公开(公告)号：US5086270A

公开(公告)日：1992-02-04

申请号：US634814

申请日：1990-12-31

申请人： Wataru Karasawa ,  Taketoshi Itoyama ,  Itaru Takao ,  Tadashi Obikane ,  Hisashi Koike

发明人： Wataru Karasawa ,  Taketoshi Itoyama ,  Itaru Takao ,  Tadashi Obikane ,  Hisashi Koike

IPC分类号： H01L21/66 ,  G01R1/04 ,  G01R1/067

CPC分类号： G01R1/04 ,  G01R1/06705

摘要： A probe apparatus having a measuring section with a first system for electrically measuring an object. A loader section has a second system for carrying objects to the measuring section and a marking section has a third system for marking objects. These sections are independent of each other so that a vibration occurring in one section is not transmitted to the other sections.

摘要翻译： 一种具有测量部分的探针装置，具有用于电测量物体的第一系统。 装载器部分具有用于将物体运送到测量部分的第二系统，并且标记部分具有用于标记物体的第三系统。 这些部分彼此独立，使得在一个部分中发生的振动不传递到其它部分。

公开(公告)号：US5510724A

公开(公告)日：1996-04-23

申请号：US251365

申请日：1994-05-31

申请人： Taketoshi Itoyama ,  Yuichi Abe ,  Masao Yamaguchi

发明人： Taketoshi Itoyama ,  Yuichi Abe ,  Masao Yamaguchi

IPC分类号： G01R31/28 ,  G01R31/02

CPC分类号： G01R31/2849

摘要： A loader section for supplying semiconductor wafers is arranged at one end of a linear first convey path for a convey unit. Burn-in test sections, probe test sections, a laser repair section, a deposition repair section, a marking section, a baking section, and visual test sections are arranged on both the sides of the first convey path. In the burn-in test section arranged in the loader section, each semiconductor wafer picked up from a cassette is pre-aligned. The pre-aligned semiconductor wafers are loaded/unloaded into/from the respective test sections and the repair section by the convey unit in accordance with a predetermined test procedure, thereby performing a plurality of test items and repair steps by an inline scheme. Each burn-in test section includes a probe card having conductive projections which are brought into contact with all of many semiconductor chips formed on each semiconductor wafer at once. Each burn-in test section performs burn-in tests on a plurality of semiconductor chips with which the conductive projections are brought into contact at once, while temperature/voltage stresses are applied to the semiconductor chips.

摘要翻译： 用于提供半导体晶片的装载器部分布置在用于输送单元的线性第一输送路径的一端。 在第一传送路径的两侧布置了老化测试部分，探针测试部分，激光修复部分，沉积修复部分，标记部分，烘烤部分和视觉测试部分。 在安装在装载器部分中的老化测试部分中，从盒子拾取的每个半导体晶片被预对准。 预定半导体晶片根据预定的测试程序由输送单元装载/卸载到相应的测试部分和修理部分，从而通过在线方案执行多个测试项目和修理步骤。 每个老化测试部分包括具有导电突起的探针卡，该探针卡立刻与形成在每个半导体晶片上的所有许多半导体芯片接触。 每个老化测试部分在对半导体芯片施加温度/电压应力的同时，对导体突起一次接触的多个半导体芯片执行老化测试。

公开(公告)号：US5614837A

公开(公告)日：1997-03-25

申请号：US457774

申请日：1995-06-01

申请人： Taketoshi Itoyama ,  Yuichi Abe ,  Masao Yamaguchi

发明人： Taketoshi Itoyama ,  Yuichi Abe ,  Masao Yamaguchi

IPC分类号： G01R31/28 ,  G01R31/02

CPC分类号： G01R31/2849

摘要： A loader section for supplying semiconductor wafers is arranged at one end of a linear first convey path for a convey unit. Burn-in test sections, probe test sections, a laser repair section, a deposition repair section, a marking section, a baking section, and visual test sections are arranged on both the sides of the first convey path. In the burn-in test section arranged in the loader section, each semiconductor wafer picked up from a cassette is pre-aligned. The pre-aligned semiconductor wafers are loaded/unloaded into/from the respective test sections and the repair section by the convey unit in accordance with a predetermined test procedure, thereby performing a plurality of test items and repair steps by an inline scheme. Each burn-in test section includes a probe card having conductive projections which are brought into contact with all of many semiconductor chips formed on each semiconductor wafer at once. Each burn-in test section performs burn-in tests on a plurality of semiconductor chips with which the conductive projections are brought into contact at once, while temperature/voltage stresses are applied to the semiconductor chips.

摘要翻译： 用于提供半导体晶片的装载器部分布置在用于输送单元的线性第一输送路径的一端。 在第一传送路径的两侧布置了老化测试部分，探针测试部分，激光修复部分，沉积修复部分，标记部分，烘烤部分和视觉测试部分。 在安装在装载器部分中的老化测试部分中，从盒子拾取的每个半导体晶片被预对准。 预定半导体晶片根据预定的测试程序由输送单元装载/卸载到相应的测试部分和修理部分，从而通过在线方案执行多个测试项目和修理步骤。 每个老化测试部分包括具有导电突起的探针卡，该探针卡立刻与形成在每个半导体晶片上的所有许多半导体芯片接触。 每个老化测试部分在对半导体芯片施加温度/电压应力的同时，对导体突起一次接触的多个半导体芯片执行老化测试。

公开(公告)号：US5172053A

公开(公告)日：1992-12-15

申请号：US726725

申请日：1991-07-01

申请人： Taketoshi Itoyama

发明人： Taketoshi Itoyama

IPC分类号： G01R1/073

CPC分类号： G01R1/07314

摘要： A proper apparatus includes a test head for generating a test signal. A probe card is fixed removably on the test head. The probe card supplies the test signal to a test piece when the probe card electrically contacts the test piece, and tests electric characteristics of the test piece.

摘要翻译： 适当的装置包括用于产生测试信号的测试头。 探针卡可拆卸地固定在测试头上。 当探针卡电接触测试片时，探针卡将测试信号提供给测试件，并测试测试件的电气特性。