公开(公告)号：US20130023186A1

公开(公告)日：2013-01-24

申请号：US13548361

申请日：2012-07-13

申请人： Yasuyuki MOTOSHIMA ,  Toru Maruyama ,  Hisanori Matsuo

发明人： Yasuyuki MOTOSHIMA ,  Toru Maruyama ,  Hisanori Matsuo

IPC分类号： B24B49/14 ,  B24B7/00 ,  B24B1/00 ,  B24B37/015

CPC分类号： B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

摘要： A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

公开(公告)号：US09579768B2

公开(公告)日：2017-02-28

申请号：US13548361

申请日：2012-07-13

申请人： Yasuyuki Motoshima ,  Toru Maruyama ,  Hisanori Matsuo

发明人： Yasuyuki Motoshima ,  Toru Maruyama ,  Hisanori Matsuo

IPC分类号： B24B49/14 ,  B24B37/015 ,  B24B55/02 ,  B24B37/34 ,  B24B53/017

CPC分类号： B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

摘要： A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

摘要翻译： 抛光装置通过将基板压靠在研磨台上的抛光垫上来抛光基板的表面。 抛光装置被配置为通过在抛光期间在抛光垫上吹入气体来控制抛光垫的抛光表面的温度。 抛光装置包括：衬垫温度控制机构，其具有至少一个气体喷射喷嘴，用于向抛光垫喷射气体，并且构造成将气体吹送到抛光垫上以控制抛光垫的温度;以及雾化器，其具有至少一个 用于喷射气体和液体的液体或混合流体的喷嘴，用于将液体或混合流体吹送到抛光垫上以去除抛光垫上的异物。 焊盘温度控制机构和雾化器形成为一体的单元。

公开(公告)号：US08241426B2

公开(公告)日：2012-08-14

申请号：US11795697

申请日：2005-12-21

申请人： Syozo Takada ,  Hisanori Matsuo ,  Akira Ishikawa

发明人： Syozo Takada ,  Hisanori Matsuo ,  Akira Ishikawa

IPC分类号： B08B3/12 ,  B08B6/00 ,  B08B7/00 ,  B08B7/02

CPC分类号： H01L21/02074 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  H01L21/76826 ,  H01L21/76828

摘要： When the remaining slurry and polishing residue are removed by cleaning with a cleaning liquid (preferably a cleaning liquid containing a surfactant), organic matter in the cleaning liquid containing a surfactant seeps into the interlayer insulating film 3. Therefore, the substrate is subsequently washed with an organic solvent or a solution containing an organic solvent, thus washing away the organic matter that has seeped into the interlayer insulating film 3. Although the interlayer insulating film 3 is subjected to a hydrophobic treatment, since the solvent used is an organic solvent, this solvent is able to seep into the interlayer insulating film 3, dissolve the organic matter, and wash the organic matter away without being affected by this hydrophobic treatment. Afterward, the substrate 1 is dried, and the organic solvent or solution containing an organic solvent that is adhering to the surface is removed.

摘要翻译： 当通过用清洗液（优选含有表面活性剂的清洗液）清洗剩余的浆料和抛光残渣时，含有表面活性剂的清洗液中的有机物渗入层间绝缘膜3.因此，随后用 有机溶剂或含有有机溶剂的溶液，从而洗去已经渗透到层间绝缘膜3中的有机物质。尽管对层间绝缘膜3进行疏水处理，但由于使用的溶剂是有机溶剂，因此 溶剂能够渗透到层间绝缘膜3中，溶解有机物质，并且在不受这种疏水处理的影响的情况下洗涤有机物质。 之后，干燥基板1，除去附着在表面上的有机溶剂的有机溶剂或溶液。

公开(公告)号：US20090047785A1

公开(公告)日：2009-02-19

申请号：US11795697

申请日：2005-12-21

申请人： Syozo Takada ,  Hisanori Matsuo ,  Akira Ishikawa

发明人： Syozo Takada ,  Hisanori Matsuo ,  Akira Ishikawa

IPC分类号： H01L21/306 ,  B24B7/00

CPC分类号： H01L21/02074 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  H01L21/76826 ,  H01L21/76828

摘要： When the remaining slurry and polishing residue are removed by cleaning with a cleaning liquid (preferably a cleaning liquid containing a surfactant), organic matter in the cleaning liquid containing a surfactant seeps into the interlayer insulating film 3. Therefore, the substrate is subsequently washed with an organic solvent or a solution containing an organic solvent, thus washing away the organic matter that has seeped into the interlayer insulating film 3. Although the interlayer insulating film 3 is subjected to a hydrophobic treatment, since the solvent used is an organic solvent, this solvent is able to seep into the interlayer insulating film 3, dissolve the organic matter, and wash the organic matter away without being affected by this hydrophobic treatment. Afterward, the substrate 1 is dried, and the organic solvent or solution containing an organic solvent that is adhering to the surface is removed.

摘要翻译： 当通过用清洗液（优选含有表面活性剂的清洗液）清洗剩余的浆料和抛光残渣时，含有表面活性剂的清洗液中的有机物渗入层间绝缘膜3.因此，随后用 有机溶剂或含有有机溶剂的溶液，从而洗去已经渗透到层间绝缘膜3中的有机物质。尽管对层间绝缘膜3进行疏水处理，但由于使用的溶剂是有机溶剂，因此 溶剂能够渗透到层间绝缘膜3中，溶解有机物质，并且在不受这种疏水处理的影响的情况下洗涤有机物质。 之后，干燥基板1，除去附着在表面上的有机溶剂的有机溶剂或溶液。

公开(公告)号：US06939208B2

公开(公告)日：2005-09-06

申请号：US09787121

申请日：2001-01-22

申请人： Kenji Kamimura ,  Norio Kimura ,  Satoshi Okamura ,  Hideo Aizawa ,  Makoto Akagi ,  Katsuhiko Tokushige ,  Hisanori Matsuo ,  Manabu Tsujimura

发明人： Kenji Kamimura ,  Norio Kimura ,  Satoshi Okamura ,  Hideo Aizawa ,  Makoto Akagi ,  Katsuhiko Tokushige ,  Hisanori Matsuo ,  Manabu Tsujimura

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306

CPC分类号： B24B53/017 ,  B24B29/005 ,  B24B53/003 ,  H01L21/30625

摘要： The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

摘要翻译： 本发明涉及一种用于将诸如半导体晶片的工件抛光成平面镜面抛光的抛光装置。 抛光装置包括具有抛光表面的抛光台和顶环，并且将工件插入在抛光台和顶环之间，并以预定压力按压以抛光工件。 抛光装置包括至少两个修整单元，用于通过与作为抛光布表面的抛光表面接触来修整抛光表面。

公开(公告)号：US06520845B2

公开(公告)日：2003-02-18

申请号：US09813323

申请日：2001-03-21

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

摘要翻译： 抛光装置包括抛光构件，其具有宽的稳定的抛光范围以进行有效的抛光，即使旋转轴线远离工件的边缘移动。 抛光构件保持器保持抛光构件，并且工件保持器保持待抛光的工件。 驱动装置在抛光构件和工件之间产生相对滑动运动。 抛光构件保持器或工件保持器中的至少一个保持器可围绕旋转轴线旋转并且可相对于其他保持器倾斜。 这种一个保持器设置有按压机构，以通过在远离旋转轴线的位置向一个保持器施加调节压力来稳定一个保持器的取向或期望姿势。

公开(公告)号：US06220945B1

公开(公告)日：2001-04-24

申请号：US09296567

申请日：1999-04-22

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

公开(公告)号：US20120276816A1

公开(公告)日：2012-11-01

申请号：US13454146

申请日：2012-04-24

申请人： Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

发明人： Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

IPC分类号： B24B1/00 ,  B24B37/005

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/105 ,  B24B57/02

摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.

摘要翻译： 提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。 抛光方法包括预先确定抛光液的供给流量与抛光衬底时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系 抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板 抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。

公开(公告)号：US06672945B1

公开(公告)日：2004-01-06

申请号：US09641347

申请日：2000-08-18

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B53/001 ,  B24B53/12 ,  B24B55/02

摘要： A abstract polishing apparatus has a substrate carrier a substrate and an abrasive member having a polishing surface. The surface is slidingly engaged with the substrate in order to effect polishing. The dressing device includes a light source when generating light rays for irradiating the polishing surface of the abrasive member, whereby dressing the polishing surface. A temperature control system control the temperature of the polishing surface of the abrasive member by sensing the temperature of the polishing surface with the temperature sensor. Mechanical dressing of the polishing surface, in addition to dressing by radiation of the polishing surface, may also be employed in order to flatten the entire polishing surface. The abrasive member preferably includes an abrasive particles, a binder and a photophilic for promoting the dressing of the polishing surface by light rays.

摘要翻译： 抽象抛光装置具有基板载体，基底和具有抛光表面的磨料构件。 该表面与衬底滑动接合以便进行抛光。 修整装置在产生用于照射研磨部件的研磨面的光线时包括光源，由此修整研磨面。 温度控制系统通过用温度传感器感测研磨表面的温度来控制研磨部件的抛光表面的温度。 抛光表面的机械修整除了通过抛光表面的辐射进行修整之外，还可以采用平整整个抛光表面。 磨料构件优选地包括研磨颗粒，粘合剂和亲水性用于通过光线促进抛光表面的修整。

公开(公告)号：US06390901B1

公开(公告)日：2002-05-21

申请号：US09397916

申请日：1999-09-17

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

IPC分类号： B24B2900

CPC分类号： B24B37/11 ,  B24D9/085

摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.

摘要翻译： 本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。 抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面 工件平整，镜面光洁。 夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。