公开(公告)号：US5231339A

公开(公告)日：1993-07-27

申请号：US670728

申请日：1991-03-18

申请人： Yasuharu Kishimoto ,  Sadao Asaba ,  Kenichi Nakata ,  Shigeo Kawatsu

发明人： Yasuharu Kishimoto ,  Sadao Asaba ,  Kenichi Nakata ,  Shigeo Kawatsu

IPC分类号： H02P27/06 ,  B60L9/18 ,  H02P23/08

CPC分类号： B60L9/18 ,  B60L15/2081 ,  H02P23/08 ,  B60L2200/26 ,  B60L2220/12 ,  Y02T10/644 ,  Y02T10/645 ,  Y02T10/7275

摘要： In a slip frequency control system hitherto widely employed as a control system for an induction motor type electric rolling stock (in which a slip frequency is determined from a current deviation, an inverter frequency is calculated from the slip frequency and a motor rotation frequency, and the inverter frequency is multiplied by a predetermined correction factor to determine a modulation rate, thereby operating an inverter), a motor output torque decreases in a low speed region. It is difficult to make the correction for this decrease of torque by detecting the torque. In the present invention made considering that a torque curve and sin .phi. (.phi.: the internal impedance angle of a motor) obtained from the result of simulation resemble each other, the decrease of sin .phi. is regarded as being the decrease of torque and a voltage to frequency ratio is corrected so as to compensate for the decrease of sin .phi..

摘要翻译： 在迄今为止广泛用作感应电动机型电动车辆的控制系统的滑差频率控制系统中（其中滑差频率根据电流偏差确定，根据转差频率和电动机转速频率计算变频器频率， 逆变器频率乘以预定的校正因子以确定调制速率，从而操作逆变器），电动机输出转矩在低速区域中减小。 通过检测转矩，难以进行扭矩减小的校正。 在本发明中，考虑到从仿真结果得到的转矩曲线和sinφ（phi：电动机的内部阻抗角）彼此相似，本发明中，将sin phi的减小视为转矩的降低和电压 对频率比进行校正，以补偿sin phi的减少。

公开(公告)号：US5401155A

公开(公告)日：1995-03-28

申请号：US41241

申请日：1993-04-01

申请人： Motokiyo Shikagawa ,  Shigeo Kawatsu

发明人： Motokiyo Shikagawa ,  Shigeo Kawatsu

IPC分类号： B29C33/12 ,  B29C33/00 ,  B29C33/44 ,  B29C45/02 ,  B29C45/14 ,  B29C45/26 ,  B29C45/33 ,  B29C45/40 ,  B29L31/34 ,  H01L21/56 ,  H01L33/54 ,  H01L33/62 ,  H01S5/022

CPC分类号： H01L21/565 ,  B29C33/005 ,  B29C33/44 ,  B29C45/14655 ,  B29C45/40 ,  H01S5/02244 ,  B29K2995/0026 ,  B29L2031/778 ,  H01L2924/0002 ,  H01L33/52 ,  H01S5/02228

摘要： Disclosure is a metal mold for forming a transparent-resin-sealed semiconductor element which, when the molding is removed from it with knock-out pins, will not rub the molding mirror surface of the light transmitting window of the resin package, thus permitting the removal of the molding with the molding mirror surface maintained as it is. In the metal mold for a transparent-resin-sealed semiconductor element which is formed by sealing a semiconductor photo-electric element mounted on a lead frame in a rectangular-parallelepiped-shaped transparent resin package having a light transmitting window on its front end, the cavity surface of the upper die (a cavity block) which corresponds to the light transmitting window has a draft angle .theta. and the surfaces of cavity blocks between which the lead frame is held are perpendicular to the cavity surface, so that, when the molding is released from the metal mold with a knock-out pin, the surface of the light transmitting window is prevented from being rubbed by the metal mold.

摘要翻译： 公开的是一种用于形成透明树脂密封的半导体元件的金属模具，当将模制件从脱模销上移除时，其不会摩擦树脂封装的透光窗的成型反射镜表面，因此允许 用模制反光镜表面原样保持成型件的去除。 在通过将安装在引线框架上的半导体光电元件密封在其前端具有透光窗的矩形平行六面体形透明树脂封装形成的透明树脂密封半导体元件用金属模中， 对应于透光窗的上模具（空腔模块）的空腔表面具有拔模角θ，并且引线框架保持在其间的空腔块的表面垂直于空腔表面，使得当模制件 用金属模具从金属模具释放出来，防止透光窗的表面被金属模具摩擦。