摘要:
A method and apparatus for selectively removing a native oxide layer from a silicon wafer without significantly affecting the underlying silicon or other materials that may be thereon, by exposing the silicon wafer to an etchant gas including NF3 while simultaneously exposing the wafer to ultraviolet radiation, and heating the wafer to a temperature of 100-400° C.
摘要:
A method for improving CdZnTe-based gamma-ray detectors is presented. A CdZnTe detector/crystal is exposed to acoustic waves. After exposure to acoustic waves, the CdZnTe gamma-detector gains higher resistivity and exhibits better spectral resolution and greater sensitivity. Further, when a batch of detectors is made according to the method of the present invention, the properties of the crystals are more homogenous, allowing for cheaper and more standardized detectors.
摘要:
A Cd1-xZnxS film material, with a high value of thermal coefficient of resistance, in the range of 1.5% to 3.7%. The Cd1-xZnxS material has excellent characteristics for use in a microbolometer-type uncooled infrared sensor. The film material can be deposited on microbolometer membranes or any other wafer for different applications. The film material can be deposited using the MOCVD technique, thermal evaporation or a different technique to form the film material over the wafer. The Cd1-xZnxS properties can be modified controlling certain deposition parameters and different annealing techniques. The process is performed at temperature compatible with CMOS technology.
摘要翻译:具有高电阻热系数的Cd 1-x Zn Zn x S膜材料在1.5%至3.7%的范围内。 Cd 1-x Zn Zn x S材料具有优异的特性用于微测辐射热计型非冷却红外传感器。 薄膜材料可以沉积在微热辐射计膜或任何其他晶片上以用于不同的应用。 可以使用MOCVD技术,热蒸发或不同的技术沉积膜材料以在晶片上形成薄膜材料。 可以修改Cd 1-x Zn Zn x S性质,以控制某些沉积参数和不同的退火技术。 该过程在与CMOS技术兼容的温度下进行。
摘要:
A Cd1-xZnxS film material, with a high value of thermal coefficient of resistance, in the range of 1.5% to 3.7%. The Cd1-xZnxS material has excellent characteristics for use in a microbolometer-type uncooled infrared sensor. The film material can be deposited on microbolometer membranes or any other wafer for different applications. The film material can be deposited using the MOCVD technique, thermal evaporation or a different technique to form the film material over the wafer. The Cd1-xZnxS properties can be modified controlling certain deposition parameters and different annealing techniques. The process is performed at temperature compatible with CMOS technology.