摘要:
The invention disclosed apparatuses and methods to do nanoimprint lithography using a deformable mold. Generally, the apparatus has a chamber with a transparent section on its top wall, which is capable of vacuuming and pressurizing. The deformable mold fixed firmly onto a hollow mold holder around its full periphery is attached to top inner surface of the chamber and positioned underneath the transparent section. The central area of the mold is freely accessible from underneath through the opening of the mold holder. An enclosed volume referring to mold mini-chamber is formed between the mold/holder and top wall of the chamber. Inside chamber, a stage assembly is installed. A chuck to vacuumly hold a substrate is mounted on top of the stage assembly. At beginning of the imprinting, the substrate with a layer of resist is positioned underneath the mold at a predetermined gap between them. Then, the substrate is moved up to contact with the mold either under vacuum or under atmosphere. The substrate and mold may be pressed further by introducing higher pressure inside the chamber. After consolidating the resist, the substrate is separated from the mold by either direct pull-down enabled by stage movement or deforming the mold enabled by differential pressure between the mold mini-chamber and the bulk volume of the chamber, or mixing of both.
摘要:
In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction. Apparatus for effecting such separation is also described.
摘要:
In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch. Surfactant vapor may be generated by liquid surface vaporization, liquid injection or spray vaporization. A surface adhesion promoter can be coated on the substrate by a similar method with the same apparatus.
摘要:
The invention disclosed apparatuses and methods to do nanoimprint lithography using a deformable mold. Generally, the apparatus has a chamber with a transparent section on its top wall, which is capable of vacuuming and pressurizing. The deformable mold fixed firmly onto a hollow mold holder around its full periphery is attached to top inner surface of the chamber and positioned underneath the transparent section. The central area of the mold is freely accessible from underneath through the opening of the mold holder. An enclosed volume referring to mold mini-chamber is formed between the mold/holder and top wall of the chamber. Inside chamber, a stage assembly is installed. A chuck to vacuumly hold a substrate is mounted on top of the stage assembly. At beginning of the imprinting, the substrate with a layer of resist is positioned underneath the mold at a predetermined gap between them. Then, the substrate is moved up to contact with the mold either under vacuum or under atmosphere. The substrate and mold may be pressed further by introducing higher pressure inside the chamber. After consolidating the resist, the substrate is separated from the mold by either direct pull-down enabled by stage movement or deforming the mold enabled by differential pressure between the mold mini-chamber and the bulk volume of the chamber, or mixing of both.
摘要:
A surface coating apparatus for preparing a work piece having a working surface for imprint lithography, wherein the work piece comprises either a mold or a substrate. The apparatus includes a vacuum chamber and a generator to produce chemical reaction radicals for cleaning the working surface. The generator may be located inside said vacuum chamber and connected to an inner surface of said vacuum chamber or external to the vacuum chamber and connected thereto via suitable couplings. A fixture within the vacuum chamber is configured to hold the work piece with the working surface accessible by the chemical reaction radicals, and a means is provided for depositing a molecular layer of surfactant on the working surface inside the vacuum chamber.
摘要:
In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction. Apparatus for effecting such separation is also described.
摘要:
In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction. Apparatus for effecting such separation is also described.
摘要:
In accordance with the invention, step-and-repeat imprint lithography is effected by applying balanced pressing forces from both sides of a substrate. The pressing forces are substantially equal in amplitude and opposite in direction. With the pressing forces thus balanced, the fixture that steps and holds the substrate does not bear the load of imprinting. The balance allows use of a high resolution aligning stage to carry the substrate and to maintain high accuracy of positioning without being shifted by change of load. With this method, sufficient imprint pressure can be used to obtain high quality patterning, a thin and uniform residual layer, and a high fidelity pattern.
摘要:
In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction. Apparatus for effecting such separation is also described.
摘要:
In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch. Surfactant vapor may be generated by liquid surface vaporization, liquid injection or spray vaporization. A surface adhesion promoter can be coated on the substrate by a similar method with the same apparatus.