Electrical characterization of interferometric modulators
    2.
    发明授权
    Electrical characterization of interferometric modulators 失效
    干涉式调制器的电气特性

    公开(公告)号:US07289256B2

    公开(公告)日:2007-10-30

    申请号:US11097511

    申请日:2005-04-01

    IPC分类号: G02B26/00

    摘要: Disclosed herein are methods and systems for testing the electrical characteristics of reflective displays, including interferometric modulator displays. In one embodiment, a controlled voltage is applied to conductive leads in the display and the resulting current is measured. The voltage may be controlled so as to ensure that interferometric modulators do not actuate during the resistance measurements. Also disclosed are methods for conditioning interferometric modulator display by applying a voltage waveform that causes actuation of interferometric modulators in the display.

    摘要翻译: 本文公开了用于测试反射显示器的电气特性的方法和系统,包括干涉式调制器显示器。 在一个实施例中,将受控电压施加到显示器中的导电引线,并且测量所得到的电流。 可以控制电压以确保在电阻测量期间干涉式调制器不起动。 还公开了通过施加使显示器中的干涉式调制器致动的电压波形来调节干涉式调制器显示的方法。

    Method and system for packaging MEMS devices with glass seal
    3.
    发明授权
    Method and system for packaging MEMS devices with glass seal 有权
    用于封装具有玻璃密封的MEMS器件的方法和系统

    公开(公告)号:US08735225B2

    公开(公告)日:2014-05-27

    申请号:US12415986

    申请日:2009-03-31

    IPC分类号: H01L23/31

    摘要: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    摘要翻译: 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
    7.
    发明申请
    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER 审中-公开
    用于包装具有并发卡特的MEMS器件的方法和系统

    公开(公告)号:US20110290552A1

    公开(公告)日:2011-12-01

    申请号:US13208218

    申请日:2011-08-11

    IPC分类号: H01L23/28 B29C65/54

    摘要: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    摘要翻译: 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
    8.
    发明申请
    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER 有权
    用于包装具有并发卡特的MEMS器件的方法和系统

    公开(公告)号:US20090189230A1

    公开(公告)日:2009-07-30

    申请号:US12415986

    申请日:2009-03-31

    IPC分类号: H01L23/31 H01L29/84 H01L21/56

    摘要: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    摘要翻译: 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    ELECTRICAL CHARACTERIZATION OF INTERFEROMETRIC MODULATORS
    9.
    发明申请
    ELECTRICAL CHARACTERIZATION OF INTERFEROMETRIC MODULATORS 失效
    干涉仪调制器的电气特性

    公开(公告)号:US20100321761A1

    公开(公告)日:2010-12-23

    申请号:US12869494

    申请日:2010-08-26

    IPC分类号: G02B26/00

    摘要: Disclosed herein are methods and systems for testing the electrical characteristics of reflective displays, including interferometric modulator displays. In one embodiment, a controlled voltage is applied to conductive leads in the display and the resulting current is measured. The voltage may be controlled so as to ensure that interferometric modulators do not actuate during the resistance measurements. Also disclosed are methods for conditioning interferometric modulator display by applying a voltage waveform that causes actuation of interferometric modulators in the display.

    摘要翻译: 本文公开了用于测试反射显示器的电气特性的方法和系统,包括干涉式调制器显示器。 在一个实施例中,将受控电压施加到显示器中的导电引线,并且测量所得到的电流。 可以控制电压以确保在电阻测量期间干涉式调制器不起动。 还公开了通过施加使显示器中的干涉式调制器致动的电压波形来调节干涉式调制器显示的方法。