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公开(公告)号：US20240355976A1
公开(公告)日：2024-10-24
申请号：US18572838
申请日：2022-01-07
发明人： Yong FAN
IPC分类号： H01L33/60 , H01L25/075
CPC分类号： H01L33/60 , H01L25/0753 , H01L2933/0058
摘要： Some embodiments of the present application provide a display unit including: a substrate; a light-emitting device disposed on the substrate; a reflective barrier layer arranged on the substrate. The reflective barrier layer is provided with a light exit hole arranged correspondingly to the light-emitting device. A first projection is defined by an orthographic projection of the light exit hole in a plane vertical to a light-emitting surface of the light-emitting device, and an angle included between a contour line of the first projection corresponding to a side of a peripheral wall of the light exit hole is different from another angle included between another contour line of the first projection corresponding to an opposite side of the peripheral wall of the light exit hole.
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公开(公告)号：US20240047635A1
公开(公告)日：2024-02-08
申请号：US18489880
申请日：2023-10-19
发明人： GANG MA
CPC分类号： H01L33/62 , H01L25/167 , H01L24/32 , H01L24/29 , H01L24/16 , H01L24/13 , H01L24/05 , H01L2224/05073 , H01L2224/05573 , H01L2224/13111 , H01L2224/13109 , H01L2224/29111 , H01L2224/29109 , H01L2924/014 , H01L2224/16145 , H01L2224/32145 , H01L2924/12041 , H01L2924/1426 , H01L24/11 , H01L24/27 , H01L2224/2745 , H01L2224/1145 , H01L24/81 , H01L24/83 , H01L2224/81815 , H01L2224/83815
摘要： A light-emitting device used for a display panel includes: a light-emitting element and a solder gradient layer, the light-emitting element includes a light-emitting epitaxial layer and a pad layer formed on the light-emitting epitaxial layer, the solder gradient layer is disposed on the pad layer, and a melting point of the solder gradient layer gradually decreases in a direction facing away from the pad layer. In a process of soldering the light-emitting device to a backplate, because there are multiple melting point regions or metal layers with different melting points in the solder gradient layer, a temperature of primary soldering is controlled to be higher than that of repair soldering in the processes of the primary soldering and the repair soldering, which can avoid an influence of the repair soldering on a solder joint formed during the primary soldering, and effectively control a yield of soldering.
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公开(公告)号：US20240130195A1
公开(公告)日：2024-04-18
申请号：US18398436
申请日：2023-12-28
发明人： YONG FAN
CPC分类号： H10K59/70 , H10K59/1201
摘要： A laminated light-emitting unit includes a first light-emitting component including a top surface, a bottom surface opposite to the top surface and multiple side surfaces disposed between the top surface and the bottom surface, a second light-emitting component laminated on the top surface of the first light-emitting component, a common electrode disposed on a first side surface of the multiple side surfaces, connected to negative electrodes of the first light-emitting component and the second light-emitting component and extending to the bottom surface of the first light-emitting component, a second electrode disposed on a second side surface of the multiple side surfaces, the first side surface and the second side surface are different side surfaces, the second electrode is electrically connected to a positive electrode of the second light-emitting component and insulated from the first light-emitting component, and the second electrode extends to the bottom surface of the first light-emitting component.
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公开(公告)号：US20230411578A1
公开(公告)日：2023-12-21
申请号：US18114939
申请日：2023-02-27
发明人： Gang MA
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L2933/0066
摘要： A micro-electronic component, a bonding backplate and a bonding assembly are provided. The micro-electronic component includes: a micro-electronic element; a first bonding pad disposed on the micro-electronic element; a first solder layer disposed on a side of the first bonding pad facing away from the micro-electronic element; and a second bonding pad disposed on a side of the first solder layer facing away from the first bonding pad. The micro-electronic component, the bonding backplate and the bonding assembly can achieve a secondary welding bonding at a bonded position in the welding bonding process of the electronic component.
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公开(公告)号：US20230387357A1
公开(公告)日：2023-11-30
申请号：US18114284
申请日：2023-02-27
发明人： Gang MA
IPC分类号： H01L33/48 , H01L25/075 , H01L33/62 , H01L33/38
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/382
摘要： A display panel, and light-emitting elements and a backplate used for display panels are provided. The backplate is provided thereon a first pad and a second pad serving as a repair pad. The first pad includes a first adhesive layer and a first bonding layer. The second pad includes a second adhesive layer and a second bonding layer. Each of the first and second bonding layers is a multi-layer structure including multiple single-metal layers. A bonding temperature of the first bonding layer is higher than that of the second bonding layer. The multiple single-metal layers are formed on both first and second pads by evaporation, so that a purity of each single-metal layer is ensured, facilitating alloys with different melting points are formed subsequently. When the second pad is heated to solder a LED chip for repairing, a first alloy on the first pad cannot be melted.
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公开(公告)号：US20240178353A1
公开(公告)日：2024-05-30
申请号：US18436050
申请日：2024-02-08
发明人： Gang MA , Chen-Ke HSU
IPC分类号： H01L33/54 , H01L25/075 , H01L33/10 , H01L33/58
CPC分类号： H01L33/54 , H01L25/0753 , H01L33/10 , H01L33/58 , H01L2933/005 , H01L2933/0058
摘要： The present application provides a display panel and a manufacturing method thereof. The display panel includes: a driving substrate, a plurality of chips, a dielectric layer, and a plurality of encapsulating colloids. Each of the plurality of chips and each of the plurality of encapsulating colloids are correspondingly arranged, and the encapsulating colloid covers the chip. The dielectric layer is disposed on outer peripheries of the encapsulating colloids. The encapsulating colloid includes a substrate and a curved lens connected to each other, the substrate covers the chip, and the curved lens is disposed on a side of the substrate away from the chip.
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公开(公告)号：US20240128244A1
公开(公告)日：2024-04-18
申请号：US18392121
申请日：2023-12-21
发明人： CHEN-KE HSU , XIANGWEI XIE , TUNG-KAI LIU
IPC分类号： H01L25/075 , H01L33/22
CPC分类号： H01L25/0753 , H01L33/22
摘要： A micro-LED chip includes an epitaxial structure, which includes first and second doped type semiconductor layers and an active layer disposed between the first and second doped type semiconductor layers; a light-emitting side of the first doped type semiconductor layer facing away from the active layer is provided with a patterned structure; and an elongated edge a of the micro-LED chip, a thickness b of the micro-LED chip, and a peak-valley height difference c of the patterned structure satisfy: 0.01≤b/a≤6, and 0.01≤c/b≤0.3. By designing a structure size and/or a shape of the micro-LED chip combined with designing the peak-valley height difference of the patterned structure to satisfy the condition of 0.01≤c/b≤0.3, power of laser lift-off operation can be reduced and a process window thereof is enlarged, and light extraction efficiency of the micro-LED chip is achieved. And a display device using the micro-LED chip is provided.
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公开(公告)号：US20240120327A1
公开(公告)日：2024-04-11
申请号：US18391852
申请日：2023-12-21
发明人： XIANGWEI XIE
CPC分类号： H01L25/167 , H01L33/62 , H01L2933/0066
摘要： A solid-state light-emitting device and a production method thereof, and a display device are provided. The solid-state light-emitting device includes multiple light-emitting components sequentially stacked in a vertical direction and connected in series to form a stacked light-emitting structure. Each light-emitting component includes a first electrode, a second electrode, a first semiconductor layer, a source layer and a second semiconductor layer, and the first semiconductor layer, the source layer and the second semiconductor layer are sequentially stacked between the first electrode and the second electrode in the vertical direction. In addition, the first electrode of one of every adjacent two light-emitting components is bonded to the second electrode of the other of the adjacent two light-emitting components in the vertical direction to form an electrical connection.
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公开(公告)号：US20230223384A1
公开(公告)日：2023-07-13
申请号：US18098340
申请日：2023-01-18
发明人： CHEN-KE HSU , Sujuan ZHANG
IPC分类号： H01L25/075 , H01L33/58
CPC分类号： H01L25/0753 , H01L33/58
摘要： Provided are an LED pixel unit, a display panel and a display screen. The LED pixel unit includes: micro-LEDs, arranged on a circumferential line with a point A as a center and R as a radius; the micro-LEDs are provided with light-emitting surfaces with a same orientation, emitting lights of the micro-LEDs are capable of rotating around a preset axis by a predetermined angle and then coinciding with each other, and the preset axis passes through the point A and is perpendicular to a plane where the circumferential line is located; and an optical component, arranged to face toward the light-emitting surfaces of the micro-LEDs and have a preset distance with respect to the light-emitting surfaces, and the optical component is configured to receive the emitting lights, and enable the emitting lights to emit from the optical component at a preset light-emitting angle.
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公开(公告)号：US20240145651A1
公开(公告)日：2024-05-02
申请号：US18410550
申请日：2024-01-11
发明人： TUNG-KAI LIU , CHEN-KE HSU
CPC分类号： H01L33/58 , H01L25/167 , H01L33/502
摘要： A display device and a display are provided. The display device includes: a drive substrate including a drive circuit, a light-emitting device array, a micro-optical structure, and a color conversion layer array. The light-emitting device array is disposed on a surface of the drive substrate and includes multiple light-emitting devices electrically connected to the drive circuit, and light emitted by the multiple light-emitting devices is light with a same color. The micro-optical structure is disposed above the light-emitting device array and used to refract the light emitted by the light-emitting device array to a uniform refraction angle. The color conversion layer array is disposed above the micro-optical structure, the multiple light-emitting devices respectively correspond to multiple color conversion layers in the color conversion layer array, and the color conversion layer array is used to convert the light emitted by the multiple light-emitting devices into light with a required color.
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