公开(公告)号：US09026241B2

公开(公告)日：2015-05-05

申请号：US13404676

申请日：2012-02-24

申请人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

发明人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

IPC分类号： G06F19/00 ,  G05B9/03

CPC分类号： G05B9/03 ,  G05B23/0237 ,  G05B2219/37533 ,  G05B2219/45031

摘要： The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.

摘要翻译： 本公开涉及具有多个传感器的半导体工具监视系统，其被配置为同时且独立地监视半导体制造工具的处理条件。 在一些实施例中，所公开的工具监控系统包括被配置为监视半导体制造工具的一个或多个处理条件并基于此产生第一监视响应的第一传感器系统。 冗余的第二传感器系统被配置为同时监视制造工具的一个或多个处理条件并且基于此产生第二监视响应。 比较元件被配置为比较第一和第二监测响应，以及如果响应彼此偏离（例如，具有大于阈值的偏差）以产生警告信号。 通过比较第一和第二监测响应，可以实时检测传感器系统中的误差，从而防止产量损失。

公开(公告)号：US20130226327A1

公开(公告)日：2013-08-29

申请号：US13404676

申请日：2012-02-24

申请人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

发明人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

IPC分类号： G06F19/00 ,  G06F15/00

CPC分类号： G05B9/03 ,  G05B23/0237 ,  G05B2219/37533 ,  G05B2219/45031

摘要： The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.

摘要翻译： 本公开涉及具有多个传感器的半导体工具监视系统，其被配置为同时且独立地监视半导体制造工具的处理条件。 在一些实施例中，所公开的工具监控系统包括被配置为监视半导体制造工具的一个或多个处理条件并基于此产生第一监视响应的第一传感器系统。 冗余的第二传感器系统被配置为同时监视制造工具的一个或多个处理条件并且基于此产生第二监视响应。 比较元件被配置为比较第一和第二监测响应，以及如果响应彼此偏离（例如，具有大于阈值的偏差）以产生警告信号。 通过比较第一和第二监测响应，可以实时检测传感器系统中的误差，从而防止产量损失。

公开(公告)号：US09708706B2

公开(公告)日：2017-07-18

申请号：US13307242

申请日：2011-11-30

申请人： Chung-En Kao ,  Ming-Chin Tsai ,  You-Hua Chou ,  Chen-Chia Chiang ,  Chih-Tsung Lee ,  Ming-Shiou Kuo

发明人： Chung-En Kao ,  Ming-Chin Tsai ,  You-Hua Chou ,  Chen-Chia Chiang ,  Chih-Tsung Lee ,  Ming-Shiou Kuo

IPC分类号： C23C14/35 ,  H01J37/34

CPC分类号： C23C14/352 ,  H01J37/3405 ,  H01J37/3417

摘要： A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.

公开(公告)号：US6071831A

公开(公告)日：2000-06-06

申请号：US135042

申请日：1998-08-17

申请人： Chen-Chia Chiang ,  Chung-An Lin

发明人： Chen-Chia Chiang ,  Chung-An Lin

IPC分类号： H01L21/00 ,  H01L21/316 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01L21/67028 ,  H01L21/316 ,  Y10S438/906

摘要： A method of forming an interlevel dielectric slayer of spin-on-glass is described which avoids spiral defects from occurring in the layer of spin-on-glass. Before the spin-on-glass is deposited and with the wafer spinning at a low angular velocity a first volume of isopropyl alcohol is deposited on the wafer. The wafer continues to spin at the low angular velocity for a short time. With the wafer continuing to spin at the low angular velocity a second volume, less than the first volume, of spin-on-glass is deposited on the wafer. The wafer continues to spin at the low angular velocity for a short time and then is spun at a high angular velocity for a longer time. The wafer is then removed from the apparatus used to deposit the spin-on-glass and processing of the wafer continues. Spiral defects in the layer of spin-on-glass are avoided.

摘要翻译： 描述了一种形成旋涂玻璃的层间电介质绝缘体的方法，其避免了在旋涂玻璃层中发生螺旋缺陷。 在沉积旋涂玻璃之前，并且晶片以低角速度旋转，将第一体积的异丙醇沉积在晶片上。 晶片以低角速度继续旋转短时间。 随着晶片以低角速度继续旋转，小于旋转玻璃的第一体积的第二体积沉积在晶片上。 晶片以低角速度继续旋转短时间，然后以高角速度旋转更长时间。 然后从用于沉积旋涂玻璃的装置中取出晶片，继续处理晶片。 避免旋涂玻璃层中的螺旋缺陷。