Microcantilever heater-thermometer with integrated temperature-compensated strain sensor
    1.
    发明授权
    Microcantilever heater-thermometer with integrated temperature-compensated strain sensor 有权
    具有集成温度补偿应变传感器的Microcantilever加热器 - 温度计

    公开(公告)号:US07928343B2

    公开(公告)日:2011-04-19

    申请号:US11950029

    申请日:2007-12-04

    CPC分类号: G01B7/18 G01N5/04

    摘要: The present invention provides microcantilever hotplate devices which incorporate temperature compensating strain sensors. The microcantilever hotplate devices of the present invention comprise microcantilevers having temperature compensating strain sensors and resistive heaters. The present invention also provides methods for using a microcantilever hotplate for temperature compensated surface stress measurements, chemical/biochemical sensing, measuring various properties of compounds adhered to the microcantilever hotplate surface, or for temperature compensated deflection measurements.

    摘要翻译: 本发明提供了包括温度补偿应变传感器的微型悬臂式电热板装置。 本发明的微悬臂加热板装置包括具有温度补偿应变传感器和电阻加热器的微悬臂梁。 本发明还提供了使用微悬臂加热板进行温度补偿表面应力测量,化学/生物化学检测,测量粘附到微悬臂梁热板表面的化合物的各种性质或用于温度补偿偏转测量的方法。

    Microcantilever Heater-Thermometer With Integrated Temperature-Compensated Strain Sensor
    2.
    发明申请
    Microcantilever Heater-Thermometer With Integrated Temperature-Compensated Strain Sensor 有权
    具有集成温度补偿应变传感器的Microcantilever加热器 - 温度计

    公开(公告)号:US20090139340A1

    公开(公告)日:2009-06-04

    申请号:US11950029

    申请日:2007-12-04

    IPC分类号: G01L1/22 H05B3/68

    CPC分类号: G01B7/18 G01N5/04

    摘要: The present invention provides microcantilever hotplate devices which incorporate temperature compensating strain sensors. The microcantilever hotplate devices of the present invention comprise microcantilevers having temperature compensating strain sensors and resistive heaters. The present invention also provides methods for using a microcantilever hotplate for temperature compensated surface stress measurements, chemical/biochemical sensing, measuring various properties of compounds adhered to the microcantilever hotplate surface, or for temperature compensated deflection measurements.

    摘要翻译: 本发明提供了包括温度补偿应变传感器的微型悬臂式电热板装置。 本发明的微悬臂加热板装置包括具有温度补偿应变传感器和电阻加热器的微悬臂梁。 本发明还提供了使用微悬臂加热板进行温度补偿表面应力测量,化学/生物化学检测,测量粘附到微悬臂梁热板表面的化合物的各种性质或用于温度补偿偏转测量的方法。

    Device for Calorimetric Measurement
    3.
    发明申请
    Device for Calorimetric Measurement 有权
    用于量热测量的装置

    公开(公告)号:US20110268148A1

    公开(公告)日:2011-11-03

    申请号:US13059812

    申请日:2009-08-20

    IPC分类号: G01K17/00

    摘要: In one aspect, provided herein is a single crystal silicon microcalorimeter, for example useful for high temperature operation and long-term stability of calorimetric measurements. Microcalorimeters described herein include microcalorimeter embodiments having a suspended structure and comprising single crystal silicon. Also provided herein are methods for making calorimetric measurements, for example, on small quantities of materials or for determining the energy content of combustible material having an unknown composition.

    摘要翻译: 在一个方面,本文提供了单晶硅微量热计,例如用于高温操作和量热测量的长期稳定性。 本文所述的微量计是包括具有悬浮结构并包含单晶硅的微量热计实施方案。 本文还提供了用于进行量热测量的方法,例如在少量材料上或用于确定具有未知组成的可燃材料的能量含量。

    Device for calorimetric measurement
    4.
    发明授权
    Device for calorimetric measurement 有权
    用于量热测量的装置

    公开(公告)号:US08931950B2

    公开(公告)日:2015-01-13

    申请号:US13059812

    申请日:2009-08-20

    IPC分类号: G01K17/00 G01N25/22 G01N25/48

    摘要: In one aspect, provided herein is a single crystal silicon microcalorimeter, for example useful for high temperature operation and long-term stability of calorimetric measurements. Microcalorimeters described herein include microcalorimeter embodiments having a suspended structure and comprising single crystal silicon. Also provided herein are methods for making calorimetric measurements, for example, on small quantities of materials or for determining the energy content of combustible material having an unknown composition.

    摘要翻译: 在一个方面,本文提供了单晶硅微量热计,例如用于高温操作和量热测量的长期稳定性。 本文所述的微量计是包括具有悬浮结构并包含单晶硅的微量热计实施方案。 本文还提供了用于进行量热测量的方法,例如在少量材料上或用于确定具有未知组成的可燃材料的能量含量。

    Apparatuses for bonding semiconductor chips

    公开(公告)号:US09704732B2

    公开(公告)日:2017-07-11

    申请号:US13599548

    申请日:2012-08-30

    摘要: An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.