摘要:
A probe apparatus having a measuring section with a first system for electrically measuring an object. A loader section has a second system for carrying objects to the measuring section and a marking section has a third system for marking objects. These sections are independent of each other so that a vibration occurring in one section is not transmitted to the other sections.
摘要:
There is provided a system and method for improving productivity of apparatuses. A vendor-side computer 26 obtains operating state data obtained by a monitoring device 18 provided in an apparatus 10 via a communication line 100, and monitors the operating state of the apparatus 10 from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus 10, and the vendor-side computer 26 that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant 101. The plant 101 feeds the optimal replacement period back to the operation of the apparatus 10, so that productivity can be improved.
摘要:
There is provided a system and method for monitoring an apparatus from a remote location. A vendor-side computer obtains operating state data obtained by a monitoring device provided in an apparatus via a communication line, and monitors the operating state of the apparatus from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus, and the vendor-side computer that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant. The plant feeds the optimal replacement period back to the operating of the apparatus.
摘要:
An apparatus and method of testing semiconductor wafer, which are capable of properly processing inking errors caused in the process of determining whether the chips are good or bad. The apparatus comprises an inker for markings those chips which have been found defective by probing test, a TV camera for imaging the chips including those which have been found defective and marked, a computer system for comparing an image-signal with a reference-signal, and determining that the chip has no marking when the signals coincide and that the chip has a marking when the signals do not coincide, and a counter for counting those chips which have been determined to have markings or no marking by the computer system.
摘要:
A probe apparatus is disclosed, in which, when performing a predetermined processing on an object having a pattern recurring at a predetermined pitch by moving the object at a pitch equal to the predetermined pitch, the difference between the pitch of actual movement of the object and the pitch of the recurrence of pattern is detected by pattern recognition, and the pitch of movement of the object is corrected according to the detected difference.
摘要:
A probe apparatus which has a probe card having a plurality of probes, a wafer holder located above or beside the probe card, for holding a wafer to be examined, a tester head electrically connected to the probes of the probe card, a tester electrically connected to the tester head, for detecting electrical characteristics of the wafer from the data output from the wafer, and a CCD camera arranged to oppose the object, for detecting the position of the wafer.
摘要:
A probe apparatus having a probe card having plurality of probes, a member arranged above the probe card to hold an object to be probed, and a test head electrically connected to the probes of the probe card.
摘要:
In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.
摘要:
A processing system has a processing section for continuously processing a member to be processed; an inspection section for inspecting a processed state of the member processed by the processing section; a processed state determination section for determining whether the processed state is defective/nondefective, on the basis of a result of inspection performed by the inspection section; a continuity determination section for determining whether or not a defective determination is continuously made when the processed state is determined to be defective by the processed state determination section; and a processing control section for controlling processing so as to stop processing of the member continuously performed by the processing section when the continuity determination section determines that the defective determination is continuously made.
摘要:
In a semiconductor manufacturing system, operations of a plurality of processing apparatuses are controlled so as to efficiently manufacture semiconductor devices. The semiconductor manufacturing system having at least one processing apparatus for applying a process to semiconductor substrates. A memory part (5) stores priority-level data which indicates a priority level of the process to be applied to each of the semiconductor substrates on an individual semiconductor substrate basis. A control part (3, 7) controls the processing apparatus to apply the process to a newly supplied one of the semiconductor substrates by determining an order of processing the newly supplied one of the semiconductor substrates being supplied to the processing apparatus based on a comparison of new priority-level data with the priority-level data stored in the memory part with respect to the semiconductor substrates of which process has been scheduled, the new priority-level data being supplied in response to the newly supplied one of the semiconductor substrates being supplied to the processing apparatus.