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公开(公告)号：US20080113643A1
公开(公告)日：2008-05-15
申请号：US11938126
申请日：2007-11-09
CPC分类号： H04L25/0266 , H01P5/10 , H03D7/1433 , H03D7/1441 , H03D7/1458 , H03D2200/0023 , H03H7/09 , H03H7/42 , H04L25/0274 , H04L25/0276
摘要： A circuit features a balun having an unbalanced input and a balanced output, and a differential coupler having a symmetrical structure about a center axis. The differential coupler has a differential input and a differential output, the differential input being coupled to the balanced output of the balun. An impedance element is coupled to a circuit node of the differential coupler at a point along the center axis. Other embodiments are also described and claimed.
摘要翻译： 电路的特征在于具有不平衡输入和平衡输出的平衡 - 不平衡变换器，以及具有关于中心轴线的对称结构的差速耦合器。 差分耦合器具有差分输入和差分输出，差分输入耦合到平衡 - 不平衡变换器的平衡输出。 阻抗元件在沿着中心轴的点处耦合到差分耦合器的电路节点。 还描述和要求保护其他实施例。
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公开(公告)号：US08170522B2
公开(公告)日：2012-05-01
申请号：US11938126
申请日：2007-11-09
IPC分类号： H04B1/26
CPC分类号： H04L25/0266 , H01P5/10 , H03D7/1433 , H03D7/1441 , H03D7/1458 , H03D2200/0023 , H03H7/09 , H03H7/42 , H04L25/0274 , H04L25/0276
摘要： A circuit features a balun having an unbalanced input and a balanced output, and a differential coupler having a symmetrical structure about a center axis. The differential coupler has a differential input and a differential output, the differential input being coupled to the balanced output of the balun. An impedance element is coupled to a circuit node of the differential coupler at a point along the center axis. Other embodiments are also described and claimed.
摘要翻译： 电路的特征在于具有不平衡输入和平衡输出的平衡 - 不平衡变换器，以及具有关于中心轴线的对称结构的差速耦合器。 差分耦合器具有差分输入和差分输出，差分输入耦合到平衡 - 不平衡变换器的平衡输出。 阻抗元件在沿着中心轴的点处耦合到差分耦合器的电路节点。 还描述和要求保护其他实施例。
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公开(公告)号：US07675465B2
公开(公告)日：2010-03-09
申请号：US11752083
申请日：2007-05-22
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15321 , H01Q1/2283 , H01Q21/0087 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.
摘要翻译： 公开了一种集成电路（IC）封装。 IC封装包括具有顶层，中层和底层的衬底，嵌入在衬底的顶层上的毫米波天线的阵列和安装在衬底的底层上的单片微波集成电路（MMIC）。 在一个实施例中，用于表面安装在印刷电路板（PCB）上的第二级互连件设置在衬底的底层上。
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公开(公告)号：US20080290959A1
公开(公告)日：2008-11-27
申请号：US11752073
申请日：2007-05-22
IPC分类号： H03H7/38
CPC分类号： H01L23/66 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A millimeter-wave integrated circuit (IC) package is disclosed. The package includes a substrate having a plurality of layers and a vertical interconnection. The vertical interconnection comprises a shielded transition between the plurality of layers and a compensation structure to minimize the parasitic effect of the transition.
摘要翻译： 公开了一种毫米波集成电路（IC）封装。 该封装包括具有多个层和垂直互连的衬底。 垂直互连包括在多个层之间的屏蔽转变以及使过渡的寄生效应最小化的补偿结构。
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公开(公告)号：US20080291115A1
公开(公告)日：2008-11-27
申请号：US11752083
申请日：2007-05-22
IPC分类号： H01Q21/00
CPC分类号： H01Q1/38 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15321 , H01Q1/2283 , H01Q21/0087 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.
摘要翻译： 公开了一种集成电路（IC）封装。 IC封装包括具有顶层，中层和底层的衬底，嵌入在衬底的顶层上的毫米波天线的阵列和安装在衬底的底层上的单片微波集成电路（MMIC）。 在一个实施例中，用于表面安装在印刷电路板（PCB）上的第二级互连件设置在衬底的底层上。
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公开(公告)号：US20080112101A1
公开(公告)日：2008-05-15
申请号：US11939726
申请日：2007-11-14
CPC分类号： H01L27/0251 , H04L25/0266
摘要： An integrated circuit chip has on-chip millimeter wave (mmW) circuitry. An on-chip electro static discharge, ESD, protection network couples a signal pad of the chip to the mmW circuitry. The ESD protection network has a shorted stub being a low impedance path to ground for ESD events. Other embodiments are also described and claimed.
摘要翻译： 集成电路芯片具有片上毫米波（mmW）电路。 片上静电放电，ESD保护网络将芯片的信号焊盘连接到mmW电路。 ESD保护网络具有短路短路，是ESD事件的低阻抗接地路径。 还描述和要求保护其他实施例。
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