公开(公告)号：US11823808B2

公开(公告)日：2023-11-21

申请号：US16575861

申请日：2019-09-19

Applicant: University of Massachusetts

Inventor： Derek R. Lovley ,  Todd Emrick ,  Yun-Lu Sun ,  Brian Montz

IPC: H01B1/12 ,  H01B3/44 ,  H01B5/14 ,  C12P21/00 ,  C08L83/04 ,  C08L89/00 ,  A61B5/145 ,  A61B5/00 ,  C08L29/04 ,  C07K14/195 ,  C09D129/04 ,  C09D183/04 ,  B82Y30/00 ,  B82Y5/00

CPC classification number: H01B1/12 ,  A61B5/14539 ,  A61B5/6801 ,  B82Y5/00 ,  B82Y30/00 ,  C07K14/195 ,  C08L29/04 ,  C08L83/04 ,  C08L89/00 ,  C09D129/04 ,  C09D183/04 ,  C12P21/00 ,  H01B3/44 ,  H01B5/14 ,  A61B2562/0285 ,  C08L29/04 ,  C08L89/00 ,  C09D129/04 ,  C08L89/00 ,  C08L83/04 ,  C08L89/00

Abstract: Electrically conductive polymeric composite materials include microbially produced protein nanowires. The conductive composites are useful in diverse electronic materials applications, particularly in applications requiring biocompatibility, such as sensors and wearable electronics.