Method and apparatus for removing native oxide layers from silicon wafers
    1.
    发明授权
    Method and apparatus for removing native oxide layers from silicon wafers 失效
    从硅晶片去除天然氧化物层的方法和装置

    公开(公告)号:US06395192B1

    公开(公告)日:2002-05-28

    申请号:US09318608

    申请日:1999-05-26

    IPC分类号: B44C122

    摘要: A method and apparatus for selectively removing a native oxide layer from a silicon wafer without significantly affecting the underlying silicon or other materials that may be thereon, by exposing the silicon wafer to an etchant gas including NF3 while simultaneously exposing the wafer to ultraviolet radiation, and heating the wafer to a temperature of 100-400° C.

    摘要翻译: 一种用于通过将硅晶片暴露于包括NF3的蚀刻剂气体同时将晶片暴露于紫外线辐射而将硅晶片暴露于紫外线辐射的同时,从硅晶片上选择性地去除天然氧化物层而不显着影响下面的硅或其上可能存在的其它材料的方法和装置,以及 将晶片加热至100-400℃的温度