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公开(公告)号:US20110169791A1
公开(公告)日:2011-07-14
申请号:US13119966
申请日:2009-06-19
申请人: Yasuhiro Hida , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yukio Shimizu
发明人: Yasuhiro Hida , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yukio Shimizu
CPC分类号: G02F1/13452 , G02F1/1345 , H05K1/147
摘要: In a liquid crystal display device (10), stabilizing capacitors (61), bypass capacitors (62) and boosting capacitors (63), which would conventionally be mounted on an FPC board (50), are disposed along long and short input sides of an LSI chip (40) mounted on a projection (20a) of a glass substrate (20) and the capacitors are connected to their respective input terminals of the LSI chip (40) via capacitor traces (71). This makes it possible to narrow the FPC board (50) connected to the liquid crystal display device (10), thereby achieving size reduction of the liquid crystal display device (10) while achieving reduction in manufacturing cost, including processing and material cost of the FPC board (50).
摘要翻译: 在液晶显示装置(10)中,通常安装在FPC基板(50)上的稳定电容器(61),旁路电容器(62)和升压电容器(63) 安装在玻璃基板(20)的突起(20a)上的LSI芯片(40)和电容器经由电容器迹线(71)与LSI芯片(40)的各自的输入端子连接。 由此,能够使与液晶显示装置(10)连接的FPC基板(50)变窄,从而实现液晶显示装置(10)的小型化,同时实现制造成本的降低,包括处理和材料成本 FPC板(50)。
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公开(公告)号:US08450753B2
公开(公告)日:2013-05-28
申请号:US13063983
申请日:2009-06-02
申请人: Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
发明人: Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
IPC分类号: H01L29/18
CPC分类号: H05K3/323 , G02F1/13452 , H01L2224/73204 , H01L2924/07811 , H05K1/0231 , H05K3/284 , H05K3/361 , H05K2201/0379 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
摘要翻译: 液晶显示装置(100)具有安装有LSI芯片(130)的玻璃基板(110)和FPC基板(140)。 使用由单片制成的部件ACF(150a),以进一步将诸如稳定电容器(150)的分立电子部件安装在玻璃基板(110)上。 部件ACF(150a)的尺寸不仅覆盖要安装分立电子部件的区域,而且覆盖首先安装的LSI芯片(130)和FPC基板(140)的顶表面。 通过这样使用大分量ACF(150a),消除了将部件ACF(150a)粘附到玻璃基板(110)上的位置约束,减小了安装分立电子部件的区域的面积。 由此,提供了通过减小安装有分立电子部件的区域的面积而小型化的板模块。
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公开(公告)号:US20110169022A1
公开(公告)日:2011-07-14
申请号:US13063983
申请日:2009-06-02
申请人: Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
发明人: Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
IPC分类号: H01L23/488 , H01L33/62 , H01L21/60
CPC分类号: H05K3/323 , G02F1/13452 , H01L2224/73204 , H01L2924/07811 , H05K1/0231 , H05K3/284 , H05K3/361 , H05K2201/0379 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
摘要翻译: 液晶显示装置(100)具有安装有LSI芯片(130)的玻璃基板(110)和FPC基板(140)。 使用由单片制成的部件ACF(150a),以进一步将诸如稳定电容器(150)的分立电子部件安装在玻璃基板(110)上。 部件ACF(150a)的尺寸不仅覆盖要安装分立电子部件的区域,而且覆盖首先安装的LSI芯片(130)和FPC基板(140)的顶表面。 通过这样使用大分量ACF(150a),消除了将部件ACF(150a)粘附到玻璃基板(110)上的位置约束,减小了安装分立电子部件的区域的面积。 由此,提供了通过减小安装有分立电子部件的区域的面积而小型化的板模块。
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公开(公告)号:US20110169792A1
公开(公告)日:2011-07-14
申请号:US13119967
申请日:2009-06-15
申请人: Yukio Shimizu , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yasuhiro Hida
发明人: Yukio Shimizu , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yasuhiro Hida
CPC分类号: G02F1/1345 , G02F1/1309 , G09G3/006 , G09G3/3611 , G09G2300/0426 , G09G2330/06 , H05K1/0215 , H05K1/0268 , H05K1/147 , H05K2201/10363 , H05K2201/10636 , Y02P70/611
摘要: The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel (10) has a configuration in which jumper resistors (60a) to (60f) are provided in an overhanging portion (20a) of a glass substrate (20) to ground test terminals, which eliminates the need to ground the test terminals on an FPC board (50). Thus, wiring lines and connection terminals which are connected to the test terminals, respectively, and the numbers of which are equal to the number of the test terminals do not need to be provided on the FPC board (50), reducing the width of the FPC board (50). Thus, the material cost of the FPC board (50) is reduced, and a process performed when mounting the FPC board (50) on the glass substrate (20) is simplified, reducing mounting cost.
摘要翻译: 本发明提供一种显示面板,其中,在不设置与液晶面板的测试端子的数量相对应的连接端子的情况下,在诸如FPC基板的电路板上获得小型化,同时降低诸如 执行电路板的安装成本和材料成本,并且执行稳定的操作。 液晶面板(10)具有将玻璃基板(20)的突出部(20a)中的跳线电阻(60a〜60f)设置为接地试验端子的结构,无需将测试 FPC基板(50)上的端子。 因此,不需要在FPC基板(50)上设置与测试端子分别连接的数量等于测试端子的数量的布线和连接端子,从而减小 FPC板(50)。 因此,FPC板(50)的材料成本降低,并且将FPC基板(50)安装在玻璃基板(20)上时的处理简化,降低了安装成本。
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公开(公告)号:US09207477B2
公开(公告)日:2015-12-08
申请号:US14113886
申请日:2012-04-23
申请人: Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
发明人: Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
IPC分类号: G02F1/1333 , G02F1/1345 , F21V8/00
CPC分类号: G02F1/133308 , G02B6/0001 , G02F1/1333 , G02F1/13336 , G02F1/13452
摘要: A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
摘要翻译: 本发明的显示模块1包括第一板3,第二板4,基膜5和电路构件2.第一板3和第二板4彼此接合在一起。 基膜5设置在第一基板3和第二基板4之间,并且从第一基板3的端部向外延伸。基膜5具有绝缘性,延伸部弯曲到 第一板3和第二板4.电路构件2形成在基膜5上。
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公开(公告)号:US20140092338A1
公开(公告)日:2014-04-03
申请号:US14113886
申请日:2012-04-23
申请人: Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
发明人: Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
IPC分类号: G02F1/1333 , F21V8/00
CPC分类号: G02F1/133308 , G02B6/0001 , G02F1/1333 , G02F1/13336 , G02F1/13452
摘要: A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
摘要翻译: 本发明的显示模块1包括第一板3,第二板4,基膜5和电路构件2.第一板3和第二板4彼此接合在一起。 基膜5设置在第一基板3和第二基板4之间,并且从第一基板3的端部向外延伸。基膜5具有绝缘性,延伸部弯曲到 第一板3和第二板4.电路构件2形成在基膜5上。
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公开(公告)号:US08421979B2
公开(公告)日:2013-04-16
申请号:US13003790
申请日:2009-05-21
申请人: Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
发明人: Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
IPC分类号: G02F1/1345
CPC分类号: G02F1/13452
摘要: A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).
摘要翻译: 包括用于驱动显示区域(41)的电路的驱动IC芯片(21)安装在面板基板(11)上。 在面板基板(11)和驱动IC芯片(21)之间插入各向异性导电膜(31),并将驱动IC芯片(21)的凸块电极(22)与电极焊盘(27)电连接 面板基板(11)。 各向异性导电膜(31)被布置成延伸超过驱动IC芯片(21)的一个特定侧表面(21a)以外的所有侧表面(21b至21d)。
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公开(公告)号:US20110122337A1
公开(公告)日:2011-05-26
申请号:US13003790
申请日:2009-05-21
申请人: Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
发明人: Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
IPC分类号: G02F1/1335 , G02F1/1345
CPC分类号: G02F1/13452
摘要: A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).
摘要翻译: 包括用于驱动显示区域(41)的电路的驱动IC芯片(21)安装在面板基板(11)上。 在面板基板(11)和驱动IC芯片(21)之间插入各向异性导电膜(31),并将驱动IC芯片(21)的凸块电极(22)与电极焊盘(27)电连接 面板基板(11)。 各向异性导电膜(31)被布置成延伸超过驱动IC芯片(21)的一个特定侧表面(21a)以外的所有侧表面(21b至21d)。
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公开(公告)号:US06312324B1
公开(公告)日:2001-11-06
申请号:US09077024
申请日:1998-05-27
申请人: Kosuke Mitsui , Toshio Fukunishi , Kazunori Kadomura , Yukio Shimizu , Yoshio Kouta , Masaaki Yamanaka , Akio Hara
发明人: Kosuke Mitsui , Toshio Fukunishi , Kazunori Kadomura , Yukio Shimizu , Yoshio Kouta , Masaaki Yamanaka , Akio Hara
IPC分类号: B24D300
摘要: A superabrasive tool such as a superabrasive grindstone (101; 102), a superabrasive dresser (103; 104; 105) or a superabrasive lap surface plate (106) includes a base (20) of steel and a superabrasive layer (10) formed on the base (20). The superabrasive layer (10) includes superabrasive grains (11) consisting of diamond grains, cubic boron nitride grains or the like and a holding layer consisting of a nickel plating layer (16) and a bond layer (17), or a brazing filler metal layer (18), holding the superabrasive grains (11) and fixing the same onto the base (20). Grooves (12) or holes (14) are formed on flat surfaces (19) of the superabrasive grains (11) exposed from the holding layer (16, 17; 18). The holding layer (16, 17; 18) holding and fixing the superabrasive grains (11) so that the surfaces of the grains are partially exposed is formed on the base (20). The grooves (12) or the holes (14) are formed by irradiating the surfaces of the superabrasive grains (11) exposed from the holding layer (16, 17; 18) with a laser beam (50). Working of high accuracy can be performed by forming the grooves (12) or the holes (14) on the surfaces of the superabrasive grains (11).
摘要翻译: 超研磨工具,例如超研磨磨石(101; 102),超研磨修整器(103; 104; 105)或超级磨料搭接表面板(106),包括钢的基部(20)和形成在 基座(20)。 超级磨料层(10)包括由金刚石晶粒,立方氮化硼晶粒等构成的超磨料颗粒(11)和由镀镍层(16)和接合层(17)组成的保持层,或钎料 层(18),保持超磨料颗粒(11)并将其固定到基底(20)上。 在从保持层(16,17; 18)露出的超级磨料颗粒(11)的平坦表面(19)上形成槽(12)或孔(14)。 保持层(16,17; 18)在基体(20)上形成有保持和固定超磨料颗粒(11)以使颗粒的表面部分露出的部分。 通过用激光束(50)照射从保持层(16,17; 18)暴露的超级磨料颗粒(11)的表面,形成凹槽(12)或孔(14)。 可以通过在超级磨料颗粒(11)的表面上形成凹槽(12)或孔(14)来实现高精度的工作。
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公开(公告)号:US5685442A
公开(公告)日:1997-11-11
申请号:US426737
申请日:1995-04-21
申请人: Shuji Yoshino , Seiji Hirano , Yukio Shimizu
发明人: Shuji Yoshino , Seiji Hirano , Yukio Shimizu
摘要: A package containers rack frame for storing, transferring and displaying relative light-weight packages. The rack frame is constructed of a pair of side frames and a plurality of support bases which are removable from the side frames. The support bases are engaged into sockets on the side frame without disassembling of the side frames. The side frames have folding elements that are for controlling the distance between the side frames, which are folding and/or unfolding. The frame members of side frames has an adjusting member for adjusting the distance between the side frames, which thereby permits use of different width or height dimension for the containers. The support base has upward curved projections at both ends thereof for restricting in lateral movement of the containers.
摘要翻译: 用于存储,传输和显示相对轻质包装的包装容器架架。 机架框架由一对侧框架和可从侧框架移除的多个支撑底座构成。 支撑基座接合在侧框架上的插座中,而不会拆卸侧框架。 侧框架具有用于控制侧框架之间的距离的折叠元件,所述侧框架是折叠和/或展开的。 侧框的框架构件具有用于调节侧框架之间的距离的调节构件,从而允许对容器使用不同的宽度或高度尺寸。 支撑基座的两端具有向上弯曲的突起,用于限制容器的横向移动。
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