公开(公告)号：US6411194B2

公开(公告)日：2002-06-25

申请号：US79459601

申请日：2001-02-27

Applicant: VICTOR COMPANY OF JAPAN

Inventor： SHINDOH MOTOSHI ,  SEGAWA KEIJI ,  OTSUKI MITSURU

IPC: H01C17/12 ,  H05K1/02 ,  H05K1/16 ,  H05K3/38 ,  H05K3/46 ,  H01C1/012

CPC classification number: H05K1/167 ,  H01C17/12 ,  H05K1/0206 ,  H05K1/165 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0317 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/0361 ,  Y10T29/49082

Abstract: The invention provides a production method capable of forming a thin film resistance element having a thickness and a shape controlled in a high accuracy in a printed circuit board. The production method of a thin film resistance element formed on a printed circuit board, has the steps of forming a thin film resistance layer having a predetermined thickness on the printed circuit board through an insulation layer by a dry process used in producing a semiconductor, forming an electrically conductive layer on the thin resistance layer, and etching the electrically conductive layer selectively so as to make, at least, a pair of electrically conductive pads, resulting in the thin film resistance element having a predetermined value of resistivity between the pair of electrically conductive pads. Thereby, it is possible to form the thin film resistance element having a thickness and a shape controlled in a high accuracy on the printed circuit board.

Abstract translation: 本发明提供一种能够形成在印刷电路板中具有高精度的厚度和形状的薄膜电阻元件的制造方法。 形成在印刷电路板上的薄膜电阻元件的制造方法具有以下步骤：通过用于制造半导体的干法在印刷电路板上形成具有预定厚度的薄膜电阻层，形成 在所述薄电阻层上的导电层，并且选择性地蚀刻所述导电层，以便至少形成一对导电焊盘，导致所述薄膜电阻元件在所述一对电学上具有预定的电阻率值 导电垫。 因此，可以在印刷电路板上形成具有高精度的厚度和形状的薄膜电阻元件。