gourishankar , Mohandas Nayak , Dattu Guru Venkata Jonnalagadda , Emily Marie Phelps , Navish Garg , Soumya Chakraborty , Gordon C. Tajiri
IPC分类号： B32B15/08 , B32B15/04 , B32B15/20 , B32B15/18 , B32B18/00 , B32B5/02 , B32B15/14 , B32B27/12 , B32B27/28
摘要： A thermal insulation system for an aerospace duct through which high temperature fluid, greater than 500 F, passes. The thermal insulation system can experience pressures less than 80 kilopascals and can be included in a turbine engine. The thermal insulation system includes at least a first foil layer confronting the duct, an insulation layer confronting the first foil layer, a second foil layer confronting the insulation layer, and at least one coating applied to any one of the layers.
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公开(公告)号：US11898260B2
公开(公告)日：2024-02-13
申请号：US17558160
申请日：2021-12-21
发明人： Ashwini Sameer Wadhavkar , Dattu Guru Venkata Jonnalagadda , Rajapriyan Rajendran , Gordon C. Tajiri , Udaya Bhaskar Pamidimarri
摘要： An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure that defines a fluid passage. The first housing can include a dissolution reservoir containing an electrolytic fluid that is fluidly coupled to the fluid passage of the second housing.
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公开(公告)号：US20240060200A1
公开(公告)日：2024-02-22
申请号：US18498245
申请日：2023-10-31
发明人： Ashwini Sameer Wadhavkar , Dattu Guru Venkata Jonnalagadda , Rajapriyan Rajendran , Gordon C. Tajiri , Udaya Bhaskar Pamidimarri
摘要： An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure. An electrically insulating sheet covers at least a portion of the base structure and defines a fluid passage where the component is to be located.
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公开(公告)号：US20230060084A1
公开(公告)日：2023-02-23
申请号：US17558160
申请日：2021-12-21
发明人： Ashwini Sameer Wadhavkar , Dattu Guru Venkata Jonnalagadda , Rajapriyan Rajendran , Gordon C. Tajiri , Udaya Bhaskar Pamidimarri
摘要： An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure that defines a fluid passage. The first housing can include a dissolution reservoir containing an electrolytic fluid that is fluidly coupled to the fluid passage of the second housing.
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