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1.发明授权Apparatus and method for measuring buoyant mass and deformability of single cells 有权用于测量单个电池的浮力质量和变形能力的装置和方法公开(公告)号：US08635911B2
公开(公告)日：2014-01-28
申请号：US13096248
申请日：2011-04-28
申请人： Sungmin Son , Sangwon Byun , Andrea Kristine Bryan , Thomas Burg , Amneet Gulati , Jungchul Lee , Scott Manalis , Yao-Chung Weng
发明人： Sungmin Son , Sangwon Byun , Andrea Kristine Bryan , Thomas Burg , Amneet Gulati , Jungchul Lee , Scott Manalis , Yao-Chung Weng
CPC分类号： G01N15/1056 , G01N2015/1043 , G01N2015/105
摘要： Method for determining buoyant mass and deformability of a cell. The method includes introducing the cell into a suspended microchannel resonator that includes a constriction near a distal location in the resonator. A first frequency shift in the resonator is monitored as a cell moves to the distal location in the resonator, the first frequency shift being related to the buoyant mass of the cell. Transit time of the cell through the constriction is measured by monitoring a second frequency shift as a result of a change in cell location as it passes through the constriction, whereby deformability is determined from the measured buoyant mass and transit time.
摘要翻译： 确定电池的浮力质量和变形能力的方法。 该方法包括将细胞引入悬浮的微通道谐振器，其包括在谐振器中的远端位置附近的收缩部。 当单元移动到谐振器中的远端位置时，监测谐振器中的第一频移，第一频移与单元的浮力质量相关。 通过收缩通过监测细胞位置的变化的结果，通过监测第二频移来测量细胞通过收缩的转运时间，从而根据所测量的浮力质量和通过时间确定变形能力。
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公开(公告)号：US20110268148A1
公开(公告)日：2011-11-03
申请号：US13059812
申请日：2009-08-20
申请人： William P. King , Jungchul Lee
发明人： William P. King , Jungchul Lee
IPC分类号： G01K17/00
CPC分类号： G01K17/006 , G01N25/4813 , Y10S977/902
摘要： In one aspect, provided herein is a single crystal silicon microcalorimeter, for example useful for high temperature operation and long-term stability of calorimetric measurements. Microcalorimeters described herein include microcalorimeter embodiments having a suspended structure and comprising single crystal silicon. Also provided herein are methods for making calorimetric measurements, for example, on small quantities of materials or for determining the energy content of combustible material having an unknown composition.
摘要翻译： 在一个方面，本文提供了单晶硅微量热计，例如用于高温操作和量热测量的长期稳定性。 本文所述的微量计是包括具有悬浮结构并包含单晶硅的微量热计实施方案。 本文还提供了用于进行量热测量的方法，例如在少量材料上或用于确定具有未知组成的可燃材料的能量含量。
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3.发明授权Microcantilever heater-thermometer with integrated temperature-compensated strain sensor 有权具有集成温度补偿应变传感器的Microcantilever加热器 - 温度计公开(公告)号：US07928343B2
公开(公告)日：2011-04-19
申请号：US11950029
申请日：2007-12-04
摘要： The present invention provides microcantilever hotplate devices which incorporate temperature compensating strain sensors. The microcantilever hotplate devices of the present invention comprise microcantilevers having temperature compensating strain sensors and resistive heaters. The present invention also provides methods for using a microcantilever hotplate for temperature compensated surface stress measurements, chemical/biochemical sensing, measuring various properties of compounds adhered to the microcantilever hotplate surface, or for temperature compensated deflection measurements.
摘要翻译： 本发明提供了包括温度补偿应变传感器的微型悬臂式电热板装置。 本发明的微悬臂加热板装置包括具有温度补偿应变传感器和电阻加热器的微悬臂梁。 本发明还提供了使用微悬臂加热板进行温度补偿表面应力测量，化学/生物化学检测，测量粘附到微悬臂梁热板表面的化合物的各种性质或用于温度补偿偏转测量的方法。
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4.发明申请Microcantilever Heater-Thermometer With Integrated Temperature-Compensated Strain Sensor 有权具有集成温度补偿应变传感器的Microcantilever加热器 - 温度计公开(公告)号：US20090139340A1
公开(公告)日：2009-06-04
申请号：US11950029
申请日：2007-12-04
摘要： The present invention provides microcantilever hotplate devices which incorporate temperature compensating strain sensors. The microcantilever hotplate devices of the present invention comprise microcantilevers having temperature compensating strain sensors and resistive heaters. The present invention also provides methods for using a microcantilever hotplate for temperature compensated surface stress measurements, chemical/biochemical sensing, measuring various properties of compounds adhered to the microcantilever hotplate surface, or for temperature compensated deflection measurements.
摘要翻译： 本发明提供了包括温度补偿应变传感器的微型悬臂式电热板装置。 本发明的微悬臂加热板装置包括具有温度补偿应变传感器和电阻加热器的微悬臂梁。 本发明还提供了使用微悬臂加热板进行温度补偿表面应力测量，化学/生物化学检测，测量粘附到微悬臂梁热板表面的化合物的各种性质或用于温度补偿偏转测量的方法。
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公开(公告)号：US09704732B2
公开(公告)日：2017-07-11
申请号：US13599548
申请日：2012-08-30
申请人： Yisung Hwang , Jungchul Lee , Jaehong Kim , Taegyeong Chung
发明人： Yisung Hwang , Jungchul Lee , Jaehong Kim , Taegyeong Chung
CPC分类号： H01L21/67144 , H01L2924/0002 , Y10T156/1744 , Y10T156/1746 , Y10T156/1761 , Y10T156/1776 , H01L2924/00
摘要： An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.
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6.发明申请APPARATUS AND METHOD FOR MEASURING BUOYANT MASS AND DEFORMABILITY OF SINGLE CELLS 有权测量单体质量和单细胞不可逆性的装置和方法公开(公告)号：US20120118063A1
公开(公告)日：2012-05-17
申请号：US13096248
申请日：2011-04-28
申请人： Sungmin Son , Sangwon Byun , Andrea Kristine Bryan , Thomas Burg , Amneet Gulati , Jungchul Lee , Scott Manalis , Yao-Chung Weng
发明人： Sungmin Son , Sangwon Byun , Andrea Kristine Bryan , Thomas Burg , Amneet Gulati , Jungchul Lee , Scott Manalis , Yao-Chung Weng
IPC分类号： G01H13/00
CPC分类号： G01N15/1056 , G01N2015/1043 , G01N2015/105
摘要： Method for determining buoyant mass and deformability of a cell. The method includes introducing the cell into a suspended microchannel resonator that includes a constriction near a distal location in the resonator. A first frequency shift in the resonator is monitored as a cell moves to the distal location in the resonator, the first frequency shift being related to the buoyant mass of the cell. Transit time of the cell through the constriction is measured by monitoring a second frequency shift as a result of a change in cell location as it passes through the constriction, whereby deformability is determined from the measured buoyant mass and transit time.
摘要翻译： 确定电池的浮力质量和变形能力的方法。 该方法包括将细胞引入悬浮的微通道谐振器，其包括在谐振器中的远端位置附近的收缩部。 当单元移动到谐振器中的远端位置时，监测谐振器中的第一频移，第一频移与单元的浮力质量相关。 通过收缩通过监测细胞位置的变化的结果，通过监测第二频移来测量细胞通过收缩的转运时间，从而根据所测量的浮力质量和通过时间确定变形能力。
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公开(公告)号：US08931950B2
公开(公告)日：2015-01-13
申请号：US13059812
申请日：2009-08-20
申请人： William P. King , Jungchul Lee
发明人： William P. King , Jungchul Lee
CPC分类号： G01K17/006 , G01N25/4813 , Y10S977/902
摘要： In one aspect, provided herein is a single crystal silicon microcalorimeter, for example useful for high temperature operation and long-term stability of calorimetric measurements. Microcalorimeters described herein include microcalorimeter embodiments having a suspended structure and comprising single crystal silicon. Also provided herein are methods for making calorimetric measurements, for example, on small quantities of materials or for determining the energy content of combustible material having an unknown composition.
摘要翻译： 在一个方面，本文提供了单晶硅微量热计，例如用于高温操作和量热测量的长期稳定性。 本文所述的微量计是包括具有悬浮结构并包含单晶硅的微量热计实施方案。 本文还提供了用于进行量热测量的方法，例如在少量材料上或用于确定具有未知组成的可燃材料的能量含量。
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公开(公告)号：US20130160952A1
公开(公告)日：2013-06-27
申请号：US13599548
申请日：2012-08-30
申请人： Yisung HWANG , Jungchul LEE , Jaehong KIM , Taegyeong CHUNG
发明人： Yisung HWANG , Jungchul LEE , Jaehong KIM , Taegyeong CHUNG
IPC分类号： H01L21/46
CPC分类号： H01L21/67144 , H01L2924/0002 , Y10T156/1744 , Y10T156/1746 , Y10T156/1761 , Y10T156/1776 , H01L2924/00
摘要： An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.
摘要翻译： 用于接合半导体芯片的装置可以包括被配置为传送基板的传送轨道，被配置为将基板装载到传送轨道上的装载部件，被配置为从传送轨道卸载基板的卸载部件;第一晶片供给单元，被配置为提供第一晶片 包括半导体芯片和/或被配置为将半导体芯片接合到基板的接合单元。 一种用于接合半导体芯片的设备可以包括：传送轨道，其被配置为传送基板，被配置为将基板装载到传送轨道上的装载部件，被配置为从传送轨道卸载基板的卸载部件;在传送轨道侧的缓冲部件 被配置为临时接收由所述加载部件加载的基板，被配置为提供包括半导体芯片的第一晶片的第一晶片供给单元和/或被配置为将所述半导体芯片接合到所述基板的接合单元。
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