公开(公告)号：US08435808B2

公开(公告)日：2013-05-07

申请号：US13281079

申请日：2011-10-25

申请人： Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

发明人： Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

摘要翻译： 提供一种制造发光二极管（LED）封装的方法。 该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接 所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔 将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。

公开(公告)号：US20120126267A1

公开(公告)日：2012-05-24

申请号：US13281079

申请日：2011-10-25

申请人： Won Ho JUNG ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

发明人： Won Ho JUNG ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

IPC分类号： H01L33/58 ,  H01L33/52

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

摘要翻译： 提供一种制造发光二极管（LED）封装的方法。 该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接 所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔 将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。

公开(公告)号：US08847270B2

公开(公告)日：2014-09-30

申请号：US13327189

申请日：2011-12-15

申请人： Hun Yong Park ,  Seong Deok Hwang ,  Won Ho Jung

发明人： Hun Yong Park ,  Seong Deok Hwang ,  Won Ho Jung

IPC分类号： H01L33/58 ,  H01L33/60 ,  H01L33/48

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014

摘要： A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.

摘要翻译： 提供了一种发光二极管（LED）封装。 LED封装包括LED，与LED电连接的多个引线框架，封装体，其具有暴露以容纳LED的接收槽，并且包括多个支撑单元，所述支撑单元设置成从接收槽的内侧表面突出 以及填充构件，其具有在其侧表面的圆周处与所述支撑单元接合并且包括在所述接收槽内部的接合槽。

公开(公告)号：US08632218B2

公开(公告)日：2014-01-21

申请号：US13227948

申请日：2011-09-08

申请人： Hun Yong Park ,  Byung Man Kim

发明人： Hun Yong Park ,  Byung Man Kim

IPC分类号： F21S8/00

CPC分类号： F21V17/02 ,  F21K9/20 ,  F21K9/69 ,  F21V5/04 ,  F21V5/045 ,  F21V14/06 ,  F21V17/12 ,  F21V29/504 ,  F21V29/507 ,  F21Y2115/10

摘要： A lighting device is provided. The lighting device includes: a light source module mounted on a substrate; a lens unit provided on the light source module and including an accommodating groove accommodating the light source module; a housing unit accommodating the lens unit therein to protect the lens unit from an outside; a supporting unit fixed to the substrate and including a coupling hole having the housing unit coupled thereto to thereby support the housing unit; and a height adjustment unit allowing the housing unit to be vertically-movably coupled to the supporting unit and adjusting a height of the lens unit such that the height of the lens unit is varied.

摘要翻译： 提供照明装置。 照明装置包括：安装在基板上的光源模块; 透镜单元，设置在所述光源模块上并且包括容纳所述光源模块的容纳槽; 将透镜单元容纳在其中以将透镜单元从外部保护的壳体单元; 支撑单元，其固定到所述基板并且包括联接孔，所述联接孔具有联接到其上的所述壳体单元，从而支撑所述壳体单元; 以及高度调节单元，其允许所述壳体单元可垂直移动地联接到所述支撑单元并且调节所述透镜单元的高度，使得所述透镜单元的高度变化。