公开(公告)号：US5955877A

公开(公告)日：1999-09-21

申请号：US170844

申请日：1998-10-13

申请人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/311 ,  H01L21/00 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H05K13/08

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H05K13/08 ,  G01R31/311 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

摘要翻译： 从临时测试包的组件组装和拆卸要测试的半导体骰子的方法和装置。 采用计算机控制的视觉系统将骰子与临时测试包基座对准，并且采用自动机器人手臂系统来检索和组装骰子与各种包装部件。 本发明在骰子的老化和其他预包装测试中具有特殊的用途，以建立已知的骰子（KGD）。

公开(公告)号：US06900459B2

公开(公告)日：2005-05-31

申请号：US10310752

申请日：2002-12-05

申请人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/311 ,  H01L21/00 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H05K13/08 ,  H01L23/58 ,  G01R31/02

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

摘要翻译： 从临时测试包的组件组装和拆卸要测试的半导体骰子的方法和装置。 采用计算机控制的视觉系统将骰子与临时测试包基座对准，并且采用自动机器人手臂系统来检索和组装骰子与各种包装部件。 本发明在骰子的老化和其他预包装测试中具有特殊的用途，以建立已知的骰子（KGD）。

公开(公告)号：US06353312B1

公开(公告)日：2002-03-05

申请号：US09234226

申请日：1999-01-20

申请人： Warren M. Farnworth ,  Jennifer L. Folaron ,  Robert J. Folaron ,  John O. Jacobson ,  David R. Hembree ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Jennifer L. Folaron ,  Robert J. Folaron ,  John O. Jacobson ,  David R. Hembree ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： G01R3102

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method for positioning a semiconductor die within a temporary package, including forming a representation of at least a portion of a semiconductor die, moving the semiconductor die to a location proximate a temporary package, and comparing the representation of the at least a portion of the semiconductor die to a representation of at least a portion of the temporary package. The compared representations are then used to define movement of a die moving assembly, in order to move the die to place the semiconductor die and the temporary package into a desired relationship to one another. A restraining device is then secured to the temporary package to retain the semiconductor die in the desired relationship to the temporary package.

摘要翻译： 一种用于将半导体管芯定位在临时封装内的方法，包括形成半导体管芯的至少一部分的表示，将半导体管芯移动到靠近临时封装的位置，以及将半导体管芯的至少一部分的表示 半导体管芯到所述临时封装的至少一部分的表示。 然后将所比较的表示用于定义模具移动组件的移动，以便移动模具以将半导体管芯和临时封装放置成彼此期望的关系。 然后将约束装置固定到临时包装以将半导体管芯保持在与临时包装件所期望的关系中。

公开(公告)号：US06492187B1

公开(公告)日：2002-12-10

申请号：US09651490

申请日：2000-08-30

申请人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： H01L2166

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

摘要翻译： 从临时测试包的组件组装和拆卸要测试的半导体骰子的方法和装置。 采用计算机控制的视觉系统将骰子与临时测试包基座对准，并且采用自动机器人手臂系统来检索和组装骰子与各种包装部件。 本发明在骰子的老化和其他预包装测试中具有特殊的用途，以建立已知的骰子（KGD）。

公开(公告)号：US6150828A

公开(公告)日：2000-11-21

申请号：US400515

申请日：1999-09-20

申请人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/311 ,  H01L21/00 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H05K13/08 ,  B65G49/07

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H05K13/08 ,  G01R31/311 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

摘要翻译： 从临时测试包的组件组装和拆卸要测试的半导体骰子的方法和装置。 采用计算机控制的视觉系统将骰子与临时测试包基座对准，并且采用自动机器人手臂系统来检索和组装骰子与各种包装部件。 本发明在骰子的老化和其他预包装测试中具有特殊的用途，以建立已知的骰子（KGD）。

公开(公告)号：US5894218A

公开(公告)日：1999-04-13

申请号：US693398

申请日：1996-08-07

申请人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/311 ,  H01L21/00 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H05K13/08 ,  G01R31/02

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H05K13/08 ,  G01R31/311 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of die to establish known good dice (KGD).

摘要翻译： 从临时测试包的组件组装和拆卸要测试的半导体骰子的方法和装置。 采用计算机控制的视觉系统将骰子与临时测试包基座对准，并且采用自动机器人手臂系统来检索和组装骰子与各种包装部件。 本发明在模具的老化和其他预包装测试中具有特别的用途，以建立已知的骰子（KGD）。

公开(公告)号：US06210984B1

公开(公告)日：2001-04-03

申请号：US09399640

申请日：1999-09-20

申请人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Alan G. Wood ,  John O. Jacobson ,  David R. Hembree ,  James M. Wark ,  Jennifer L. Folaron ,  Robert J. Folaron ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： H01L2166

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

摘要翻译： 从临时测试包的组件组装和拆卸要测试的半导体骰子的方法和装置。 采用计算机控制的视觉系统将骰子与临时测试包基座对准，并且采用自动机器人手臂系统来检索和组装骰子与各种包装部件。 本发明在骰子的老化和其他预包装测试中具有特殊的用途，以建立已知的骰子（KGD）。

公开(公告)号：US6064194A

公开(公告)日：2000-05-16

申请号：US767700

申请日：1996-12-17

申请人： Warren M. Farnworth ,  Jennifer L. Folaron ,  Robert J. Folaron ,  David R. Hembree ,  John O. Jacobson ,  Jay C. Nelson ,  Lelan D. Warren

发明人： Warren M. Farnworth ,  Jennifer L. Folaron ,  Robert J. Folaron ,  David R. Hembree ,  John O. Jacobson ,  Jay C. Nelson ,  Lelan D. Warren

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/311 ,  H01L21/00 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H05K13/08 ,  G01R31/02

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H05K13/08 ,  G01R31/311 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An apparatus for automatically positioning electronic dice within temporary packages to enable continuity testing between the dice bond pads and the temporary package electrical interconnects is provided. The apparatus includes a robot having a programmable robot arm with a gripper assembly, die and lid feeder stations, a die inverter, and a plurality of cameras. The cameras take several pictures of the die and temporary packages to precisely align the die bond pads with the temporary package electrical interconnects. A predetermined assembly position is located along a conveyor that conveys a carrier between a first position, corresponding to an inlet, and a second position, corresponding to an outlet. The die, a restraining device and temporary package are assembled at the predetermined assembly position and tested for continuity therebetween. The apparatus further includes a fifth camera which locates the die at a wafer handler. The apparatus has a control mechanism including a microprocessor and program routines that selectively control the robot arm (i) to move the gripper assembly to the lid feeder station to pick up a lid, (ii) to move the gripper assembly along with the lid to pick up the die, (iii) to move the gripper assembly along with the lid and the die to a position to be photographed by the fine die camera, and (iv) to move the lid and the die to the predetermined assembly position located along the conveyor. The method and apparatus may also be used for disassembly.

摘要翻译： 提供了一种用于将电子骰子自动定位在临时包装内的装置，以实现骰子接合焊盘和临时封装电互连之间的连续性测试。 该装置包括具有可编程机器人臂的机器人，其具有夹持器组件，模具和盖子馈送站，模具反相器和多个相机。 相机拍摄模具和临时包装的几张照片，以便将芯片接合焊盘与临时封装电气互连精确对准。 预定的组装位置沿着输送机定位，该输送器在对应于出口的第一位置（对应于入口）和第二位置之间输送载体。 模具，约束装置和临时包装组装在预定的组装位置，并测试其间的连续性。 该设备还包括一个将晶片定位在晶片处理器上的第五相机。 该装置具有包括微处理器和程序程序的控制机构，该程序程序选择性地控制机器人手臂（i）将夹持器组件移动到盖子馈送站以拾取盖子，（ii）将夹持器组件与盖子一起移动到 拾取模具，（iii）将夹具组合件与盖和模具一起移动到由精细模具相机拍摄的位置，以及（iv）将盖子和模具移动到沿着预定的组装位置 输送机 该方法和装置也可以用于拆卸。

公开(公告)号：US06619532B2

公开(公告)日：2003-09-16

申请号：US10196666

申请日：2002-07-15

申请人： David R. Hembree ,  Michael E. Hess ,  John O. Jacobson ,  Warren M. Farnworth ,  Alan G. Wood

发明人： David R. Hembree ,  Michael E. Hess ,  John O. Jacobson ,  Warren M. Farnworth ,  Alan G. Wood

IPC分类号： B23K2010

CPC分类号： B23K20/10 ,  B23K2101/38

摘要： A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

摘要翻译： 用于将互连的穿刺型导电接触构件接合到裸半导体管芯的接合焊盘的机器和方法包括使用安装成振动模具和互连中的一个或两者的一个或两个超声波振动器。 超声能量的短轴向线性爆发使得接触构件能够以低得多的压缩力在接合焊盘的表面上刺穿硬氧化物层并且迅速地实现完全的穿透深度。

公开(公告)号：US6064216A

公开(公告)日：2000-05-16

申请号：US241553

申请日：1999-02-01

申请人： Warren M. Farnworth ,  Salman Akram ,  Alan G. Wood ,  David R. Hembree ,  James M. Wark ,  John O. Jacobson

发明人： Warren M. Farnworth ,  Salman Akram ,  Alan G. Wood ,  David R. Hembree ,  James M. Wark ,  John O. Jacobson

IPC分类号： G01R1/04 ,  G01R31/28 ,  G01R31/02

CPC分类号： G01R1/0491 ,  G01R31/2886

摘要： A method, apparatus and system for testing semiconductor wafers are provided. The method includes providing a wafer carrier to provide an electrical path for receiving and transmitting test signals to the wafer. The wafer carrier includes a base for retaining the wafer, and an interconnect having contact members configured to establish electrical communication with contact locations on the wafer. The wafer carrier can include one or more compressible spring members configured to bias the wafer and interconnect together in the assembled carrier. The wafer carrier can be assembled, with the wafer in alignment with the interconnect, using optical alignment techniques, and an assembly tool similar to aligner bonder tools used for flip chip bonding semiconductor dice. A system for use with the carrier can include a testing apparatus configured to apply test signals through the carrier to the wafer while the wafer is subjected to temperature cycling.

摘要翻译： 提供了一种用于测试半导体晶片的方法，装置和系统。 该方法包括提供晶片载体以提供用于接收和传输测试信号到晶片的电路径。 晶片载体包括用于保持晶片的基座和具有被配置为与晶片上的接触位置建立电连通的接触构件的互连。 晶片载体可以包括被配置为偏置晶片并在组装的载体中互连在一起的一个或多个可压缩弹簧构件。 可以使用光学对准技术来组装晶片载体，其中晶片与互连对准，以及类似于用于倒装芯片接合半导体晶片的对准器焊接工具的组装工具。 与载体一起使用的系统可以包括测试装置，其被配置为在晶片受到温度循环的同时将测试信号通过载体施加到晶片。