Method for making the self-aligned gate contact of a semiconductor device
    1.
    发明授权
    Method for making the self-aligned gate contact of a semiconductor device 失效
    用于制造半导体器件的自对准栅极接触的方法

    公开(公告)号:US3866310A

    公开(公告)日:1975-02-18

    申请号:US39531973

    申请日:1973-09-07

    CPC classification number: H01L29/00 H01L21/00 H01L29/812

    Abstract: A self-aligned gate contact of a semiconductor device is made without etching the semiconductor member during the gate contact forming step. A metal layer for forming contacts of the semiconductor device is deposited on a major surface of the semiconductor member and thereafter overlaid with a resist layer. A window pattern corresponding to the desired gate contact is formed in the resist layer, and the metal layer is undercut and removed adjacent the window pattern to expose portions of the major surface of the semiconductor member and to form overhanging portions of the resist layer adjacent the window pattern. Simultaneously with the undercutting, at least portions of contacts of the semiconductor device are formed in the metal layer. The desired gate contact is then self-aligned on the major surface by deposition through the window pattern in the resist layer. The method is particularly useful in making Schottky barrier gate field-effect transistors with high frequency capability, which requires minimal distance between source and drain contacts with an electrically separate Schottky barrier gate contact therebetween.

    Abstract translation: 在栅极接触形成步骤期间,半导体器件的自对准栅极接触被制成而不蚀刻半导体部件。 用于形成半导体器件的接触的金属层沉积在半导体部件的主表面上,然后用抗蚀剂层覆盖。 在抗蚀剂层中形成与所需的栅极接触相对应的窗口图案,并且金属层与窗口图案相邻地被切削和去除,以暴露半导体部件的主表面的部分,并形成邻近的抗蚀剂层的悬垂部分 窗口图案 与底切同时,在金属层中形成半导体器件的至少一部分触点。 然后通过沉积穿过抗蚀剂层中的窗口图案,使主要表面上所需的栅极接触自对准。 该方法在制造具有高频能力的肖特基势垒栅极场效应晶体管中是特别有用的,其需要在源极和漏极接触之间的最小距离与它们之间的电隔离的肖特基势垒栅极接触。

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