Dispensed electrical interconnections
    9.
    发明授权
    Dispensed electrical interconnections 有权
    分配电气互连

    公开(公告)号:US07442564B2

    公开(公告)日:2008-10-28

    申请号:US11334922

    申请日:2006-01-19

    申请人: Peter Andrews

    发明人: Peter Andrews

    IPC分类号: H01L21/00

    摘要: An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

    摘要翻译: 电子设备包括基板,基板上的电气元件,基板上的非导电粘合剂材料,以及电气元件上的导电粘合剂材料并延伸到非导电粘合剂材料上。 形成封装的LED的方法包括提供其上具有电元件的基板,以及在基板上分配非导电粘合剂材料。 非导电粘合剂材料至少部分固化,并且导电粘合剂材料分配在电气元件上以及至少部分固化的非导电材料上。 导电粘合剂材料至少部分固化。 导电粘合剂材料可以在电气元件和衬底上或另一衬底上的第二电气元件之间提供电连接。

    Chuck with integrated wafer support
    10.
    发明授权
    Chuck with integrated wafer support 失效
    带集成晶圆支架的卡盘

    公开(公告)号:US07362115B2

    公开(公告)日:2008-04-22

    申请号:US11655605

    申请日:2007-01-19

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2887

    摘要: An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

    摘要翻译: 具有提升销的改进的卡盘组件。 卡盘组件可以具有外周边和上表面。 提升销可以定位在卡盘组件的周边内,并且可以相对于卡盘组件的上表面相对垂直运动。