摘要:
Cleaning compositions composed of specific amounts of carbonic acid and/or carbonate, hydrogen peroxide, aluminum fluoride and water are highly effective for cleaning electronic devices of resist, resist residues, titanium dioxide, aluminum oxide and silicon dioxide. The compositions contain no hydroxylamine and are thus free of its hazards.
摘要:
This etching composition for etching hafnium compound, includes a fluoride compound and a chloride compound. This method for etching a substrate, includes etching a film which contains hafnium compound and is formed on a substrate by using an etching composition, wherein the etching composition contains a fluoride compound and a chloride compound.
摘要:
Cleaning compositions composed of specific amounts of carbonic acid and/or carbonate, hydrogen peroxide, aluminum fluoride and water are highly effective for cleaning electronic devices of resist, resist residues, titanium dioxide, aluminum oxide and silicon dioxide. The compositions contain no hydroxylamine and are thus free of its hazards.
摘要:
A cleaning composition for a semiconductor device-manufacturing apparatus comprising, based on the weight of the composition, 0.1-10% by weight of at least one fluorine compound selected from sodium fluoride, potassium fluoride, lithium fluoride and ammonium fluoride; 1-50% by weight of at least one phosphoric ingredient selected from phosphoric acid and a phosphoric acid salt; 0.5-35% by weight of hydrogen peroxide; 0-5% by weight of hydrofluoric acid, and the remainder of water, wherein the ratio (H2O2/F) by weight of hydrogen peroxide to fluorine in the total of the fluorine compound and the hydrofluoric acid is at least 4. The cleaning composition is used for cleaning semiconductor device-manufacturing apparatus having deposited thereon at least one deposited metal ingredient selected from metallic titanium, titanium oxide, titanium nitride, metallic copper, copper oxide, metallic tantalum, tantalum oxide and tantalum nitride to remove these deposited metal ingredients.
摘要翻译:一种半导体装置制造装置用清洗组合物,其特征在于,以组合物的重量为基准,含有0.1-10重量%的选自氟化钠,氟化钾,氟化锂和氟化铵的至少一种氟化合物; 1-50重量%的选自磷酸和磷酸盐的至少一种磷成分; 0.5-35重量%的过氧化氢; 0-5重量%的氢氟酸,剩余的水,其中过氧化氢与氟的重量比(H 2 N 2 O 2 / F)为 氟化合物和氢氟酸的总和至少为4.清洁组合物用于清洁其上沉积有至少一种选自金属钛,氧化钛,氮化钛,金属铜,铜的沉积金属成分的半导体器件制造装置 氧化物,金属钽,氧化钽和氮化钽,以除去这些沉积的金属成分。
摘要:
An optical device includes a ridge-like optical waveguide portion, a mesa protector portion that is arranged in parallel to the optical waveguide portion, a resin portion that covers upper parts of the mesa protector portion and is disposed at both sides of the mesa protector portion, an electrode that is disposed on the optical waveguide portion, an electrode pad that is disposed on the resin portion located at an opposite side to the optical waveguide portion with respect to the mesa protector portion, and a connection portion that is disposed on the resin portion and electrically connects the electrode to the electrode pad.
摘要:
In an apparatus for manufacturing a dye-sensitized solar cell, a photosensitization dye solution makes contact with an electrode material layer that functions as a working electrode of a dye-sensitized solar cell so that the photosensitizing dye is adsorbed on the layer. Such an apparatus for manufacturing a dye-sensitized solar cell has a substrate housing section to house a substrate with the electrode material layer formed on its surface, and a circulation mechanism to circulate the photosensitization dye solution in such a way that the solution passes a surface of the substrate housed in the substrate housing section. In such an apparatus, a cross-sectional area of a flow path for the photosensitization dye solution in a portion facing the substrate in the substrate housing section is set smaller than a cross-sectional area of a flow path for the photosensitization dye solution in other portions.
摘要:
A guide device 3 for smoothing into a shape of a flat plate a parison P having a semi-circular shape in a planar cross-section, the parison being extruded from an extrusion device 1 and divided into two by a cutter 2, wherein the guide device includes a spiral guide element 4 that is in contact with the parison P while rotating about an axis, the spiral guide element being formed so as to rotate in opposite directions with each other on the left and right of a middle part 4C as a boundary so as to expand the parison P to the left and right. The spiral guide element 4 is formed in a protruding shape on an outer periphery of a shaft 5 rotated by the driving of a drive motor M.