Abstract:
A self-aligned gate contact of a semiconductor device is made without etching the semiconductor member during the gate contact forming step. A metal layer for forming contacts of the semiconductor device is deposited on a major surface of the semiconductor member and thereafter overlaid with a resist layer. A window pattern corresponding to the desired gate contact is formed in the resist layer, and the metal layer is undercut and removed adjacent the window pattern to expose portions of the major surface of the semiconductor member and to form overhanging portions of the resist layer adjacent the window pattern. Simultaneously with the undercutting, at least portions of contacts of the semiconductor device are formed in the metal layer. The desired gate contact is then self-aligned on the major surface by deposition through the window pattern in the resist layer. The method is particularly useful in making Schottky barrier gate field-effect transistors with high frequency capability, which requires minimal distance between source and drain contacts with an electrically separate Schottky barrier gate contact therebetween.
Abstract:
This disclosure relates to a process for preparing a selfaligned gate field effect transistor in which the source-drain spacing is automatically held to a minimum as a result of the processing steps.