摘要:
The present invention provides a self-driving circuit of a low voltage, large current, and high power density DC/DC converter. The converter comprises a transformer, power MOS transistors (S), output rectification portion (SRb 1, SR2), filter portion and demagnetizing portion. The first configuration of the self-driving circuit consists of Da, Ra, Ca, Qa for self-driving SR2; and the second configuration consists of Da, Ra, Sa, a delay driving circuit and an isolation differential circuit, for self-driving SR2. The self-driving circuit of the present invention may reduce the cross-conductive loss, and increase the converting efficiency.
摘要:
The present invention provides a self-driving circuit for DC/DC converter of a low voltage, high current, and high power density. The converter comprises a transformer, output rectification portion SR1 and voltage clamping. The first configuration of the self-driving circuit consists of resisters Ra1, Ra2, capacitors Ca1, Ca2, transistors Qa1, Qa2; and the second configuration consists of Da, small power MOS transistor SRa, an auxiliary winding Nsa, a delay driving circuit and a isolating differential circuit. The self-driving circuit of the present invention may reduce the cross-conductive loss, and increase the converting efficiency.
摘要:
An improved approach for implementing metal fill on an electrical device without causing creating cross-coupling capacitance problems is disclosed. Timing aware metal fill insertion is performed to avoid or minimize cross-capacitance problems on the IC design. A cost may be assigned to different candidate metal fill shapes. The cost is associated with the expected effect upon timing requirements by the metal fill shape, with lower costs corresponding to lower expected impacts upon the timing requirements. To meet density requirements, lower cost metal fill shapes are inserted prior to higher cost metal fill shapes.
摘要:
Disclosed is an improved method and system for implementing metal fill for an integrated circuit design. When an engineering change order is implemented, the existing dummy metal fill geometries are initially ignored when modifying the layout, even if this results in shorts and/or other DRC violations. Once the ECO changes have been implemented, those violations caused by interaction between the changes and the metal fill are repaired afterwards.
摘要:
Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.
摘要:
A method is provided to evaluate substrate noise propagation in an integrated circuit design, the method comprising: providing a tile definition that specifies an electrical model associated with instances of the tile; mapping a plurality of respective tile instances to respective locations of the substrate; obtaining respective waveforms indicative of digital switching induced power grid fluctuations associated with the respective identified contacts; and associating a voltage with a selected tile instance of the tile grid that is indicative of substrate noise injection due to waveforms associated with contacts encompassed by the selected tile instance.
摘要:
Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.
摘要:
An improved method, system, and article of manufacture for reducing via failures is described. In one approach, additional vias or via cuts are inserted into an IC device to increase the number of cuts in a given area. The additional vias or via cuts are inserted until a sufficient via density level has been reached.
摘要:
A step up converter with overcurrent protection is disclosed. The step up converter can precisely limit the output current of the upstream device. Current from the input terminal of the converter is detected and compared with a predetermined maximum current to get a comparison value which is delivered to a close-loop regulator. The overcurrent protection is achieved by the regulator outputting a control signal to fulfill the conduction or resistance increase of a resistive element of the protection circuit. Furthermore, detection of the temperature or the output voltage may trigger shut off of the protection circuit to implement a protection function.
摘要:
A method is provided to evaluate substrate noise propagation in an integrated circuit design, the method comprising: providing a tile definition that specifies an electrical model associated with instances of the tile; mapping a plurality of respective tile instances to respective locations of the substrate; obtaining respective waveforms indicative of digital switching induced power grid fluctuations associated with the respective identified contacts; and associating a voltage with a selected tile instance of the tile grid that is indicative of substrate noise injection due to waveforms associated with contacts encompassed by the selected tile instance.