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公开(公告)号：US5162071A
公开(公告)日：1992-11-10
申请号：US532417
申请日：1990-06-04
IPC分类号： B32B43/00 , B26D1/38 , B26D5/04 , B29C65/20 , B29C65/78 , B29L9/00 , B32B37/22 , B32B38/00 , H05K3/00 , H05K3/06
CPC分类号： B32B37/226 , B26D1/385 , B26D5/04 , B32B38/0004 , B32B38/185 , B32B2457/08 , H05K3/0079 , Y10T156/1322 , Y10T156/1339 , Y10T156/1343 , Y10T156/1734
摘要： A thin film laminating apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure laminating roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film laminating apparatus.
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2.发明授权Apparatus for bonding continuous thin film to discrete base plates and cutting thereof 失效用于连续连续薄膜剥离基板和切割的装置
公开(公告)号：US5110400A
公开(公告)日：1992-05-05
申请号：US500984
申请日：1990-03-29
CPC分类号： B32B37/226 , B26D1/385 , B32B38/0004 , B32B38/185 , B32B2457/08 , H05K3/0079 , Y10T156/1339 , Y10T156/1343 , Y10T156/1734 , Y10T83/4711
摘要： A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.
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3.发明授权
公开(公告)号：US5289750A
公开(公告)日：1994-03-01
申请号：US972091
申请日：1992-11-05
CPC分类号： B32B37/226 , B26D1/385 , B32B38/0004 , B32B38/185 , B32B2457/08 , H05K3/0079 , Y10T83/4443 , Y10T83/748 , Y10T83/8739 , Y10T83/874 , Y10T83/8748 , Y10T83/8817 , Y10T83/8818
摘要： An apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.
摘要翻译： 一种用于将从连续辊提供的薄膜沿着离散印刷表面基板的整个长度粘合到至少一个接合表面并有效地将膜切割成覆盖板的整个平面的适当长度的设备。 每个板被输送到胶片粘合位置，并且连续膜的前端被传送到通过抽吸保持的胶片粘合位置。 压接辊在板的表面上移动并自动进给胶片并将胶片粘合到纸板上，同时使胶片的一部分松动在纸的尾端上。 包括旋转刀片和横跨薄膜和板的移动方向设置的固定刀片的切割器安装在能够朝向和远离薄膜移动的滑动床上。 旋转刀片倾斜定向，以便当刀片相对于固定刀片旋转时允许切割胶片。 然后，压接辊完成膜的松散端部通过板的剩余部分的结合。 这种结构允许宽膜快速且正确地切割并结合到板上。
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4.发明授权
公开(公告)号：US5176784A
公开(公告)日：1993-01-05
申请号：US706666
申请日：1991-05-29
CPC分类号： B32B37/226 , B26D1/385 , B32B38/0004 , B32B38/185 , B32B2457/08 , H05K3/0079 , Y10T156/1062 , Y10T156/12 , Y10T156/1322 , Y10T156/133 , Y10T156/1339 , Y10T156/1343 , Y10T156/1734 , Y10T83/4711 , Y10T83/483 , Y10T83/4833 , Y10T83/4836 , Y10T83/4847
摘要： A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.
摘要翻译： 一种用于将从连续辊供应的薄膜沿着离散印刷表面基板的整个长度粘合到至少一个接合表面并有效地将膜切割成覆盖板的整个平面的适当长度的方法和装置。 每个板被输送到胶片粘合位置，并且连续膜的前端被传送到通过抽吸保持的胶片粘合位置。 压接辊在板的表面上移动并自动进给胶片并将胶片粘合到纸板上，同时使胶片的一部分松动在纸的尾端上。 包括旋转刀片和横跨薄膜和板的移动方向设置的固定刀片的切割器安装在能够朝向和远离薄膜移动的滑动床上。 旋转刀片倾斜定向，以便当刀片相对于固定刀片旋转时允许切割胶片。 然后，压接辊完成膜的松散端部通过板的剩余部分的结合。 这种结构允许宽膜快速且正确地切割并结合到板上。
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公开(公告)号：US5312505A
公开(公告)日：1994-05-17
申请号：US979430
申请日：1992-11-19
申请人： Shigeo Sumi , Fumio Hamamura , Mitsuhiro Seki , Ichio Fukuda
发明人： Shigeo Sumi , Fumio Hamamura , Mitsuhiro Seki , Ichio Fukuda
CPC分类号： H05K3/0079 , B29C63/0013 , G03F7/16 , Y10T156/1105 , Y10T156/1906
摘要： A film peeling apparatus is disclosed wherein a base plate stuck with the films is conveyed to a film peeling position, where a contact tightness of leading edges of the films to the base plate is reduced by a film contact tightness reducer while relative moving speed of the base plate and the reducer is decreased by slowing down the conveyance speed of the base plate or by moving the reducer in synchronism with the conveyance of the base plate without stopping the conveyance of the base plate.
摘要翻译： 公开了一种薄膜剥离装置，其中粘贴有薄膜的基板被输送到薄膜剥离位置，其中薄膜前端到底板的接触紧密度通过薄膜接触紧密度减小器减小，同时相对移动速度 通过减慢基板的输送速度或者通过与基板的输送同步地移动减速器，而不停止基板的输送，减小了基板和减速器。
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公开(公告)号：US5131972A
公开(公告)日：1992-07-21
申请号：US532418
申请日：1990-06-04
申请人： Mitsuhiro Seki , Shigeo Sumi , Fumio Hamamura
发明人： Mitsuhiro Seki , Shigeo Sumi , Fumio Hamamura
CPC分类号： B32B37/226 , B32B38/1825 , B32B2457/08 , H05K3/0079 , Y10T156/1322 , Y10T156/1339 , Y10T156/1343 , Y10T156/1734
摘要： A film guide device for film bonding in which a movable guide roller support and guides the film and swing roller arms prevent the slackening of the film while the film is being fed. Also, a driving action of a rotation-drive source, which controls the movement of the movable guide roller support arms, is synchronized with the braking of the film supply role and the movement of the leading edge of the film towards the bonding surface. This device prevents longitudinal wrinkles in the film, misplacement on the bonding surface, and excessive tension on the film.
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公开(公告)号：USD339147S
公开(公告)日：1993-09-07
申请号：US684397
申请日：1991-04-12
申请人： Shigeo Sumi , Fumio Hamamura , Mitsuhiro Seki
设计人： Shigeo Sumi , Fumio Hamamura , Mitsuhiro Seki
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公开(公告)号：US5083898A
公开(公告)日：1992-01-28
申请号：US437567
申请日：1989-11-17
申请人： Shigeo Sumi , Fumio Hamamura , Noriyasu Sawada
发明人： Shigeo Sumi , Fumio Hamamura , Noriyasu Sawada
CPC分类号： B65G47/914
摘要： A base plate conveyor for supplying a base plate storage section at one end of a base plate conveyance passage to the conveyance surface of the passage or receiving the base plate from the passage to the storage section. The conveyor is characterized by including the base plate storage section in which a plurality of base plates can be piled so that the base plates are leant against the inside of the section and the conveyed surface of the base plates have a predetermined angle to the conveyance surface of the conveyance passage; and a base plate mover provided at the casing of the conveyor so as to automatically move the base plate from the storage section to the conveyance passage or from the conveyance passage to the storage section. The base plate mover includes a vertically swung arm member, which is swung vertically and translated so as to move the base plate between the base plate storage section and the base plate conveyance passage. The arm member is provided with a suction so as to suck the conveyed surface of the base plate by vacuum action. The base storage section is mounted on a carrying stand which is independently movable and is removably attached to the base plate conveyor.
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公开(公告)号：US4867836A
公开(公告)日：1989-09-19
申请号：US905411
申请日：1986-08-29
申请人： Fumio Hamamura , Shigeo Sumi
发明人： Fumio Hamamura , Shigeo Sumi
CPC分类号： B29C63/0013 , G03F7/161 , Y10S156/934 , Y10T156/19 , Y10T156/1922 , Y10T156/1928
摘要： A film peeling apparatus for peeling a film from a substrate comprises film raising means for raising a part of the film from the substrate, and fluid jetting means for jetting fluid into between the film thus raised and the substrate, the film raising means including a brush or an adhesive member, so that the film the part of which has been raised from the substrate can be readily, positively and instantaneously peeled from the substrate by jetting the fluid.
摘要翻译： 用于从基板剥离薄膜的薄膜剥离装置包括用于从基板上升一部分薄膜的薄膜提升装置，以及用于将流体喷射到如此凸起的薄膜和基板之间的流体喷射装置，薄膜升高装置包括刷 或粘合构件，使得其一部分已经从基板升起的膜可以通过喷射流体而容易地从基板上快速地剥离。
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10.发明授权
公开(公告)号：US5125999A
公开(公告)日：1992-06-30
申请号：US514056
申请日：1990-04-24
申请人： Shigeo Sumi , Fumio Hamamura
发明人： Shigeo Sumi , Fumio Hamamura
IPC分类号： B32B43/00 , B29C63/02 , B29C65/20 , B29C65/78 , B29L9/00 , B29L31/34 , B32B37/16 , B32B37/22 , G03F7/16 , H05K3/00 , H05K3/06
CPC分类号： B32B37/226 , B32B37/0038 , G03F7/161 , B29L2031/3425 , H05K3/0079 , Y10T156/1111 , Y10T156/1928
摘要： A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.
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