公开(公告)号：US20130023186A1

公开(公告)日：2013-01-24

申请号：US13548361

申请日：2012-07-13

申请人： Yasuyuki MOTOSHIMA ,  Toru Maruyama ,  Hisanori Matsuo

发明人： Yasuyuki MOTOSHIMA ,  Toru Maruyama ,  Hisanori Matsuo

IPC分类号： B24B49/14 ,  B24B7/00 ,  B24B1/00 ,  B24B37/015

CPC分类号： B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

摘要： A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

公开(公告)号：US20110159782A1

公开(公告)日：2011-06-30

申请号：US12974123

申请日：2010-12-21

申请人： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

发明人： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

IPC分类号： B24B51/00

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

摘要： An apparatus for polishing a substrate is provided. The apparatus includes: a rotatable polishing table supporting a polishing pad; a substrate holder configured to hold a substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate; a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad; a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface; and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

摘要翻译： 提供了一种用于抛光衬底的设备。 该装置包括：支撑抛光垫的可旋转抛光台; 衬底保持器，其构造成保持衬底并将衬底压靠在旋转的抛光台上的抛光垫的抛光表面上以抛光衬底; 焊盘温度检测器，被配置为测量抛光垫的抛光表面的温度; 衬垫温度调节器，被配置为接触抛光表面以调节抛光表面的温度; 以及温度控制器，其被配置为通过基于由所述焊盘温度检测器检测到的关于所述抛光表面的温度的信息来控制所述焊盘温度调节器来控制所述抛光表面的温度。