公开(公告)号：US20170213754A1

公开(公告)日：2017-07-27

申请号：US15481183

申请日：2017-04-06

申请人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H05K7/20218

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.

公开(公告)号：US09622375B2

公开(公告)日：2017-04-11

申请号：US14145680

申请日：2013-12-31

申请人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H05K7/20 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H05K7/20218

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

公开(公告)号：US20150187626A1

公开(公告)日：2015-07-02

申请号：US14145702

申请日：2013-12-31

申请人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683

CPC分类号： H01L21/6831 ,  H01L21/67109 ,  Y10T137/0318

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

摘要翻译： 使用外部流量调节描述静电卡盘，以改善温度分布。 在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。 冷却板被固定并且热耦合到陶瓷盘。 供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。 回流室连接到冷却区以从冷却区排出冷却剂。 多个可调节的孔口位于供气室和相应的一个冷却区之间，以控制从供气室到冷却区的冷却剂的流量。

公开(公告)号：US09520315B2

公开(公告)日：2016-12-13

申请号：US14145702

申请日：2013-12-31

申请人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Vijay D. Parkhe ,  Matthew J. Busche ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6831 ,  H01L21/67109 ,  Y10T137/0318

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

摘要翻译： 使用外部流量调节来描述静电卡盘，以改善温度分布。 在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。 冷却板被固定并且热耦合到陶瓷盘。 供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。 回流室连接到冷却区以从冷却区排出冷却剂。 多个可调节的孔口位于供气室和相应的一个冷却区之间，以控制从供气室到冷却区域的冷却剂流量。

公开(公告)号：US20150226611A1

公开(公告)日：2015-08-13

申请号：US14179339

申请日：2014-02-12

申请人： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

发明人： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

IPC分类号： G01J5/10 ,  G01J5/02 ,  H01L21/683

CPC分类号： H01L21/6833 ,  G01N21/9501 ,  H01L21/67103 ,  H01L21/67248

摘要： An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus has a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.

摘要翻译： 描述了用于测量诸如静电卡盘的晶片卡盘的热性能的装置和方法。 在一个示例中，该装置具有腔室，用于支撑腔室中的晶片卡盘的基座，用于加热卡盘的加热器，通过腔室外部的窗口以及用于测量卡盘温度的红外成像系统， 卡盘被加热。

公开(公告)号：US20150070814A1

公开(公告)日：2015-03-12

申请号：US14085026

申请日：2013-11-20

申请人： Vijay D. Parkhe ,  Wendell Boyd, JR.

发明人： Vijay D. Parkhe ,  Wendell Boyd, JR.

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/67109 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/6831

摘要： Electrostatic chucks with variable pixelated heating are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A light carrying medium is disposed in the base, the light carrying medium configured to provide pixelated light-based heating capability for the ESC.

摘要翻译： 描述了具有可变像素化加热的静电卡盘。 例如，静电卡盘（ESC）包括具有前表面和后表面的陶瓷板，前表面用于支撑晶片或基板。 基座耦合到陶瓷板的背面。 光传送介质设置在基座中，轻载运介质构造成为ESC提供像素化的基于光的加热能力。

公开(公告)号：US09196514B2

公开(公告)日：2015-11-24

申请号：US14085026

申请日：2013-11-20

申请人： Vijay D. Parkhe ,  Wendell Boyd, Jr.

发明人： Vijay D. Parkhe ,  Wendell Boyd, Jr.

IPC分类号： H01L21/683 ,  H01L23/00 ,  H01L21/67

CPC分类号： H01L21/67109 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/6831

摘要： Electrostatic chucks with variable pixelated heating are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A light carrying medium is disposed in the base, the light carrying medium configured to provide pixelated light-based heating capability for the ESC.

摘要翻译： 描述了具有可变像素化加热的静电卡盘。 例如，静电卡盘（ESC）包括具有前表面和后表面的陶瓷板，前表面用于支撑晶片或基板。 基座耦合到陶瓷板的背面。 光传送介质设置在基座中，轻载运介质构造成为ESC提供像素化的基于光的加热能力。

公开(公告)号：US09969022B2

公开(公告)日：2018-05-15

申请号：US12892219

申请日：2010-09-28

申请人： Vijay D. Parkhe

发明人： Vijay D. Parkhe

IPC分类号： B23K1/00 ,  B23K1/19 ,  B23K101/20 ,  B23K103/18 ,  F16B5/08 ,  B23K103/10 ,  B23K103/12 ,  B23K103/00 ,  B23K103/04

CPC分类号： B23K1/0008 ,  B23K1/19 ,  B23K2101/20 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/52 ,  F16B5/08 ,  Y10T403/479

摘要： A vacuum process chamber component comprising two separate pieces with an o-ring between the pieces and solder bonded together is described. The component may be an electrostatic chuck comprising a ceramic electrostatic puck and a metal baseplate with at least one o-ring therebetween and joined by a solder bond is described. Methods of making and using vacuum process chamber component are also described.

公开(公告)号：US20150155193A1

公开(公告)日：2015-06-04

申请号：US14094601

申请日：2013-12-02

申请人： Chih-Hsun Hsu ,  Tza-Jing Gung ,  Benjamin Schwarz ,  Shahid Rauf ,  Ankur Agarwal ,  Vijay D. Parkhe ,  Michael D. Willwerth ,  Zhiqiang Guo

发明人： Chih-Hsun Hsu ,  Tza-Jing Gung ,  Benjamin Schwarz ,  Shahid Rauf ,  Ankur Agarwal ,  Vijay D. Parkhe ,  Michael D. Willwerth ,  Zhiqiang Guo

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01J37/3266 ,  H01J37/32715

摘要： Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.

摘要翻译： 描述了具有可变像素化磁场的静电卡盘。 例如，静电卡盘（ESC）包括具有前表面和后表面的陶瓷板，前表面用于支撑晶片或基板。 基座耦合到陶瓷板的背面。 多个电磁铁设置在基座中，多个电磁铁构造成为ESC提供像素化的磁场调谐能力。

公开(公告)号：US08320099B2

公开(公告)日：2012-11-27

申请号：US13297203

申请日：2011-11-15

申请人： Robert T. Hirahara ,  Vijay D. Parkhe

发明人： Robert T. Hirahara ,  Vijay D. Parkhe

IPC分类号： H01L21/683 ,  H01T23/00

CPC分类号： H01L21/6875 ,  H01L21/6831 ,  Y10T29/49002 ,  Y10T279/23

摘要： The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.

摘要翻译： 本发明包括用于修复包含在静电卡盘内的双极电极之间的电连接的方法和装置以及设置在静电卡盘上方的导电掩模，称为平衡电路。 在移除用于翻新的静电卡盘之后，本发明的实施例是特别有用的。