摘要:
In a method of manufacturing a TFT substrate in accordance with an exemplary aspect of the present invention, an intrinsic semiconductor film, an impurity semiconductor film, and a conductive film for source lines are formed in succession, and a resist having a thin-film portion and a thick-film portions is formed on the conductive film for source lines. Then, etching is performed by using the resist as a mask, and after that, a part of the conductive film for source lines is exposed by removing the thin-film portion of the resist. Next, the exposed conductive film for source lines is etched by using the thick-film portions of the resist a mask, so that the impurity semiconductor film is exposed. Then, by etching the exposed impurity semiconductor film, a back channel region of a TFT 108 is formed. Further, a dummy back channel region 18a, which is irrelevant to the operation of the finished product, is also formed in a portion other than the TFT 108 region.
摘要:
In a method of manufacturing a TFT substrate in accordance with an exemplary aspect of the present invention, an intrinsic semiconductor film, an impurity semiconductor film, and a conductive film for source lines are formed in succession, and a resist having a thin-film portion and a thick-film portions is formed on the conductive film for source lines. Then, etching is performed by using the resist as a mask, and after that, a part of the conductive film for source lines is exposed by removing the thin-film portion of the resist. Next, the exposed conductive film for source lines is etched by using the thick-film portions of the resist a mask, so that the impurity semiconductor film is exposed. Then, by etching the exposed impurity semiconductor film, a back channel region of a TFT 108 is formed. Further, a dummy back channel region 18a, which is irrelevant to the operation of the finished product, is also formed in a portion other than the TFT 108 region.
摘要:
In forming a thin film transistor using multi-tone exposure, a wiring width of a foundational wiring is 40 μm or less, and a ratio of a wiring width of a foundational wiring in a dense case to a space between adjacent wirings is 1.7, preferably 1.0 or less.
摘要:
In forming a thin film transistor using multi-tone exposure, a wiring width of a foundational wiring is 40 μm or less, and a ratio of a wiring width of a foundational wiring in a dense case to a space between adjacent wirings is 1.7, preferably 1.0 or less.
摘要:
A semi-transparent TFT array substrate has a TFT including a source electrode, a gate electrode, and a drain electrode. The substrate also has an auxiliary capacitive wiring and a reflective pixel electrode. Further, the substrate has a transparent pixel electrode including an electrode extending from a corner of the rest of the transparent pixel electrode to an edge of the auxiliary capacitive wiring closest to a gate wiring connected to the gate electrode. In addition, the substrate has a source wiring connected to the source electrode. The auxiliary capacitive wiring overlaps a space existing between the reflective pixel electrode and the source wiring. The electrode is disposed between the reflective pixel electrode and the source wiring. A connection which connects the electrode and the rest of the transparent pixel electrode does not overlap the auxiliary capacitive wiring in a plan view. The connection does not overlap the gate wiring.
摘要:
A thin film transistor array substrate including an insulating substrate, a first metallic pattern formed on the insulating substrate, and an insulating film provided on the first metallic pattern. A semiconductor pattern is provided on the insulating film, and a second metallic pattern is provided on the semiconductor pattern. The second metallic pattern is surrounded by the semiconductor pattern.
摘要:
A transflective liquid crystal display device in which a transmissive area to transmit light to a pixel area and a reflective area as well as a thin film transistor are arranged on an insulating substrate, includes an TFT array substrate having plural gate wirings each provided with a gate electrode and a storage capacitive wiring provided with a storage capacitive electrode made of a first conductive film, plural source wirings each provided with a source electrode and a drain electrode made of a second conductive film, a reflecting pixel electrode extending from the drain electrode, and a transmissive pixel electrode formed through a second insulating film, and an opposite substrate arranged oppositely to the TFT array substrate. The source wirings and the reflecting pixel electrode are arranged apart from each other by a predetermined interval, and a contrast preventing electrode is formed over the interval on the second insulating film.
摘要:
An Si thin film (2) for a channel is formed on an insulating substrate (1), and then a gate insulating film (3) made principally of SiO.sub.2 is formed thereon. On the gate insulating film (3) is formed a gate electrode (4) composed of a Si thin film doped with impurities. The gate electrode (4) is patterned by isotropic etching using a photoresist (11) as a mask, and the gate insulating film (3) is patterned by anisotropic etching using the photoresist (11) as a mask into a configuration wider than the gate electrode (4) to be removed from source/drain regions position. The Si thin film (2) is ion implanted with impurities to form source/drain regions of an offset structure. A thin film transistor having an offset or LDD structure and capable of reducing an off-state drain current is fabricated without the need for increased number of masks and for an accurate photolithography technique, such as in alignment accuracy between masks.
摘要:
An array substrate is provided with thereon a display area in which plural pixels are arranged in a matrix shape. Output-side mounting terminals for a source driving circuit chip, which is COG-mounted on a frame area on the outside of the display area, have a plural-row zigzag arrangement. Inspection terminals individually provided in correspondence to the output-side mounting terminals have a zigzag arrangement opposite to the zigzag arrangement of the output-side mounting terminals in a terminal-row direction. Additionally, the output-side mounting terminals and the inspection terminals are disposed below the source driving circuit chip.
摘要:
A method of producing a thin film transistor array substrate which includes an insulating substrate, a display pixel having a pixel electrode connected to a drain electrode, a gate wiring, and a source wiring perpendicular to the gate wiring, comprising forming a first thin metal multi-layer film an upper layer of which includes aluminum, and spreading a photo-resist, forming the photo-resist to a thickness less in an area connected to a second thin metal film than other area, patterning the first thin metal film, reducing a thickness of the photo-resist layer and removing the photo-resist in the area, removing the upper layer in the area to expose a lower layer, forming an interlayer insulating film and patterning it to expose the lower layer in the area, and patterning the second thin metal film to include the area, to connect the lower layer to the second thin metal film.