公开(公告)号：US20060187675A1

公开(公告)日：2006-08-24

申请号：US10906462

申请日：2005-02-22

申请人： Wei-Yang Tseng ,  Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yu Lo

发明人： Wei-Yang Tseng ,  Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yu Lo

IPC分类号： F21V7/04

CPC分类号： G02B6/0041 ,  G02B6/0023

摘要： A light-guide plate comprising a light-guide board having a first refractive index and at least one light-guide part buried inside the light-guide board is provided. The light-guide part has a second refractive index larger than the first refractive index. The light-guide board and the light-guide part buried therein have different refractive indices so that the total reflection may occur for improving the light transmission efficiency in the light-guide plate.

摘要翻译： 提供了一种导光板，其包括具有第一折射率的导光板和掩埋在所述导光板内的至少一个导光部。 导光部具有大于第一折射率的第二折射率。 埋入其中的导光板和导光部具有不同的折射率，从而可以发生全反射以提高导光板的光传输效率。

公开(公告)号：US07406228B2

公开(公告)日：2008-07-29

申请号：US11315235

申请日：2005-12-23

申请人： Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yang Tseng ,  Wei-Yu Lo

发明人： Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yang Tseng ,  Wei-Yu Lo

IPC分类号： G02B6/26 ,  G02B6/42

CPC分类号： G02B6/0028 ,  G02B6/0021 ,  G02B6/0031

摘要： The present invention provides a backlight module for a light emitting device (LED) chip holder. The backlight module includes a top guide-light board, a bottom guide-light board, a chip holder with an inclined plane thereon, and a light emitting diode chip. One side of the top guide-light board and the bottom guide-light board has a reflective sheet, and the light emitting diode chip is located on the inclined surface of the chip holder, and further the light emitting diode chip is embedded in the bottom guide-light. When the light emitting diode chip emits incident light, the light produces the total reflection on the bottom guide-light board to reflect to the reflective mirror. Then, the light is reflected to the top guide-light board by the reflective sheet, and is emitted out from the top guide-light board to be a light source for the backlight module.

摘要翻译： 本发明提供一种用于发光器件（LED）芯片保持器的背光模块。 该背光模块包括顶部导光板，底部导光板，其上具有倾斜面的芯片保持器和发光二极管芯片。 顶部引导板和底部导光板的一侧具有反射片，并且发光二极管芯片位于芯片保持器的倾斜表面上，此外，发光二极管芯片嵌入底部 导光灯 当发光二极管芯片发射入射光时，光在底部导光板上产生全反射以反射到反射镜。 然后，通过反射片将光反射到顶部导光板，并从顶部导光板发射出来，作为用于背光模块的光源。

公开(公告)号：US20070116424A1

公开(公告)日：2007-05-24

申请号：US11315235

申请日：2005-12-23

申请人： Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yang Tseng ,  Wei-Yu Lo

发明人： Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yang Tseng ,  Wei-Yu Lo

IPC分类号： G02B6/00

CPC分类号： G02B6/0028 ,  G02B6/0021 ,  G02B6/0031

摘要： The present invention provides a backlight module for the light emitting device (LED) chip holder. The backlight module includes a top guide-light board, a bottom guide-light board, a chip holder with an inclined plane thereon, and a light emitting diode chip. The one side of the top guide-light board and the bottom guide-light board has a reflective sheet, and the light emitting diode chip located on the inclined surface of the chip holder, and further the light emitting diode chip embedded in the bottom guide-light. When the light emitting diode chip emitted incident light source, the light source produces the total reflection on the bottom guide-light board to reflect to the reflective mirror. Then, the light source is reflected to the top guide-light board by the reflective sheet, and is emitted out from the top guide-light board to be a light source for the backlight module to be a light source for the backlight module.

摘要翻译： 本发明提供了一种用于发光器件（LED）芯片保持器的背光模块。 该背光模块包括顶部导光板，底部导光板，其上具有倾斜面的芯片保持器和发光二极管芯片。 顶部引导板和底部引导板的一侧具有反射片，位于芯片保持器的倾斜表面上的发光二极管芯片，并且还包括嵌入在底部引导件中的发光二极管芯片 -光。 当发光二极管芯片发射入射光源时，光源在底部导光板上产生全反射以反射到反射镜。 然后，通过反射片将光源反射到顶部引导光板，并从顶部导光板发射为背光模块的光源，作为背光模块的光源。

公开(公告)号：US07165856B2

公开(公告)日：2007-01-23

申请号：US10906462

申请日：2005-02-22

申请人： Wei-Yang Tseng ,  Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yu Lo

发明人： Wei-Yang Tseng ,  Chu-Chi Ting ,  Tien-Lung Chiu ,  Wei-Yu Lo

IPC分类号： F21V8/00

CPC分类号： G02B6/0041 ,  G02B6/0023

摘要： A light-guide plate comprising a light-guide board having a first refractive index and at least one light-guide part buried inside the light-guide board is provided. The light-guide part has a second refractive index larger than the first refractive index. The light-guide board and the light-guide part buried therein have different refractive indices so that the total reflection may occur for improving the light transmission efficiency in the light-guide plate.

摘要翻译： 提供了一种导光板，其包括具有第一折射率的导光板和掩埋在所述导光板内的至少一个导光部。 导光部具有大于第一折射率的第二折射率。 埋入其中的导光板和导光部具有不同的折射率，从而可以发生全反射以提高导光板的光传输效率。

公开(公告)号：US07339202B2

公开(公告)日：2008-03-04

申请号：US11162724

申请日：2005-09-21

申请人： Tien-Lung Chiu ,  Wei-Yang Tseng

发明人： Tien-Lung Chiu ,  Wei-Yang Tseng

IPC分类号： H01L29/24 ,  H01L33/00

CPC分类号： H01L33/58 ,  G02B6/0025 ,  G02B6/003 ,  G02B6/0036 ,  G02B6/0055

摘要： The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging plastic body. Moreover, the plastic package body contains a light-converging part and a light-scattering part, in which the light-converging part has a first axis and the light-scattering part has a second axis. In addition, the first axis of the light-converging part intersects the second axis of the light-scattering part. Furthermore, one terminal of each of the two leading legs is electrically connected to the LED chip while another terminal extends out of the packaging plastic body. Because the LED package structure can converge light and scatter light in different directions, the backlight module implementing the LED package structure has the advantage of a shorter light-mixing distance and better light utilization.

摘要翻译： LED封装结构包括衬底，LED芯片，塑料封装主体和两个引导腿。 此外，LED芯片布置在基板上并被包装塑料体覆盖。 此外，塑料封装体包含聚光部分和光散射部分，其中聚光部分具有第一轴线并且光散射部分具有第二轴线。 另外，聚光部的第一轴与光散射部的第二轴相交。 此外，两个前导腿中的每一个的一个端子电连接到LED芯片，而另一个端子从包装塑料体延伸出来。 由于LED封装结构能够使光在不同方向上聚光并散射光，所以实现LED封装结构的背光模组具有缩短光混合距离和更好的光利用的优点。

公开(公告)号：US20070063210A1

公开(公告)日：2007-03-22

申请号：US11162724

申请日：2005-09-21

申请人： Tien-Lung Chiu ,  Wei-Yang Tseng

发明人： Tien-Lung Chiu ,  Wei-Yang Tseng

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  G02B6/0025 ,  G02B6/003 ,  G02B6/0036 ,  G02B6/0055

摘要： The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging plastic body. Moreover, the plastic package body contains a light-converging part and a light-scattering part, in which the light-converging part has a first axis and the light-scattering part has a second axis. In addition, the first axis of the light-converging part intersects the second axis of the light-scattering part. Furthermore, one terminal of each of the two leading legs is electrically connected to the LED chip while another terminal extends out of the packaging plastic body. Because the LED package structure can converge light and scatter light in different directions, the backlight module implementing the LED package structure has the advantage of a shorter light-mixing distance and better light utilization.

摘要翻译： LED封装结构包括衬底，LED芯片，塑料封装主体和两个引导腿。 此外，LED芯片布置在基板上并被包装塑料体覆盖。 此外，塑料封装体包含聚光部分和光散射部分，其中聚光部分具有第一轴线并且光散射部分具有第二轴线。 另外，聚光部的第一轴与光散射部的第二轴相交。 此外，两个前导腿中的每一个的一个端子电连接到LED芯片，而另一个端子从包装塑料体延伸出来。 由于LED封装结构能够使光在不同方向上聚光并散射光，所以实现LED封装结构的背光模组具有缩短光混合距离和更好的光利用的优点。

公开(公告)号：US20070273266A1

公开(公告)日：2007-11-29

申请号：US11441187

申请日：2006-05-26

申请人： Yu-Heng Hsieh ,  Chu-Chi Ting ,  Hsin-Chia Ho ,  Jau-Shiu Chen ,  Wei-Yang Tseng

发明人： Yu-Heng Hsieh ,  Chu-Chi Ting ,  Hsin-Chia Ho ,  Jau-Shiu Chen ,  Wei-Yang Tseng

IPC分类号： H01J63/04 ,  H01J1/62

CPC分类号： H01J65/046 ,  G02F1/133602 ,  G02F1/133605 ,  G02F2001/133614 ,  H01J61/305

摘要： A planar light source device and a manufacturing method therefor are provided. The planar light source device includes a first substrate, a second substrate disposed under the first substrate and in parallel therewith at a specific distance therefrom and having a plurality of protrusions on an upper surface thereof or a plurality of recessions on a lower surface of the second substrate. The plurality of protrusions or recessions is formed by sandblasting or etching. Between the first and second substrates, a dielectric layer, a plurality of discharging spaces, a plurality of metal electrodes, a first phosphor layer, a second phosphor layer, a plurality of ribs and a reflective layer are provided and the reflective layer is formed on upper surfaces of the protrusions or lower surfaces of the recessions.

摘要翻译： 提供一种平面光源装置及其制造方法。 平面光源装置包括第一基板和第二基板，第二基板设置在第一基板的下方并与其隔开一定距离并且在其上表面上具有多个突起，或者在第二基板的下表面上具有多个凹部 基质。 多个突起或凹陷通过喷砂或蚀刻形成。 在第一和第二基板之间设置电介质层，多个放电空间，多个金属电极，第一荧光体层，第二荧光体层，多个肋和反射层，并且反射层形成在 凹陷的突起或下表面的上表面。