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公开(公告)号：US20240047635A1
公开(公告)日：2024-02-08
申请号：US18489880
申请日：2023-10-19
发明人： GANG MA
CPC分类号： H01L33/62 , H01L25/167 , H01L24/32 , H01L24/29 , H01L24/16 , H01L24/13 , H01L24/05 , H01L2224/05073 , H01L2224/05573 , H01L2224/13111 , H01L2224/13109 , H01L2224/29111 , H01L2224/29109 , H01L2924/014 , H01L2224/16145 , H01L2224/32145 , H01L2924/12041 , H01L2924/1426 , H01L24/11 , H01L24/27 , H01L2224/2745 , H01L2224/1145 , H01L24/81 , H01L24/83 , H01L2224/81815 , H01L2224/83815
摘要： A light-emitting device used for a display panel includes: a light-emitting element and a solder gradient layer, the light-emitting element includes a light-emitting epitaxial layer and a pad layer formed on the light-emitting epitaxial layer, the solder gradient layer is disposed on the pad layer, and a melting point of the solder gradient layer gradually decreases in a direction facing away from the pad layer. In a process of soldering the light-emitting device to a backplate, because there are multiple melting point regions or metal layers with different melting points in the solder gradient layer, a temperature of primary soldering is controlled to be higher than that of repair soldering in the processes of the primary soldering and the repair soldering, which can avoid an influence of the repair soldering on a solder joint formed during the primary soldering, and effectively control a yield of soldering.
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公开(公告)号：US20240355993A1
公开(公告)日：2024-10-24
申请号：US18759835
申请日：2024-06-29
发明人： GANG MA
CPC分类号： H01L33/644 , H01L33/005 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0075
摘要： A light-emitting device includes: a substrate that includes a first surface and a second surface and defines a through via; a light-emitting element disposed on the first surface of the substrate and disposed corresponding to the through via in the substrate; and a heat-conducting structure filled with the through via in the substrate. Moreover, an end of the heat-conducting structure extends from the through via to be tightly attached to the light-emitting element, and another end of the heat-conducting structure extends from the through via to be flush with the second surface of the substrate or to cover the second surface of the substrate. Therefore, the light-emitting device can conduct heat, generated during the light-emitting element works, by means of the heat-conducting structure disposed in the substrate below the light-emitting element, so that the heat dissipation efficiency of the light-emitting device is improved.
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