公开(公告)号：US11683973B2

公开(公告)日：2023-06-20

申请号：US16778200

申请日：2020-01-31

Applicant: Universal Display Corporation

Inventor： Gregory McGraw ,  William E. Quinn ,  Steven Buswell

IPC: H10K71/13 ,  B05B1/02 ,  C23C16/455 ,  C23C14/22 ,  C23C14/04 ,  C23C16/44 ,  C23C14/12 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L33/62 ,  H10K71/00 ,  H10K71/16

CPC classification number: H10K71/135 ,  B05B1/02 ,  C23C14/04 ,  C23C14/12 ,  C23C14/228 ,  C23C16/4412 ,  C23C16/45563 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49513 ,  H01L24/14 ,  H01L24/89 ,  H01L33/62 ,  H10K71/00 ,  H10K71/16

Abstract: Embodiments of the disclosed subject matter provide a device including a carrier plate, and a die including a mating surface with a patterned thin film of metal or metal oxide surface bonded to the carrier plate using a solder preform with voids that overlay the patterned thin film on the die, where the oxide surface is disposed opposite a moat in a mating surface of the carrier plate, and where the voided regions remain free of solder when the solder is reflowed.