摘要:
A loader section for supplying semiconductor wafers is arranged at one end of a linear first convey path for a convey unit. Burn-in test sections, probe test sections, a laser repair section, a deposition repair section, a marking section, a baking section, and visual test sections are arranged on both the sides of the first convey path. In the burn-in test section arranged in the loader section, each semiconductor wafer picked up from a cassette is pre-aligned. The pre-aligned semiconductor wafers are loaded/unloaded into/from the respective test sections and the repair section by the convey unit in accordance with a predetermined test procedure, thereby performing a plurality of test items and repair steps by an inline scheme. Each burn-in test section includes a probe card having conductive projections which are brought into contact with all of many semiconductor chips formed on each semiconductor wafer at once. Each burn-in test section performs burn-in tests on a plurality of semiconductor chips with which the conductive projections are brought into contact at once, while temperature/voltage stresses are applied to the semiconductor chips.
摘要:
A loader section for supplying semiconductor wafers is arranged at one end of a linear first convey path for a convey unit. Burn-in test sections, probe test sections, a laser repair section, a deposition repair section, a marking section, a baking section, and visual test sections are arranged on both the sides of the first convey path. In the burn-in test section arranged in the loader section, each semiconductor wafer picked up from a cassette is pre-aligned. The pre-aligned semiconductor wafers are loaded/unloaded into/from the respective test sections and the repair section by the convey unit in accordance with a predetermined test procedure, thereby performing a plurality of test items and repair steps by an inline scheme. Each burn-in test section includes a probe card having conductive projections which are brought into contact with all of many semiconductor chips formed on each semiconductor wafer at once. Each burn-in test section performs burn-in tests on a plurality of semiconductor chips with which the conductive projections are brought into contact at once, while temperature/voltage stresses are applied to the semiconductor chips.
摘要:
There is provided a probe apparatus with a stage for holding a wafer on which a plurality of chips are regularly arranged such that the chips are arranged substantially in an XY plane, a large number of contactors facing the wafer held on the stage, provided to corresponding to respective pads of the chips such as to be brought into contact collectively with the pads of all the device circuits on the wafer, tester for transmitting/receiving a test signal to/from the device via the contactors, elevator device for elevating the stage in a Z-axis direction, alignment device for moving the stage in an X-axis and/or Y-axis direction, and controller for controlling the alignment device and the elevator device.
摘要:
The present invention is a template matching processing device capable of evaluating a similarity degree which supports even a case of intensive morphological change between a design image and a photographic image. In the template matching processing device, matching processing between the design image and the photographic image is performed, a partial design image is obtained by clipping a portion having the highest correlation (step 101), and processing for deforming the photographic image in accordance with the clipped design image (steps 102 to 105) is performed, so that correlation between the deformed image obtained and the design image is taken to be set as the similarity degree.
摘要:
When the lengths of FEM wafers are automatically measured, not only the sizes of targets, the lengths of which are to be measured, are often varied from those in registration, but also the patterns of the targets are often deformed. Therefore, it is difficult to automatically determine whether the length measurement is possible or not. Therefore, the following are executed with a semiconductor inspection system: (1) a process of identifying the position of the contour line of an inspected image using a distance image calculated from a reference image, (2) a process of calculating a defect size image based on the position of the contour line with respect to the identified distance image, and detecting a defect candidate from the defect size image, and (3-1) a process of, upon detection of the defect candidate, calculating the size of the detected defect candidate, or (3-2) a process of detecting a portion different between the first and second contour lines as the defect candidate.
摘要:
It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.The semiconductor inspection apparatus includes means for imaging a shape on a wafer or on an exposure mask; means for storing an image inspected by the imaging means; means for storing design data of the semiconductor circuit corresponding to a position on the wafer or on the exposure mask which are to be imaged by the imaging means; means for storing a design-data image obtained as a result of converting the design data into an image; means for generating a design-data ROI image by converting an interest drawing region found from a relative crude-density relation of a shape included in the design-data image into an image; and a position alignment section configured to carry out position alignment on the inspected image and the design-data image. The semiconductor inspection apparatus makes use of the design-data ROI image in order to identify a position at which the inspected image and the design-data image match each other or compute the degree of coincidence.
摘要:
An evaluation value indicative of the extent of lines in each direction is calculated for a pre-processed image in which 0s are filled in and extended in the lateral direction of the inputted image and which has been reduced ⅛th in the longitudinal direction. To obtain the angle of rotation of an image from the change in the evaluation value obtained while the angle relative to the lateral direction of the pre-processed image is modified in small steps, a parallel line is drawn for each direction, a projection is taken, and the sum of squares serves as the evaluation value of the direction. The direction having the highest evaluation value serves as the obtained direction of rotation from the normal position. The projection of each direction references the point of intersection between the parallel line drawn for each direction and the coordinate line of the horizontal axis.
摘要:
Provided is a template matching method and a template matching apparatus, where the degree of matching between a template and the actual image upon template matching is maintained at a high level, without depending on a partial appearance of a lower layer. Proposed as one embodiment, is a method and an apparatus for template matching, where either an area is set in which comparison of the template and the image is not conducted, or a second area is set inside the template where comparison different from comparison conducted in a first comparison area is to be conducted, and the template matching is conducted on the basis either of comparison excluding the non-comparison area, or of comparison using the first and second areas.
摘要:
A content playback apparatus includes: a display section that displays a plurality of indicators associated with a plurality of pieces of content, and a specifier to be used to specify one of the indicators; a playback section that plays back the piece of content associated with the indicator specified by the specifier; a switch section that switches, in accordance with a user's operation, what the specifier specifies to new the indicator; and a playback control section that controls the playback section such that if the user's operation switches, while the piece of content associated with the indicator specified by the specifier is played, what the specifier specifies to next the indicator and the user's subsequent operation switches, within a predetermined period of time from when the previous switch is completed, what the specifier specifies to subsequent the indicator, the playback section keeps playing back the piece of content.
摘要:
There is provided a data processing system including a server device for providing Web data having a data portion with a specific identifier, and a data processing apparatus having a receiving unit for receiving the Web data from the server device, an analysis unit for analyzing the Web data to extract the specific identifier from the Web data, and a data processing unit for changing the data portion with the specific identifier based on local data.