Magnetic Tunnel Junction for MRAM applications
    1.
    发明申请
    Magnetic Tunnel Junction for MRAM applications 有权
    MRAM应用的磁隧道结

    公开(公告)号:US20120181537A1

    公开(公告)日:2012-07-19

    申请号:US12930877

    申请日:2011-01-19

    IPC分类号: H01L29/82 H01L21/36 H01L29/04

    摘要: A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FeB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic %. NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiment, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.

    摘要翻译: 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FeB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%的Mg,Hf,Zr,Nb或Ta。 NiFeX厚度优选在20至40埃之间,以显着减少位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。

    Magnetic tunnel junction for MRAM applications
    2.
    发明授权
    Magnetic tunnel junction for MRAM applications 有权
    用于MRAM应用的磁隧道结

    公开(公告)号:US08786036B2

    公开(公告)日:2014-07-22

    申请号:US12930877

    申请日:2011-01-19

    IPC分类号: H01L43/10 H01L27/22

    摘要: A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FEB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic % NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiments, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.

    摘要翻译: 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FEB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%NiFeX厚度的Mg,Hf,Zr,Nb或Ta优选为20〜40埃,以显着降低位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。

    High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same
    3.
    发明授权
    High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same 有权
    用于常规MRAM和STT-RAM的高性能MTJ元件及其制造方法

    公开(公告)号:US08372661B2

    公开(公告)日:2013-02-12

    申请号:US11981127

    申请日:2007-10-31

    IPC分类号: H01L21/00

    摘要: A STT-RAM MTJ that minimizes spin-transfer magnetization switching current (Jc) is disclosed. The MTJ has a MgO tunnel barrier layer formed with a natural oxidation process to achieve a low RA (10 ohm-um2) and a Fe or Fe/CoFeB/Fe free layer which provides a lower intrinsic damping constant than a CoFeB free layer. A Fe, FeB, or Fe/CoFeB/Fe free layer when formed with a MgO tunnel barrier (radical oxidation process) and a CoFeB AP1 pinned layer in a MRAM MTJ stack annealed at 360° C. provides a high dR/R (TMR)>100% and a substantial improvement in read margin with a TMR/Rp_cov=20. High speed measurement of 100 nm×200 nm oval STT-RAM MTJs has shown a Jc0 for switching a Fe free layer is one half that for switching an amorphous CO40Fe40B20 free layer. A Fe/CoFeB/Fe free layer configuration allows the Hc value to be increased for STT-RAM applications.

    摘要翻译: 公开了使自旋转移磁化开关电流(Jc)最小化的STT-RAM MTJ。 MTJ具有形成有自然氧化工艺的MgO隧道阻挡层,以实现低的RA(10欧姆 - um2)和不含CoFeB自由层的较低的固有阻尼常数的Fe或Fe / CoFeB / Fe自由层。 当在360℃退火的MRAM MTJ堆叠中形成具有MgO隧道势垒(自由基氧化法)和CoFeB AP1钉扎层的Fe,FeB或Fe / CoFeB / Fe自由层时,提供高dR / R(TMR )> 100%,TMR / Rp_cov = 20时读取余量大幅度提高。 100 nm×200 nm椭圆STT-RAM MTJ的高速测量显示,用于切换无Fe层的Jc0是用于切换无定形CO40Fe40B20自由层的一半。 Fe / CoFeB / Fe自由层配置允许为STT-RAM应用增加Hc值。

    High performance MTJ elements for STT-RAM and method for making the same
    4.
    发明申请
    High performance MTJ elements for STT-RAM and method for making the same 有权
    用于STT-RAM的高性能MTJ元件和制作相同的方法

    公开(公告)号:US20100258889A1

    公开(公告)日:2010-10-14

    申请号:US12803191

    申请日:2010-06-21

    IPC分类号: H01L29/82

    摘要: An STT-MTJ MRAM cell utilizes transfer of spin angular momentum as a mechanism for changing the magnetic moment direction of a free layer. The cell includes an IrMn pinning layer, a SyAP pinned layer, a naturally oxidized, crystalline MgO tunneling barrier layer that is formed on an Ar-ion plasma smoothed surface of the pinned layer and, in one embodiment, a composite tri-layer free layer that comprises an amorphous layer of Co60Fe20B20 of approximately 20 angstroms thickness formed between two crystalline layers of Fe of 3 and 6 angstroms thickness respectively. The free layer is characterized by a low Gilbert damping factor and by very strong polarizing action on conduction electrons. The resulting cell has a low critical current, a high dR/R and a plurality of such cells will exhibit a low variation of both resistance and pinned layer magnetization angular dispersion.

    摘要翻译: STT-MTJ MRAM单元利用自旋角动量的传递作为改变自由层的磁矩方向的机构。 电池包括形成在被钉扎层的Ar离子等离子体平滑表面上的IrMn钉扎层,SyAP钉扎层,自然氧化的结晶的MgO隧道势垒层,在一个实施例中,复合三层自由层 其包括分别在3和6埃厚度的Fe的两个结晶层之间形成的约20埃厚度的Co60Fe20B20的非晶层。 自由层的特征在于低吉尔伯特阻尼因子和对传导电子的非常强的偏振作用。 所得到的电池具有低临界电流,高dR / R,并且多个这样的电池将呈现电阻和钉扎层磁化角分散的低变化。

    High performance MTJ element for STT-RAM and method for making the same
    7.
    发明授权
    High performance MTJ element for STT-RAM and method for making the same 有权
    用于STT-RAM的高性能MTJ元件和制作相同的方法

    公开(公告)号:US08058698B2

    公开(公告)日:2011-11-15

    申请号:US12803189

    申请日:2010-06-21

    IPC分类号: H01L29/82 G11C11/00

    摘要: An STT-MTJ MRAM cell that utilizes transfer of spin angular momentum as a mechanism for changing the magnetic moment direction of a free layer. The device includes an IrMn pinning layer, a SyAP pinned layer, a naturally oxidized, crystalline MgO tunneling barrier layer that is formed on an Ar-ion plasma smoothed surface of the pinned layer and, in one embodiment, a free layer that is an amorphous layer of Co60Fe20B20 of approximately 20 angstroms thickness formed between two crystalline layers of Fe of 3 and 6 angstroms thickness respectively. The free layer has a low Gilbert damping factor and a very strong polarizing action on conduction electrons. The resulting cell has a low critical current, a high dR/R and a plurality of such cells will exhibit a low variation of both resistance and pinned layer magnetization angular dispersion.

    摘要翻译: 利用转移自旋角动量作为改变自由层的磁矩方向的机构的STT-MTJ MRAM单元。 该器件包括形成在钉扎层的Ar离子等离子体平滑表面上的IrMn钉扎层,SyAP钉扎层,自然氧化的结晶的MgO隧道势垒层,在一个实施例中,是非晶形的自由层 分别在3和6埃厚度的Fe的两个结晶层之间形成大约20埃厚度的Co60Fe20B20层。 自由层具有低的吉尔伯特衰减因子和对传导电子的非常强的偏振作用。 所得到的电池具有低临界电流,高dR / R,并且多个这样的电池将呈现电阻和钉扎层磁化角分散的低变化。

    High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same
    8.
    发明申请
    High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same 有权
    用于常规MRAM和STT-RAM的高性能MTJ元件及其制造方法

    公开(公告)号:US20090108383A1

    公开(公告)日:2009-04-30

    申请号:US11981127

    申请日:2007-10-31

    IPC分类号: H01L29/82 H01L21/8246

    摘要: A STT-RAM MTJ that minimizes spin-transfer magnetization switching current (Jc) is disclosed. The MTJ has a MgO tunnel barrier layer formed with a natural oxidation process to achieve a low RA (10 ohm-um2) and a Fe or Fe/CoFeB/Fe free layer which provides a lower intrinsic damping constant than a CoFeB free layer. A Fe, FeB, or Fe/CoFeB/Fe free layer when formed with a MgO tunnel barrier (radical oxidation process) and a CoFeB AP1 pinned layer in a MRAM MTJ stack annealed at 360° C. provides a high dR/R (TMR)>100% and a substantial improvement in read margin with a TMR/Rp_cov=20. High speed measurement of 100 nm×200 nm oval STT-RAM MTJs has shown a Jc0 for switching a Fe free layer is one half that for switching an amorphous CO40Fe40B20 free layer. A Fe/CoFeB/Fe free layer configuration allows the Hc value to be increased for STT-RAM applications.

    摘要翻译: 公开了使自旋转移磁化开关电流(Jc)最小化的STT-RAM MTJ。 MTJ具有形成有自然氧化工艺的MgO隧道阻挡层,以实现低的RA(10欧姆 - um2)和不含CoFeB自由层的较低的固有阻尼常数的Fe或Fe / CoFeB / Fe自由层。 当在360℃退火的MRAM MTJ堆叠中形成具有MgO隧道势垒(自由基氧化法)和CoFeB AP1钉扎层的Fe,FeB或Fe / CoFeB / Fe自由层时,提供高dR / R(TMR )> 100%,TMR / Rp_cov = 20时读取余量大幅度提高。 100 nmx200 nm椭圆形STT-RAM MTJ的高速测量显示,用于切换无Fe层的Jc0是用于切换无定形CO40Fe40B20自由层的一半。 Fe / CoFeB / Fe自由层配置允许为STT-RAM应用增加Hc值。

    High performance MTJ element for STT-RAM and method for making the same
    9.
    发明申请
    High performance MTJ element for STT-RAM and method for making the same 有权
    用于STT-RAM的高性能MTJ元件和制作相同的方法

    公开(公告)号:US20100258888A1

    公开(公告)日:2010-10-14

    申请号:US12803189

    申请日:2010-06-21

    IPC分类号: H01L29/82

    摘要: An STT-MTJ MRAM cell that utilizes transfer of spin angular momentum as a mechanism for changing the magnetic moment direction of a free layer. The device includes an IrMn pinning layer, a SyAP pinned layer, a naturally oxidized, crystalline MgO tunneling barrier layer that is formed on an Ar-ion plasma smoothed surface of the pinned layer and, in one embodiment, a free layer that comprises an amorphous layer of Co60Fe20B20. of approximately 20 angstroms thickness formed between two crystalline layers of Fe of 3 and 6 angstroms thickness respectively. The free layer is characterized by a low Gilbert damping factor and by very strong polarizing action on conduction electrons. The resulting cell has a low critical current, a high dR/R and a plurality of such cells will exhibit a low variation of both resistance and pinned layer magnetization angular dispersion.

    摘要翻译: 利用转移自旋角动量作为改变自由层的磁矩方向的机构的STT-MTJ MRAM单元。 该器件包括形成在被钉扎层的Ar离子等离子体平滑表面上的IrMn钉扎层,SyAP钉扎层,自然氧化的结晶的MgO隧道势垒层,在一个实施例中,包含非晶态的自由层 Co60Fe20B20层。 分别在3和6埃的Fe的两个结晶层之间形成约20埃的厚度。 自由层的特征在于低吉尔伯特阻尼因子和对传导电子的非常强的偏振作用。 所得到的电池具有低临界电流,高dR / R,并且多个这样的电池将呈现电阻和钉扎层磁化角分散的低变化。

    Structure and method to fabricate high performance MTJ devices for spin-transfer torque (STT)-RAM
    10.
    发明申请
    Structure and method to fabricate high performance MTJ devices for spin-transfer torque (STT)-RAM 有权
    用于制造自旋转矩(STT)-RAM的高性能MTJ装置的结构和方法

    公开(公告)号:US20100065935A1

    公开(公告)日:2010-03-18

    申请号:US12284066

    申请日:2008-09-18

    IPC分类号: H01L29/82 H01L21/00

    摘要: A STT-RAM MTJ is disclosed with a MgO tunnel barrier formed by a NOX process, a CoFeB/FeSiO/CoFeB composite free layer with a middle nanocurrent channel layer to minimize Jc0, and a Ru capping layer to enhance the spin scattering effect and increase dR/R. Good write margin is achieved by modifying the NOX process to afford a RA less than 10 ohm-μm2 and good read margin is realized with a dR/R of >100% by annealing at 330° C. or higher to form crystalline CoFeB free layers. The NCC thickness is maintained in the 6 to 10 Angstrom range to reduce Rp and avoid Fe(Si) granules from not having sufficient diameter to bridge the distance between upper and lower CoFeB layers. A FeSiO layer may be inserted below the Ru layer in the capping layer to prevent the Ru from causing a high damping constant in the upper CoFeB free layer.

    摘要翻译: 公开了一种STT-RAM MTJ,其具有通过NOX工艺形成的MgO隧道势垒,具有中间纳米通道层的CoFeB / FeSiO / CoFeB复合自由层以最小化Jc0,以及Ru覆盖层以增强自旋散射效应并增加 dR / R。 通过改变NOX工艺以获得RA小于10欧姆 - μm2的良好的写入余量,并且通过在330℃或更高温度退火以dO / R> 100%实现良好的读取余量以形成结晶CoFeB自由层 。 NCC厚度保持在6至10埃范围内以减少Rp,并避免Fe(Si)颗粒不具有足够的直径以桥接上部和下部CoFeB层之间的距离。 可以在覆盖层中的Ru层下方插入FeSiO层,以防止Ru在上部CoFeB自由层中引起高阻尼常数。