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    Functional and stress testing of LGA devices
    4.
    发明授权
    Functional and stress testing of LGA devices 失效
    LGA器件的功能和压力测试

    公开(公告)号：US07479796B2

    公开(公告)日：2009-01-20

    申请号：US11747202

    申请日：2007-05-10

    申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

    发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891

    摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

    摘要翻译： 公开了用于测试LGA设备的改进的方法，系统和设备。 一个示例性实施例包括测试嵌套组件冷却线的垂直布线，以便最小化测试嵌套足迹并增加单个测试卡上的可用测试位置。 另一示例性实施例包括将外部负载和力矩隔离并调整到散热器/冷板中，其中这些负载和力矩涉及控制质心以恢复散热片/芯片接口的更理想的热性能。 另一个示例性实施例包括便于LGA插座的简单且低成本替换的嵌套架构。 最后，另一示例性实施例包括通过使用干式空气排气对测试巢组件部件进行有效的冷凝控制。

    Functional and stress testing of LGA devices
    6.
    发明授权
    Functional and stress testing of LGA devices 失效
    LGA器件的功能和压力测试

    公开(公告)号：US07423440B2

    公开(公告)日：2008-09-09

    申请号：US11747207

    申请日：2007-05-10

    申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

    发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891

    摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

    摘要翻译： 公开了用于测试LGA设备的改进的方法，系统和设备。 一个示例性实施例包括测试嵌套组件冷却线的垂直布线，以便最小化测试嵌套足迹并增加单个测试卡上的可用测试位置。 另一示例性实施例包括将外部负载和力矩隔离并调整到散热器/冷板中，其中这些负载和力矩涉及控制质心以恢复散热片/芯片接口的更理想的热性能。 另一个示例性实施例包括便于LGA插座的简单且低成本替换的嵌套架构。 最后，另一示例性实施例包括通过使用干式空气排气对测试巢组件部件进行有效的冷凝控制。

    Common heatsink for multiple chips and modules
    8.
    发明授权
    Common heatsink for multiple chips and modules 有权
    多个芯片和模块的通用散热器

    公开(公告)号：US06661661B2

    公开(公告)日：2003-12-09

    申请号：US10040779

    申请日：2002-01-07

    申请人： Michael A. Gaynes ,  Howard Victor Mahaney, Jr. ,  Mark V. Pierson

    发明人： Michael A. Gaynes ,  Howard Victor Mahaney, Jr. ,  Mark V. Pierson

    IPC分类号： H05K720

    CPC分类号： H01L23/3675 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  Y10T29/4935

    摘要： A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.

    摘要翻译： 用于在电子封装上间隔开的多个芯片和模块的共同散热器，以及用于在由公共散热器覆盖的两个或更多个芯片或模块之间形成精密间隙的装置。 此外，精密工具使得能够为用于电子封装的多个芯片和模块的公共散热器定位，便于在多个芯片和共用散热器之间形成x，y和z方向兼容的热接口，并具有最小化的封装公差的影响。

    High density heatsink attachment and method therefor
    10.
    发明授权
    High density heatsink attachment and method therefor 失效
    高密度散热器附件及其方法

    公开(公告)号：US06180874B2

    公开(公告)日：2001-01-30

    申请号：US09097891

    申请日：1998-06-15

    申请人： Johnny Roy Brezina ,  John Saunders Corbin, Jr. ,  Howard Victor Mahaney, Jr. ,  James Robert Taylor

    发明人： Johnny Roy Brezina ,  John Saunders Corbin, Jr. ,  Howard Victor Mahaney, Jr. ,  James Robert Taylor

    IPC分类号： H01L2326

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.

    摘要翻译： 将不同散热器的阵列安装到紧密堆叠的处理器阵列，高速缓存控制器设备以及在数据处理系统内使用的任何其他类型的数据处理元件的装置和方法。 该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。 金属框架具有允许访问下面的数据处理元件的顶部的多个孔。 金属框架用作用于多个散热器的容纳车辆，并且还提供刚性，其特征在于在设备附接到印刷电路板的拐角特别脆弱的附近的印刷电路板。