摘要:
A sensor of a parameter such as temperature includes an indicator encapsulated within a rigid enclosure, wherein the sensor has a characteristic that varies with the parameter that is detectable upon illumination with electromagnetic radiation through a window of the enclosure that is transparent to the radiation. In a specific example, the indicator changes an optical characteristic such as its color as a function of its temperature, and may be of an irreversible type in order to indicate the peak temperature reached. The sensor may include a pattern of such indicators that have different peak temperatures to which they respond, so that the sensor gives a unique visual pattern at each temperature within its measurement range. This pattern may be viewed directly or processed by computer to compare the pattern with those which indicate known temperatures. The sensor and system utilizing it have particular advantages for operation in a vacuum, and/or under ion bombardment, such occurs in plasma etching and deposition machines, and/or within a strong electromagnetic field, such as within the radio frequency and microwave frequency ranges. An array of such sensors positioned across a surface of a thermally conductive substrate is especially useful for measuring a temperature distribution occurring across semiconductor wafers in wafer processing machinery.
摘要:
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
摘要:
A cable and interconnect design including a substrate containing discrete sensors in a plurality of cavities or a plurality of thin film sensors deposited throughout the substrate surface. The discrete sensors are bonded within each cavity and potted with a potting compound. Each sensor has leads joined to filaments by an interconnect system. Thin film sensor leads on the substrate connect to a signal transmitting cable by the interconnect system. The filaments are coated and converge at a strain relief coupled to the substrate. The cable, having flat and round portions, includes an array of flat signal transmitting cables arranged side by side in the flat portion and stacked one on top of the other in the round portion. Each signal cable contains a plurality of the filaments bonded together. A pair of ribbons extend along the length of the array of cables. The ribbons and array of cables are bonded together with film to form the flat portion. The ribbons are joined to the strain relief, thereby joining the cable to the substrate. A boot is disposed around the cable transition between the flat and round portions. A connector is coupled to the round portion and the filaments are terminated to the connector. Advantages include the interconnect system bonding pads which reduce fabrication time and provide simple connection geometry on the substrate. Integration of the ribbons into the flat portion allows repeated use in a vacuum seal without damaging the cables. Stacked flat cables make identification of the filaments easy and product assembly fast.
摘要:
Fiberoptic sensors of various configurations are provided for measuring the magnitude of the electric or magnetic fields, and thereby the power, at local points within a relatively high-power electromagnetic heating environment such as occurs, for example, in a microwave oven or an industrial microwave processing chamber. Each type of sensor includes one element that is heated by either the oscillating electric or magnetic field, and an optical temperature measuring element positioned to be heated by the first element, its temperature being optically determined by an instrument to which an opposite end of the optical fiber length is connected.
摘要:
A luminescence-based integrated optical and electronic system for measuring temperature or some other parameter from the decay time of a luminescent sensor is disclosed. A high bandwidth, low noise amplifier applies a detected decaying luminescent signal to a digital system that acquires that signal and processes it in order to determine its decay time characteristics that are related to temperature or another parameter being measured. The digital signal processing includes use of a digital curve-fitting technique. A preferred luminescent material for temperature measurement is a chromium-doped yttrium gallium garnet material. The entire optical and electronic portions of the measuring system can be accommodated on a small single circuit card.
摘要:
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
摘要:
A method for reducing overlay error in a photolithographic process, by providing a substrate having a permanent layer with a first pattern disposed therein, coating the substrate with photoresist, exposing the photoresist to a second pattern, while measuring temperatures at a plurality of different first positions across the substrate, developing the second pattern in the photoresist, measuring overlay errors between the first and second patterns at a plurality of different second positions across the substrate, correlating the overlay errors with temperatures by position on the substrate, determining any relationship indicated between the correlated overlay errors and temperatures, and adjusting at least one temperature controlling aspect of the photolithographic process in response to any relationship determined.
摘要:
At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要:
Multiple sensors may be attached to a substrate to measure conditions at different points. Positioning the sensors accurately may be achieved using a template to establish sensor position. A pre-fabricated kit including a template, sensors and a cable assembly may be easily transported so that sensors may be attached in the field.
摘要:
Several specific types of optical sensors capable of measuring temperature, pressure, force, acceleration, radiation and electrical fields, fluid level, vapor pressure, and the like, are disclosed, along with an electro-optical system for detecting the optical signal developed by the sensor. One such probe utilizes a convex shaped structure consisting of an elastomeric material attached to an end of an optical fiber, the elastomeric material being coated with a luminescent material, a combination that is capable of measuring both temperature and pressure. Such a probe is also specifically adapted for measuring surface temperature by making a good physical contact with the surface being measured. Another such probe utilizes a similar structure but of a non-elastomeric material for the purpose of detecting both temperature and either index of refraction or vapor pressure changes. Improvements in other existing sensors of a wide variety of physical parameters other than temperature are also described wherein temperature is simultaneously measured for correcting such physical parameter measurements that are affected by temperature variations.