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公开(公告)号：US20080290959A1
公开(公告)日：2008-11-27
申请号：US11752073
申请日：2007-05-22
IPC分类号： H03H7/38
CPC分类号： H01L23/66 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A millimeter-wave integrated circuit (IC) package is disclosed. The package includes a substrate having a plurality of layers and a vertical interconnection. The vertical interconnection comprises a shielded transition between the plurality of layers and a compensation structure to minimize the parasitic effect of the transition.
摘要翻译： 公开了一种毫米波集成电路（IC）封装。 该封装包括具有多个层和垂直互连的衬底。 垂直互连包括在多个层之间的屏蔽转变以及使过渡的寄生效应最小化的补偿结构。
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公开(公告)号：US07675465B2
公开(公告)日：2010-03-09
申请号：US11752083
申请日：2007-05-22
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15321 , H01Q1/2283 , H01Q21/0087 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.
摘要翻译： 公开了一种集成电路（IC）封装。 IC封装包括具有顶层，中层和底层的衬底，嵌入在衬底的顶层上的毫米波天线的阵列和安装在衬底的底层上的单片微波集成电路（MMIC）。 在一个实施例中，用于表面安装在印刷电路板（PCB）上的第二级互连件设置在衬底的底层上。
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公开(公告)号：US20080291115A1
公开(公告)日：2008-11-27
申请号：US11752083
申请日：2007-05-22
IPC分类号： H01Q21/00
CPC分类号： H01Q1/38 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15321 , H01Q1/2283 , H01Q21/0087 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.
摘要翻译： 公开了一种集成电路（IC）封装。 IC封装包括具有顶层，中层和底层的衬底，嵌入在衬底的顶层上的毫米波天线的阵列和安装在衬底的底层上的单片微波集成电路（MMIC）。 在一个实施例中，用于表面安装在印刷电路板（PCB）上的第二级互连件设置在衬底的底层上。
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4.发明申请APPARATUS, SYSTEM, AND METHOD FOR A COMPACT SYMMETRICAL TRANSITION STRUCTURE FOR RADIO FREQUENCY APPLICATIONS 有权用于无线电频率应用的紧凑对称转换结构的装置，系统和方法公开(公告)号：US20110285474A1
公开(公告)日：2011-11-24
申请号：US13113318
申请日：2011-05-23
申请人： Mohammed Ershad Ali
发明人： Mohammed Ershad Ali
IPC分类号： H01P5/02
CPC分类号： H01P5/10
摘要： Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL).
摘要翻译： 这里描述的是具有用于RF应用的紧凑对称过渡结构的装置，系统和方法。 该装置包括：第一和第二接地层，每个具有相应的截头边缘，第一和第二接地平面彼此平行并由多层基板隔开; 位于第一和第二接地平面之间的带状线; 以及对称的过渡结构，其耦合到带状线以及在它们各自的截头边缘附近的第一和第二接地平面，并且还耦合到宽侧耦合线（BCL）。
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5.发明授权公开(公告)号：US07508823B2
公开(公告)日：2009-03-24
申请号：US10837338
申请日：2004-04-30
申请人： Mohammed Ershad Ali
发明人： Mohammed Ershad Ali
CPC分类号： H04L12/42 , Y10T307/74
摘要： A high-speed multiple channel and line selector switch allows the simultaneous selection of the two lines of a differential channel and permits the simultaneous selection of multiple channels by introduction of the appropriate high speed pad connectivity.
摘要翻译： 高速多通道和线选择开关允许同时选择差分通道的两条线路，并允许通过引入适当的高速焊盘连接来同时选择多个通道。
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公开(公告)号：US06933628B2
公开(公告)日：2005-08-23
申请号：US10627317
申请日：2003-07-24
申请人： Mohammed Ershad Ali
发明人： Mohammed Ershad Ali
IPC分类号： H01H19/00 , G01R31/28 , G01R31/319 , H01H9/54 , H01H19/02 , H01H19/54 , H04B17/00 , H01H19/58 , H04L1/12 , H04L12/50
CPC分类号： H04B17/0082 , G01R31/31905 , G01R31/31912 , Y10T307/74
摘要： An embodiment in accordance with the invention recites a high speed channel selector switch. The high speed channel selector switch includes a first unit that has a plurality of contacts that are operable to electrically couple to a plurality of high speed data lines of a device under test. The first unit also has an additional contact operable to electrically couple to a signal line. The high speed channel selector switch further includes a second unit that is operable to selectively electrically couple one of the plurality of contacts of the first unit to the additional contact of the first unit. The second unit also electrically couples the remaining contacts of the first unit to respective termination impedances. Thus, one of the plurality of high speed data lines is coupled to the signal line via the second unit and the remaining high speed data lines are coupled to respective termination impedances.
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7.发明授权Apparatus, system, and method for a compact symmetrical transition structure for radio frequency applications 有权用于射频应用的紧凑对称过渡结构的装置，系统和方法公开(公告)号：US08963656B2
公开(公告)日：2015-02-24
申请号：US13113318
申请日：2011-05-23
申请人： Mohammed Ershad Ali
发明人： Mohammed Ershad Ali
IPC分类号： H01P5/10
CPC分类号： H01P5/10
摘要： Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL).
摘要翻译： 这里描述的是具有用于RF应用的紧凑对称过渡结构的装置，系统和方法。 该装置包括：第一和第二接地层，每个具有相应的截头边缘，第一和第二接地平面彼此平行并由多层基板隔开; 位于第一和第二接地平面之间的带状线; 以及对称的过渡结构，其耦合到带状线以及在它们各自的截头边缘附近的第一和第二接地平面，并且还耦合到宽侧耦合线（BCL）。
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8.发明授权Via placement for layer transitions in flexible circuits with high density ball grid arrays 有权通过用于具有高密度球栅阵列的柔性电路中的层过渡的放置公开(公告)号：US07223924B2
公开(公告)日：2007-05-29
申请号：US10669982
申请日：2003-09-23
CPC分类号： H01L24/49 , H01L23/49838 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2223/6627 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/4943 , H01L2224/85207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/1903 , H05K1/0237 , H05K1/113 , H05K1/189 , H05K2201/09381 , H05K2201/10674 , H05K2203/049 , H01L2924/00014 , H01L2924/00
摘要： A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads. The flexible circuit also includes vias disposed proximate the first type of electrical connection pads and extended through the ground plane to provide for electrically coupling the first transmission line and the second transmission line, such that the vias reduce discontinuity in the ground plane and aggregate discontinuity in the flex circuit.
摘要翻译： 具有通孔的柔性电路，其设置成使分离相对传输线的接地平面中的不连续性最小化。 柔性电路包括耦合到第一表面的第一传输线，耦合到第二相对表面的第二传输线和分离第一传输线和第二传输线的接地平面。 柔性电路还包括设置在第一表面上并电耦合到第一传输线的第一类型的电连接焊盘。 柔性电路还包括设置在第二表面上的第二类型的电连接焊盘，并且电耦合到第二传输线，其中第二类型的电连接焊盘具有比第一类型的电连接焊盘更高的面密度。 柔性电路还包括设置在第一类型的电连接焊盘附近并延伸穿过接地平面以提供电耦合第一传输线和第二传输线的通孔，使得通孔减小接地平面中的不连续性并且聚集不连续性 柔性电路。
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公开(公告)号：US07065113B2
公开(公告)日：2006-06-20
申请号：US10136928
申请日：2002-04-30
CPC分类号： H01S5/02248 , H01S5/02276 , H01S5/024 , H01S5/4025
摘要： A driver IC and EML array are electrically coupled to one another via a flexible PCB. Thermal isolation between the driver IC and EML array is adjusted by varying a cross-section and length of electrically-conductive traces on the PCB.
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