公开(公告)号：US20170213754A1

公开(公告)日：2017-07-27

申请号：US15481183

申请日：2017-04-06

申请人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H05K7/20218

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.

公开(公告)号：US09520315B2

公开(公告)日：2016-12-13

申请号：US14145702

申请日：2013-12-31

申请人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6831 ,  H01L21/67109 ,  Y10T137/0318

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

摘要翻译： 使用外部流量调节来描述静电卡盘，以改善温度分布。 在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。 冷却板被固定并且热耦合到陶瓷盘。 供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。 回流室连接到冷却区以从冷却区排出冷却剂。 多个可调节的孔口位于供气室和相应的一个冷却区之间，以控制从供气室到冷却区域的冷却剂流量。

公开(公告)号：US09622375B2

公开(公告)日：2017-04-11

申请号：US14145680

申请日：2013-12-31

申请人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H05K7/20 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H05K7/20218

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

公开(公告)号：US20150187626A1

公开(公告)日：2015-07-02

申请号：US14145702

申请日：2013-12-31

申请人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683

CPC分类号： H01L21/6831 ,  H01L21/67109 ,  Y10T137/0318

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

摘要翻译： 使用外部流量调节描述静电卡盘，以改善温度分布。 在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。 冷却板被固定并且热耦合到陶瓷盘。 供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。 回流室连接到冷却区以从冷却区排出冷却剂。 多个可调节的孔口位于供气室和相应的一个冷却区之间，以控制从供气室到冷却区的冷却剂的流量。

公开(公告)号：US20150187625A1

公开(公告)日：2015-07-02

申请号：US14145680

申请日：2013-12-31

申请人： Matthew J. Busche ,  Vijay De. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Matthew J. Busche ,  Vijay De. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H05K7/20

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H05K7/20218

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

摘要翻译： 使用外部流量调节来描述静电卡盘，以改善温度分布。 在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。 冷却板被固定并且热耦合到陶瓷盘。 供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。 回流通风室联接到冷却区域以从冷却区域排出冷却剂，并且多个流量控制阀定位在供应压力室和相应的一个冷却区域之间，以控制从供气室到冷却区的冷却剂的流量 冷却区。

公开(公告)号：US20150226611A1

公开(公告)日：2015-08-13

申请号：US14179339

申请日：2014-02-12

申请人： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

发明人： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

IPC分类号： G01J5/10 ,  G01J5/02 ,  H01L21/683

CPC分类号： H01L21/6833 ,  G01N21/9501 ,  H01L21/67103 ,  H01L21/67248

摘要： An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus has a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.

摘要翻译： 描述了用于测量诸如静电卡盘的晶片卡盘的热性能的装置和方法。 在一个示例中，该装置具有腔室，用于支撑腔室中的晶片卡盘的基座，用于加热卡盘的加热器，通过腔室外部的窗口以及用于测量卡盘温度的红外成像系统， 卡盘被加热。