公开(公告)号：US20110312134A1

公开(公告)日：2011-12-22

申请号：US13220763

申请日：2011-08-30

申请人： YUICHI MACHIDA

发明人： YUICHI MACHIDA

IPC分类号： H01L21/60

CPC分类号： H01L24/33 ,  H01L21/4842 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/05556 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2224/838 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.

摘要翻译： 提高了半导体器件的可靠性。 将第一引线框架，第一半导体芯片，第二引线框架和第二半导体芯片依次堆叠在组装夹具上，并且进行焊料回流处理以进行组装。 此后，该组件被夹在第一和第二模具之间以形成封装树脂部分。 第二模具的上表面设置有台阶。 在模制步骤中，第二引线框架在高于第一引线框架的位置处被夹持在第一和第二管芯之间; 并且第三引线框架在较高位置处夹在第一和第二管芯之间。 组装夹具在与第二模具的上表面相对应的位置处设置有与第二模具的上表中的步骤相同位置的步骤。

公开(公告)号：US20120002276A1

公开(公告)日：2012-01-05

申请号：US13159588

申请日：2011-06-14

申请人： FUMIYASU SUZUKI ,  YU HIRONO ,  YUICHI MACHIDA

发明人： FUMIYASU SUZUKI ,  YU HIRONO ,  YUICHI MACHIDA

IPC分类号： G02B21/26

CPC分类号： G02B21/34 ,  G02B21/24 ,  G02B21/26

摘要： Disclosed herein is a stage system, including: a stage on which to mount a slide glass; a projection block projected more than the thickness of the slide glass to the side of that surface of the stage on which to dispose the slide glass; and a pressing block which is provided on that surface of the stage on which to dispose the slide glass, is thicker than the slide glass, and presses toward the projection block the slide glass disposed between itself and the projection block.

摘要翻译： 本文公开了一种舞台系统，包括：安装载玻片的舞台; 投影块比投影载玻片的台面的该表面侧的投影量大于载玻片的厚度; 并且设置在其上设置载玻片的台的表面上的按压块比载玻片厚，并且朝向突出块压入设置在其自身与突出块之间的载玻片。