-
公开(公告)号：US4768070A
公开(公告)日：1988-08-30
申请号：US15716
申请日：1987-02-17
CPC分类号： H01S5/02252 , H01L2224/48091 , H01L2224/48465 , H01L2224/78301 , H01L2224/85181 , H01S5/02212 , H01S5/0683
摘要： An optoelectronics device wherein a light-receiving element which defines a monitor light receiver and a semiconductor laser which generates a laser beam are hermetically sealed in the same package, and wherein the light-receiving surface of the element for measuring the output power of the beam of light emitted from the semiconductor laser is disposed so as to be inclined with respect to the light-emitting surface of the semiconductor laser. The wire bonding surface of the light-receiving element pellet-bonded to a stem and the wire bonding surface of the lead electrically connected to the light-receiving element through a wire are arranged so as to be parallel with each other. Thus, it is possible to support both the bonding surfaces horizontally at the same time. As a result, a bonding tool can be brought into perpendicular contact with each of the bonding surfaces, and this enables appropriate wire bonding to be effected.
摘要翻译： 一种光电子器件，其中限定监测光接收器的光接收元件和产生激光束的半导体激光器被密封在相同的封装中，并且其中用于测量光束的输出功率的元件的光接收表面 从半导体激光器发射的光被设置成相对于半导体激光器的发光表面倾斜。 散射接合到杆的受光元件的引线接合表面和通过导线电连接到光接收元件的引线的引线接合表面被布置成彼此平行。 因此，可以同时水平地支撑接合面。 结果，可以使接合工具与每个接合表面垂直接触，这使得能够实现适当的引线接合。
-
2.发明授权Non-electrolytic gold plating liquid and non-electrolytic gold plating method using same 有权非电解镀金液和非电解镀金方法使用相同公开(公告)号：US06287371B1
公开(公告)日：2001-09-11
申请号：US09433568
申请日：1999-11-04
申请人： Yasuo Ota , Yasushi Takizawa , Haruki Enomoto
发明人： Yasuo Ota , Yasushi Takizawa , Haruki Enomoto
IPC分类号： C23C1831
CPC分类号： C23C18/42
摘要： The present invention provides an excellent non-electrolytic gold plating liquid which produces a gold plating layer firmly adhered to a surface selected from the group consisting of nickel, cobalt, palladium or a metal alloy containing nickel, cobalt or palladium, as well as a method for performing a non-electrolytic gold plating method using the non-electrolytic gold plating liquid. The non-electrolytic gold plating liquid comprises: (1) a water-soluble gold compound; (2) a complexation agent which stabilizes a gold ion in the plating liquid, but does not substantially dissolve nickel, cobalt or palladium; and (3) an anti-gold deposit agent which inhibits excess local etching or corrosion by substitution reaction between the metal surface and gold during the gold plating.
摘要翻译： 本发明提供了一种优异的非电解镀金液，其生产牢固地附着在选自镍，钴，钯或含有镍，钴或钯的金属合金的表面上的镀金层，以及一种方法 用于使用非电解镀金液进行非电解镀金方法。 非电解镀金液包括：（1）水溶性金化合物;（2）使电镀液中的金离子稳定但不能充分溶解镍，钴或钯的络合剂; 和（3）抗金沉积剂，其在镀金期间通过金属表面和金之间的取代反应抑制过量的局部蚀刻或腐蚀。
-
公开(公告)号：US20070068823A1
公开(公告)日：2007-03-29
申请号：US11507265
申请日：2006-08-21
申请人： Yasushi Takizawa , Masaaki Imanari
发明人： Yasushi Takizawa , Masaaki Imanari
IPC分类号： C25D3/30
摘要： To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.
摘要翻译： 提供一种没有有害铅并具有优异的焊料润湿性的锡电镀溶液，以及使用这种锡电镀溶液在电子部件上沉积锡膜的方法。 锡电镀溶液包括有机酸，萘酚磺酸，以及根据需要的抗氧化剂和表面活性剂。
-
公开(公告)号：US06736886B2
公开(公告)日：2004-05-18
申请号：US10189130
申请日：2002-07-02
申请人： Kazuyuki Suda , Yasuo Ohta , Yasushi Takizawa
发明人： Kazuyuki Suda , Yasuo Ohta , Yasushi Takizawa
IPC分类号： C23C1854
摘要： Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.
摘要翻译： 提供使用这些浴的无电镀金浴和电镀方法。 化学镀金浴包括i）水溶性金化合物，ii）使电镀液中的金离子稳定但不会使镀镍液中的镍，钴或钯发生实质溶解的络合剂，和iii）聚乙烯亚胺化合物 。 当要镀覆的材料经受这样的镀金浴时，通过控制反应开始后立即的取代反应速率来降低被镀材料表面下的贱金属的腐蚀，并且在基体金属 并且沉积的金涂层增加。
-
公开(公告)号：US08142639B2
公开(公告)日：2012-03-27
申请号：US11894444
申请日：2007-08-21
CPC分类号： C25D3/62
摘要： A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
摘要翻译： 使用含有氰化金，钴盐和六亚甲基四胺的镀金溶液提供具有高沉积选择性的镀金溶液的硬金镀液和电镀方法。
-
公开(公告)号：US06383269B1
公开(公告)日：2002-05-07
申请号：US09490928
申请日：2000-01-25
IPC分类号： C23C1852
摘要： Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates.
摘要翻译： 公开了用于在含镍基底上形成金涂层的电解质组合物。 还公开了在含镍基底上镀金层的方法。
-
公开(公告)号：US20100038254A1
公开(公告)日：2010-02-18
申请号：US12587816
申请日：2009-10-14
申请人： Yasushi Takizawa , Masaaki Imanari
发明人： Yasushi Takizawa , Masaaki Imanari
摘要： To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.
摘要翻译： 提供一种没有有害铅并具有优异的焊料润湿性的锡电镀溶液，以及使用这种锡电镀溶液在电子部件上沉积锡膜的方法。 锡电镀溶液包括有机酸，萘酚磺酸，以及根据需要的抗氧化剂和表面活性剂。
-
8.发明授权公开(公告)号：US06991675B2
公开(公告)日：2006-01-31
申请号：US10362386
申请日：2001-08-21
申请人： Kazuyuki Suda , Yasushi Takizawa , Kazunori Hibi
发明人： Kazuyuki Suda , Yasushi Takizawa , Kazunori Hibi
CPC分类号： C23C18/48 , C23C18/42 , Y10T428/12889 , Y10T428/265
摘要： An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement gold plating solution contains a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting an even plated appearance and also having a thick gold coating film.
摘要翻译： 本发明的目的是提供一种无电位移镀金液，用于制备电镀液的添加剂以及通过电镀液处理得到的金属复合材料。 无电位置镀金液含有水溶性金化合物，络合剂和水溶性银化合物，以及任选的水溶性铊化合物，水溶性铅化合物，水溶性铜化合物或 水溶性镍化合物或其任何组合。 电镀溶液具有良好的稳定性，即使不仅在制备后立即，而且在制剂经过一段时间后，也可以用于制造具有均匀电镀外观的金属复合材料，并且还具有厚金 涂膜。
-
9.发明申请公开(公告)号：US20050031895A1
公开(公告)日：2005-02-10
申请号：US10362386
申请日：2001-08-21
申请人： Kazuyuki Suda , Yasushi Takizawa , Kazunori Hibi
发明人： Kazuyuki Suda , Yasushi Takizawa , Kazunori Hibi
CPC分类号： C23C18/48 , C23C18/42 , Y10T428/12889 , Y10T428/265
摘要： An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The present invention provides an electroless displacement gold plating solution containing a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting a even plated appearance and also having a thick gold coating film.
摘要翻译： 本发明的目的是提供一种无电位移镀金液，用于制备电镀液的添加剂以及通过电镀液处理得到的金属复合材料。 本发明提供一种含有水溶性金化合物，络合剂和水溶性银化合物以及任选的水溶性铊化合物，水溶性铅化合物，水溶性 铜化合物或水溶性镍化合物，或其任意组合。 电镀溶液具有良好的稳定性，即使不仅在制备后立即，而且在制剂经过一段时间后，也可以用于制造具有均匀镀层外观的金属复合材料，并且还具有厚金 涂膜。
-
公开(公告)号：US20090000953A1
公开(公告)日：2009-01-01
申请号：US11894444
申请日：2007-08-21
IPC分类号： C25D3/62
CPC分类号： C25D3/62
摘要： A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
摘要翻译： 使用含有氰化金，钴盐和六亚甲基四胺的镀金溶液提供具有高沉积选择性的镀金溶液的硬金镀液和电镀方法。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.023 秒)
